• Journal of the Korea Institute of Military Science and Technology
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• v.18 no.3
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• pp.293-299
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• 2015

We analyzed the damage effect on Glass Fibre Reinforced Plastics(GFRP) under air flow by irradiation of continuous wave near-IR laser. Damage process and temporal temperature distribution were demonstrated and material characteristics were observed with laser intensity, surface flow speed and angle. Surface temperature on GFRP rapidly increased with laser intensity, and the damaged pattern was different with flow characteristics. In case of no flow, penetration on GFRP by burning and flame generation after laser irradiation was appeared at once. GFRP was penetrated by the heat generated from resin ignition. In case of laser irradiation under flow, a flame generated after burning extinguished at once by flow and penetration pattern on GFRP were differently shown with flow angle. From the results, we presented the damage process and its mechanism.

• Journal of Korean Society for Atmospheric Environment
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• v.24 no.2
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• pp.259-270
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• 2008

The regional air movement in a coastal area is generated by the different heat capacities of sea and land sides, which is called sea/land breeze. In the west coast area, the local air quality is significantly influenced by this sea/land breeze. In this study, the mathematical model is proposed to estimate the effective area of sea/land breeze. A commercial air model, that is suggested as an alternative air model by USEPA, is introduced to simulate the mechanism of sea/land breeze generation. From this study, it is confirmed that the numerical approach proposed in this study is reliable to predict the effective area of sea breeze in a coastal area. It implies that the current application of common air model needs to be carefully reviewed especially when dealing with a coastal air quality issue. It is also found that the sea breeze in Incheon area has the impact in the range of approximately 24 km in-land side, so-called penetration length.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.4
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• pp.402-416
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• 1999

The thermal distributions near the growth interface of 150nm CZ crystals were measured by three thermocouples installed at the center, middle (half radius) and edge (10nm from surface) of the crystals. The results show that larger growth rates produced smaller thermal gradients. This contradicts the widely used heat flux balance equation. Using this fact, it is confirmed in CZ crystals that the type of point defects created is determined by the value of the thermal gradient(G) near the interface during growth, as already reported for FZ crystals. Although depending on the growth systems the effective length of the thermal gradient for defect generation are varied, we defined the effective length as 10n,\m from th interface in this experiment. If the G is roughly smaller than 20C/cm, vacancy rich CZ crystals are produced. If G is larger than 25C/cm, the species of point defects changes dramatically from vacancies to interstitials. The experimental results after detaching FZ and CZ crystals from the melt show that growth interfaces are filled with vacancies. We propose that large G produces shrunk lattice spacing and in order to relax such lattice excess interstitials are necessary. Such interstitials recombine with vacancies which were generated at the growth interface, nest occupy interstitial sites and residuals aggregate themselves to make stacking faults and dislocation loops during cooling. The shape of the growth interface is also determined by te distributions of G across the interface. That is, the small G and the large G in the center induce concave and convex interfaces to the melts, respectively.

• Transactions of the Korean hydrogen and new energy society
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• v.21 no.3
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• pp.241-247
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• 2010

An Energy Efficiency Resource Standards (EERS) is a simple, market-based mechanism to encourage more efficient generation, transmission, and use of electricity, natural gas and heat. An EERS consists of electric, gas and/or heating energy savings targets for utilities, often with flexibility to achieve the target through a market-based trading system. In this paper, we make persons acquainted with EERS programs of foreign countries in these days. And we analyze domestic energy demand side management (DSM) programs in order to introduce an EERS program into the country successfully. Energy efficiency potential calculated in 2007 is one of the important factors for establishing an EERS program domestically. This study may provide basic data to set the amount of energy saving when an EERS program would be phased in.

• Corrosion Science and Technology
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• v.18 no.1
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• pp.8-15
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• 2019

A high-temperature gas-cooled reactor (HTGR) is recognized as the best candidate reactor for next generation nuclear reactors. Helium is used to be the coolant in the core of the HTGR with temperature expected to exceed $900^{\circ}C$ at the core outlet. Several iron- and nickel-based superalloys, including Alloy 800H, Hastelloy X, and Alloy 617, are potential structural materials for intermediate heat exchanger (IHX) in an HTGR. Oxidation behaviors of three selected alloys (Hastelloy X, Alloy 800H, and Alloy 617) were investigated at four different temperatures from $650^{\circ}C$ to $950^{\circ}C$ under helium environments with various concentrations of $O_2$ and $H_2O$. Preliminary results showed that chromium oxide as the primary protective layer was observed on surfaces of the three tested alloys. Based on results of mass gain and SEM analyses, Hastelloy X alloy exhibited the best corrosion resistance in all corrosion tests. Further details on the oxidation mechanism of these alloys are presented in this study.

• Current Applied Physics
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• v.18 no.12
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• pp.1600-1604
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• 2018

This paper reports on a systematic and quantitative assessment of light induced degradation (LID) and regeneration in full Al-BSF and passivated emitter rear contact cells (PERC) along with the fundamental understanding of the difference between the two. After LID, PERC cells showed a much greater loss in cell efficiency than full Al-BSF cells (~0.9% vs ~0.6%) because the degradation in bulk lifetime also erodes the benefit of superior BSRV in PERC cells. Three main regeneration conditions involving the combination of heat and light ($75^{\circ}C/1\;Sun/48h$, $130^{\circ}C/2\;Suns/1.5h$ and $200^{\circ}C/3\;Suns/30s$) were implemented to eliminate LID loss due to BO defects. Low temperature/long time ($75^{\circ}C/48h$) and high temperature/short time ($200^{\circ}C/30s$) regeneration process was unable to reach 100% stabilization. The intermediate temperature/time ($130^{\circ}C/1.5h$) generation achieved nearly full recovery and stabilization (over 99%) for both full Al-BSF and PERC cells. We discussed the effect of temperature, time and suns in regeneration mechanism for two cells.

• Journal of Navigation and Port Research
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• v.30 no.1 s.107
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• pp.113-117
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• 2006

The object qf this experiment was the evaluation of the growth rate of frost layer conditioned by inlet air's velocity, temperature and relative humidity on the copper tube in evaporator. In this experiment, the inlet air's velocity were $0.3^m/_s,\;0.6^m/_s,\;0.9^m/_s,$ temperature were $15^{\circ}C,\;20^{\circ}C,\;25^{\circ}C$ and the variation of relative humidity was $70\%~90\%$. And the brine temperature flowing through the copper tubes was kept $-15{\circ}C$ because generally cooling temperature range is constantly $-15^{\circ}C$ in the heat exchanger for air conditioning system It was found that the amount of frost generation increased so that the relative humidity, velocity and temperature of supply air increased.

• Journal of the Korean Electrochemical Society
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• v.11 no.4
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• pp.273-283
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• 2008

GDL(Gas Diffusion Layer) is one of the main components of PEM fuel cell. It transports reactants from the channel to the catalyst and removes reaction products from the catalyst to the channels in the flow filed plate. It is known that higher permeability of GDL can make it possible to enhance the gas transport through GDL, leading to better performance. And MEA's temperature is determined by gas and heat transport. In this paper, three dimensional numerical simulation of PEM fuel cell of parallel channel and serpentine channel by the permeability of GDL is presented to analysis heat and mass transfer characteristics using a FLUENT modified to include the electrochemical behavior. Results show that in the case of parallel channel, performance variation with change of permeability of GDL was not so much. This is thought because mass transfer is carried out by diffusion mechanism in parallel channel. Also, in the case of serpentine channel, higher GDL permeability resulted in better performance of PEM fuel cell because of convection flow though GDL. And mass transfer process is changed from convection to diffusion when the permeability becomes low.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.