• 제목/요약/키워드: heat equivalent

검색결과 416건 처리시간 0.027초

핀-관 열교환기에서 개별 열의 열전달 효과 (Heat Transfer Performance of Individual Rows in Fin-Tube Heat Exchangers)

  • 정지환;장근선;이현우
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2003년도 유체기계 연구개발 발표회 논문집
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    • pp.238-244
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    • 2003
  • An experimental study was performed to examine the heat transfer performance of individual rows of fin-tube heat exchangers. The heat transfer performance was measured using air-enthalpy type calorimeter. The examined heat exchangers consists of $7{\Phi}$ tube and fin patterns of them are slit and louver types. Equivalent fin spacing are 18 FPI for all samples, and the number of tube rows were 2. In order to confirm that thermal boundary condition on fins of each row are the same, physically separated between two rows as well as connected heat exchangers were used. The frontal air velocity varied from 0.7 to 2.5 m/s. Heat transfer performance for each row are measured. It was observed that the heat transfer coefficient of the 2nd row were smaller than that of the 1st row at low Reynolds number while larger at high Reynolds number.

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2열 핀-관 열 교환기의 열별 전열성능 측정 (Heat Transfer Performance of Individual Rows in Fin-Tube Heat Exchangers)

  • 권영철;정지환;장근선;홍기수;진심원
    • 설비공학논문집
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    • 제16권3호
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    • pp.280-286
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    • 2004
  • An experimental study is peformed to examine the heat transfer performance of individual rows of fin-tube heat exchangers. The heat transfer performance is measured using an air-enthalpy type calorimeter. The examined heat exchangers consist of 7mm tube and fin patterns of them are slit and louver types. Equivalent fin spacings are 18 fins per inch(fpi) for all samples, and the number of tube rows are two. In order to confirm that thermal boundary condition on fins of each row are the same, physically separated between two rows as well as connected heat exchangers are used. The frontal air velocity is varied from 0.7 to 2.5㎧. Heat transfer performance for each row is measured. It is observed that the heat transfer coefficient of the second row is smaller than that of the first row at low Reynolds number while larger at high Reynolds number.

디스크 브레이크의 구조 및 열 해석 (Structural and Thermal Analysis of Disk Brake)

  • 조재웅;한문식
    • 한국생산제조학회지
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    • 제19권2호
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    • pp.211-215
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    • 2010
  • Continuous contraction and expansion of disk brake can be due to friction and temperature difference at repeated sudden braking. As serious vibration at disk is produced, the braking force will be changed ununiformly and braking system can not be stabilized. Temperature and heat flux at disk brake are investigated by structural and thermal analysis in this study. The maximum equivalent stress and displacement are shown respectively at the ventilated hole and the lower part of disk plate. At thermal analysis of initial state, temperature on disk plate is distributed from $95.9^{\circ}C$ to $100^{\circ}C$. The maximum heat flux of $0.0168W/mm^2$ is shown at the inner friction part between disk plate and pad. At thermal analysis of transient state, temperature on disk plate is distributed from $95^{\circ}C$ to $96.5^{\circ}C$ after 100 second. The maximum heat flux of $0.0024W/mm^2$ is also shown at the inner friction part between disk plate and pad. By comparing with initial state, the temperature on disk plate is more uniformly distributed and heat flux is more decreased by 7 times at transient state.

가전용 커패시터의 소손원인 규명 및 발열 메커니즘 해석 (Examination of the Cause of Damage to Capacitors for Home Appliances and Analysis of the Heat Generation Mechanism)

  • 박형기;최충석
    • 한국안전학회지
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    • 제26권6호
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    • pp.13-19
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    • 2011
  • The purpose of this study is to examine the cause of damage to electrolytic capacitors and to present the heat generation mechanism in order to prevent the occurrence of similar problems. From the analysis results of electrolytic capacitors collected from accident sites, the fire causing area can be limited to the primary power supply for the initial accident. From the tests performed by applying overvoltage, surge, etc., it is thought that the fuse, varistor, etc., are not directly related to the accidents that occurred. The analysis of the characteristics using a switching regulator showed that the charge and discharge characteristics fell short of standard values. In addition, it is thought that heated electrolytic capacitors caused thermal stress to nearby resistances, elements, etc. It can be seen that the heat generation is governed by the over-ripple current, application of AC overvoltage, surge input, internal temperature increase, defective airtightness, etc. Therefore, when designing an electrolytic capacitor, it is necessary to comprehensively consider the correct polarity arrangement, appropriate voltage application, correct connection of equivalent series resistance(ESR) and equivalent series inductance(SEL), rapid charge and discharge control, sufficient margin of dielectric tangent, etc.

Physicochemical and antioxidant properties of garlic (A. sativum) prepared by different heat treatment conditions

  • Kim, Il-Doo;Park, Yong-Sung;Park, Jae-Jeong;Dhungana, Sanjeev Kumar;Shin, Dong-Hyun
    • 한국식품과학회지
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    • 제51권5호
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    • pp.452-458
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    • 2019
  • The objective of this study was to investigate the physicochemical characteristics and antioxidant potential of garlic processed using different heat treatments conditions, which is an effective method for removing the unpleasant odor and taste of raw garlic. The pH and soluble solid content of raw garlic (pH 6.07, $7.7^{\circ}Bx$) were almost equal or slightly higher than that of processed garlic samples (pH 5.06-6.09, $7.1-7.4^{\circ}Bx$). The color of processed garlic was also significantly affected. The amounts of amino acids such as ${\gamma}$-amino-n-butyric acid and few essential amino acids also increased after the thermal treatment of garlic. The antioxidant potentials of red and black garlic were higher than that of raw garlic. The polyphenol content of processed garlic ($38.51-81.51{\mu}g$ gallic acid equivalent/g sample) was significantly higher than that of raw garlic ($30.66{\mu}g$ gallic acid equivalent/g sample). These results indicated that heat treatment for different durations under a controlled environment enhanced the nutritional and functional properties of garlic.

A study of guaranteeing reliability for IC of electronic instruments according temperature

  • Yoon, Geon;Park, Yong-Oon;Kwon, Soon-Chang
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.320-323
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    • 2005
  • This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

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E-mobility용 고밀도 전원장치의 PCB방열 특성해석에 관한 연구 (A study on PCB Heat Dissipation Characteristics of High Density Power Supply for E-mobility)

  • 김종해
    • 전기전자학회논문지
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    • 제25권3호
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    • pp.528-533
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    • 2021
  • 본 논문은 전기자동차용 고밀도 DC-DC 컨버터의 PCB 방열특성에 대해 나타낸다. 본 논문은 또한 고밀도 DC-DC 컨버터의 방열구조를 분석하고 열해석 시뮬레이션을 통해 고밀도 전원장치의 PCB 방열 설계를 최적화한다. 따라서 본 논문에서는 열전달 이론을 바탕으로 일반적인 전자기기의 방열 경로를 분석하고 열저항 등가 회로를 모델링한다. 또한 본 논문의 연구 대상인 500[W]급 동기식 벅 컨버터의 열저항 등가 회로를 모델링 하여 방열 성능 향상을 위한 구조적인 방열 경로를 제시한다. 입력전압 72[V], 출력전압 12[V]의 500[W]급 동기식 벅 컨버터에 다면 방열 구조를 적용하여 열해석 시뮬레이션결과와 시작품의 실험을 통해 제안 구조의 타당성을 검증한다.

4개 대칭배열 발열 전자소자에서의 확산 열저항 산정 (Evaluation of Spreading Thermal Resistance in Symmetrical Four-Heat Generating Electronic Components)

  • 김윤호;김서영;리광훈
    • 설비공학논문집
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    • 제18권8호
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    • pp.664-671
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    • 2006
  • We propose the correlation to predict the spreading thermal resistance on a plate with symmetrical four heat sources. The correlation transforms four heat sources to a single equivalent heat source and then the spreading thermal resistance can be obtained with the existing equation for a single heat source. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, the plate thermal conductivity and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.

원통다관식 열교환기의 압력 변화에 따른 설계 응력 연구 (Study upon Design Stress due to Pressure of Shell-and-Tube Type Heat Exchanger)

  • 이용범;한성건;고재명
    • 유공압시스템학회논문집
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    • 제5권2호
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    • pp.8-13
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    • 2008
  • Shell-and-tube type heat exchangers are generally classified with fixed tube-sheet and floating tube-sheet heat exchangers. In this paper, we employed the fixed tube-sheet heat exchangers. We theoretically investigated the safety evaluation of our shell-tube heat exchanger by axial, bending and equivalent stress of fin tubes, tube plates, channels and shell. Design pressure ranges were chosen pressure($0.6{\sim}2\;MPa$) on tube side and 200 %(3 MPa) of Maximum pressure on shell side for safety evaluation of heat exchangers. This research will be useful for fabrication of heat exchangers to prevent against damage hazard of heat exchangers in operation.

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