• Title/Summary/Keyword: heat equivalent

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Heat Transfer Performance of Individual Rows in Fin-Tube Heat Exchangers (핀-관 열교환기에서 개별 열의 열전달 효과)

  • Jeong, Ji-Hwan;Chang, Keun-Sun;Lee, Hyun-Woo
    • 유체기계공업학회:학술대회논문집
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    • 2003.12a
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    • pp.238-244
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    • 2003
  • An experimental study was performed to examine the heat transfer performance of individual rows of fin-tube heat exchangers. The heat transfer performance was measured using air-enthalpy type calorimeter. The examined heat exchangers consists of $7{\Phi}$ tube and fin patterns of them are slit and louver types. Equivalent fin spacing are 18 FPI for all samples, and the number of tube rows were 2. In order to confirm that thermal boundary condition on fins of each row are the same, physically separated between two rows as well as connected heat exchangers were used. The frontal air velocity varied from 0.7 to 2.5 m/s. Heat transfer performance for each row are measured. It was observed that the heat transfer coefficient of the 2nd row were smaller than that of the 1st row at low Reynolds number while larger at high Reynolds number.

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Heat Transfer Performance of Individual Rows in Fin-Tube Heat Exchangers (2열 핀-관 열 교환기의 열별 전열성능 측정)

  • 권영철;정지환;장근선;홍기수;진심원
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.16 no.3
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    • pp.280-286
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    • 2004
  • An experimental study is peformed to examine the heat transfer performance of individual rows of fin-tube heat exchangers. The heat transfer performance is measured using an air-enthalpy type calorimeter. The examined heat exchangers consist of 7mm tube and fin patterns of them are slit and louver types. Equivalent fin spacings are 18 fins per inch(fpi) for all samples, and the number of tube rows are two. In order to confirm that thermal boundary condition on fins of each row are the same, physically separated between two rows as well as connected heat exchangers are used. The frontal air velocity is varied from 0.7 to 2.5㎧. Heat transfer performance for each row is measured. It is observed that the heat transfer coefficient of the second row is smaller than that of the first row at low Reynolds number while larger at high Reynolds number.

Structural and Thermal Analysis of Disk Brake (디스크 브레이크의 구조 및 열 해석)

  • Cho, Jae-Uug;Han, Moon-Sik
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.2
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    • pp.211-215
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    • 2010
  • Continuous contraction and expansion of disk brake can be due to friction and temperature difference at repeated sudden braking. As serious vibration at disk is produced, the braking force will be changed ununiformly and braking system can not be stabilized. Temperature and heat flux at disk brake are investigated by structural and thermal analysis in this study. The maximum equivalent stress and displacement are shown respectively at the ventilated hole and the lower part of disk plate. At thermal analysis of initial state, temperature on disk plate is distributed from $95.9^{\circ}C$ to $100^{\circ}C$. The maximum heat flux of $0.0168W/mm^2$ is shown at the inner friction part between disk plate and pad. At thermal analysis of transient state, temperature on disk plate is distributed from $95^{\circ}C$ to $96.5^{\circ}C$ after 100 second. The maximum heat flux of $0.0024W/mm^2$ is also shown at the inner friction part between disk plate and pad. By comparing with initial state, the temperature on disk plate is more uniformly distributed and heat flux is more decreased by 7 times at transient state.

Examination of the Cause of Damage to Capacitors for Home Appliances and Analysis of the Heat Generation Mechanism (가전용 커패시터의 소손원인 규명 및 발열 메커니즘 해석)

  • Park, Hyung-Ki;Choi, Chung-Seog
    • Journal of the Korean Society of Safety
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    • v.26 no.6
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    • pp.13-19
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    • 2011
  • The purpose of this study is to examine the cause of damage to electrolytic capacitors and to present the heat generation mechanism in order to prevent the occurrence of similar problems. From the analysis results of electrolytic capacitors collected from accident sites, the fire causing area can be limited to the primary power supply for the initial accident. From the tests performed by applying overvoltage, surge, etc., it is thought that the fuse, varistor, etc., are not directly related to the accidents that occurred. The analysis of the characteristics using a switching regulator showed that the charge and discharge characteristics fell short of standard values. In addition, it is thought that heated electrolytic capacitors caused thermal stress to nearby resistances, elements, etc. It can be seen that the heat generation is governed by the over-ripple current, application of AC overvoltage, surge input, internal temperature increase, defective airtightness, etc. Therefore, when designing an electrolytic capacitor, it is necessary to comprehensively consider the correct polarity arrangement, appropriate voltage application, correct connection of equivalent series resistance(ESR) and equivalent series inductance(SEL), rapid charge and discharge control, sufficient margin of dielectric tangent, etc.

Physicochemical and antioxidant properties of garlic (A. sativum) prepared by different heat treatment conditions

  • Kim, Il-Doo;Park, Yong-Sung;Park, Jae-Jeong;Dhungana, Sanjeev Kumar;Shin, Dong-Hyun
    • Korean Journal of Food Science and Technology
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    • v.51 no.5
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    • pp.452-458
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    • 2019
  • The objective of this study was to investigate the physicochemical characteristics and antioxidant potential of garlic processed using different heat treatments conditions, which is an effective method for removing the unpleasant odor and taste of raw garlic. The pH and soluble solid content of raw garlic (pH 6.07, $7.7^{\circ}Bx$) were almost equal or slightly higher than that of processed garlic samples (pH 5.06-6.09, $7.1-7.4^{\circ}Bx$). The color of processed garlic was also significantly affected. The amounts of amino acids such as ${\gamma}$-amino-n-butyric acid and few essential amino acids also increased after the thermal treatment of garlic. The antioxidant potentials of red and black garlic were higher than that of raw garlic. The polyphenol content of processed garlic ($38.51-81.51{\mu}g$ gallic acid equivalent/g sample) was significantly higher than that of raw garlic ($30.66{\mu}g$ gallic acid equivalent/g sample). These results indicated that heat treatment for different durations under a controlled environment enhanced the nutritional and functional properties of garlic.

A study of guaranteeing reliability for IC of electronic instruments according temperature

  • Yoon, Geon;Park, Yong-Oon;Kwon, Soon-Chang
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.320-323
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    • 2005
  • This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

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A study on PCB Heat Dissipation Characteristics of High Density Power Supply for E-mobility (E-mobility용 고밀도 전원장치의 PCB방열 특성해석에 관한 연구)

  • Kim, Jong-Hae
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.528-533
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    • 2021
  • This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

Evaluation of Spreading Thermal Resistance in Symmetrical Four-Heat Generating Electronic Components (4개 대칭배열 발열 전자소자에서의 확산 열저항 산정)

  • Kim Yun-Ho;Kim Seo-Young;Rhee Gwang-Hoon
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.8
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    • pp.664-671
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    • 2006
  • We propose the correlation to predict the spreading thermal resistance on a plate with symmetrical four heat sources. The correlation transforms four heat sources to a single equivalent heat source and then the spreading thermal resistance can be obtained with the existing equation for a single heat source. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, the plate thermal conductivity and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.

Study upon Design Stress due to Pressure of Shell-and-Tube Type Heat Exchanger (원통다관식 열교환기의 압력 변화에 따른 설계 응력 연구)

  • Lee, Y.B.;Han, S.G.;Ko, J.M.
    • Transactions of The Korea Fluid Power Systems Society
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    • v.5 no.2
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    • pp.8-13
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    • 2008
  • Shell-and-tube type heat exchangers are generally classified with fixed tube-sheet and floating tube-sheet heat exchangers. In this paper, we employed the fixed tube-sheet heat exchangers. We theoretically investigated the safety evaluation of our shell-tube heat exchanger by axial, bending and equivalent stress of fin tubes, tube plates, channels and shell. Design pressure ranges were chosen pressure($0.6{\sim}2\;MPa$) on tube side and 200 %(3 MPa) of Maximum pressure on shell side for safety evaluation of heat exchangers. This research will be useful for fabrication of heat exchangers to prevent against damage hazard of heat exchangers in operation.

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