• Title/Summary/Keyword: harsh environment

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Conditions of kimchi to be safe from consuming viable Ascaris suum eggs (학술 2 - 김치에 함유된 돼지회충란의 사멸조건)

  • Shin, Sung-Shik
    • Journal of the korean veterinary medical association
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    • v.48 no.9
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    • pp.540-543
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    • 2012
  • Livestock excretes are frequently used in organic farming to produce vegetables and crops. However, zoonotic parasite eggs can be contaminated into such products and people can be infected with parasites of animal origin. Sporadic zoonotic infections with Ascaris suum have been reported even in developed countries, such as North America, Denmark, and the United Kingdom. Ascaris eggs are resistant to most adverse environmental conditions, and pigs and humans become infected by ingestion of fecally excreted eggs through contaminated food, water, or soil. This article discusses the resistant nature of ascarid eggs against harsh environment, and conditions of kimchi to be safe from consuming viable A. suum eggs.

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Cellular and Molecular Responses of a Filamentous Fungus Neurospora Crassa to Non-thermal Plasma at Atmospheric Pressure

  • Park, Gyung-Soon;Ryu, Young-Hyo;Hong, Young-June;Uhm, Han-Sup;Choi, Eun-H.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.476-476
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    • 2012
  • Although plasma is an efficient means of microbial sterilization, mechanism of plasma effect on microorganisms still needs to be clarified. In addition, a limited number of studies are available on eukaryotic microorganisms such as yeast and fungi in relation to plasma application. Thus, we investigated cellular and molecular aspects of plasma effects on a filamentous fungus, Neurospora crassa by making use of argon plasma jet at atmospheric pressure. The viability and cell morphology of N. crassa spores exposed to plasma were both significantly reduced depending on the exposure time when treated in water. The intracellular genomic DNA content was dramatically reduced in fungal tissues after a plasma treatment and the transcription factor tah-3 was found to be required for fungal tolerance to a harsh plasma environment.

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Experimental Study on Friction Characteristics of Metal Surface Treated by LST (레이저 표면처리 된 금속의 마찰특성에 관한 실험적 연구)

  • Park, Sung-Yong;Min, Joon-Won;Lee, Eun-Gil;Chu, In-Gil
    • Laser Solutions
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    • v.13 no.1
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    • pp.16-20
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    • 2010
  • The studies on the fine processing on the surface of the metal utilizing the technique for LST (Laser surface texturing) have been performed recently. This study has acquired the lower frictional coefficient and endurance in the harsh environment of motion in the low lubricating range of low frictional coefficient in addition to storing of lubricant through fine processing on the frictional part of metal.

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Bonding Mechanism and Strength of Metals to Ceramics (금속과 세라믹의 접합기구와 접합강도)

  • Kee, Se-Ho;Jung, Jae-Pil;Kim, Won-Joong
    • Journal of Welding and Joining
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    • v.32 no.1
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    • pp.40-46
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    • 2014
  • Bonding technology and bonding mechanism of metal to ceramic including brazing, diffusion bonding, friction welding and etc were reviewed in this study. Various factors should be considered from a bonding design step to acquire a good bonding joint because of a large difference between metal and ceramic in crystal lattice, coefficient of thermal expansion and various properties. In addition, metal and ceramic bonding technologies are constantly being developed according to precise components, multi-function and application to harsh environment. However, improvement of bonding properties and bonding reliability also should be accompanied. Bonding of ceramics, such as $ZrO_2$, $Ti_3AlC_2$ and SiC, to metals like Ti-alloy, TiAl and steel were described in this paper.

Chatter Monitoring of Milling Process using Spindle Displacement Signal (주축 변위 신호를 이용한 밀링가공의 채터 감시)

  • Chang, Hun-Keun;Kim, Il-Hae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.6
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    • pp.140-145
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    • 2007
  • To improve productivity of a metal cutting process, it is required to monitor machining stability in real time. Since cutting environment is harsh against sensing conditions due to vibration, chip, and cutting fluid, etc., it is necessary to develop a robust and reliable sensing system for the practical application. In this work, a chatter monitoring system was developed and its effectiveness was proved. Spindle displacement caused by cutting was selected as a main monitoring parameter. A cylindrical capacitive displacement sensor was adopted. Chatter frequencies were identified through modal analysis. To quantify chatter vibrations, chatter correlation coefficient was introduced. The identification of the monitoring system showed a good agreement with the result of experiment.

Fabrication of Micromachined Ceramic Thin-Film Pressure Sensors for High Overpressure Tolerance

  • Chung, Gwiy-Sang
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2002.11a
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    • pp.59-63
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    • 2002
  • This paper reports on the fabrication process and characteristics of a ceramic thin-film pressure sensor based on Ta-N strain-gauges for harsh environment applications. The Ta-N thin-film strain-gauges are sputter-deposited on a thermally oxidized micromachined Si diaphragms with buried cavities for overpressure tolerance. The proposed device takes advantage of the good mechanical properties of single-crystalline Si as a diaphragm fabricated by SDB and electrochemical etch-stop technology, and in order to extend the temperature range, it has relatively higher resistance, stability and gauge factor of Ta-N thin-films more than other gauges. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is 1.21 ~ 1.097 mV/V.kgf/$\textrm{cm}^2$ in temperature ranges of 25~ $200^{\circ}C$ and a maximum non-linearity is 0.43 %FS.

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A study on the logistics cost reduction in textile industries by introducing Pad Pool System (PPS(PAD POOL SYSTEM) 도입에 의한 섬유업계 물류비 절감에 관한 연구)

  • Kwon An Sik;Park In Sul
    • Journal of the Korea Safety Management & Science
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    • v.7 no.2
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    • pp.95-106
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    • 2005
  • Many Korean companies are challenged to reduce logistics cost and meet environmental-friendly logistics. The textile companies in harsh competition are requested to make improvement on their logistics environment to cut down the total cost. However, they have reached the limit on improving the manufacturing process. We believe that the logistics department is the most improvable part at present. Improving logistics will be highly effective to cut down the total cost. In this study, we present Pad Pool System(PPS) as the solution to save their logistics cost. PPS, which means the shared use of Styrofoam pads, will enable the textile companies to cut down their cost and strengthen enterprise competitiveness. Also, PPS will be helpful reducing environmental disruption because the system reuses retrieved Styrofoam pads many times.

Recursive PCA-based Remote Sensor Data Management System Applicable to Sensor Network

  • Kim, Sung-Ho;Youk, Yui-Su
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.8 no.2
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    • pp.126-131
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    • 2008
  • Wireless Sensor Network(WSNs) consists of small sensor nodes with sensing, computation, and wireless communication capabilities. It has new information collection scheme and monitoring solution for a variety of applications. Faults occurring to sensor nodes are common due to the limited resources and the harsh environment where the sensor nodes are deployed. In order to ensure the network quality of service it is necessary for the WSN to be able to detect the faulty sensors and take necessary actions for the reconstruction of the lost sensor data caused by fault as earlier as possible. In this paper, we propose an recursive PCA-based fault detection and lost data reconstruction algorithm for sensor networks. Also, the performance of proposed scheme was verified with simulation studies.

PN Chip Clock Generator for CDMA Code Synchronization

  • Oh, Hyun-Seo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.1 no.2
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    • pp.193-197
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    • 1997
  • In this paper, we propose a new PN chip clock generator which employs two synchronous counters to achieve precise phase control of chip clock. In a CDMA code acquisition and tracking system, the PN chip clock is required to operate highly reliable without any glitch even under harsh environment condition such as temperature and voltage fluctu-aliens. The digital implementation of the proposed PN chip clock generator imparts it with much desired reliability. Since the proposed chip clock generator can be easily controlled into one of the states: free running, phase advance, and delay state, it can be applied to data processing as well as code synchronization. We have done FPGA implementation of the proposed logic and have verified its satisfactory operation up to 50 MHz.

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Fabrication of a Micromachined Metal Thin-film Type Pressure Sensor for High Overpressure Tolerance and Its Characteristics (과부하 방지용 마이크로머시닝 금속 박막형 압력센서의 제작과 그 특성)

  • Kim, Jae-Min;Lim, Byoung-Kwon;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05a
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    • pp.192-196
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    • 2002
  • This paper describes on the fabrication and characteristics of a metal thin-film pressure sensor based on Cr strain-gauges for harsh environment applications. The Cr thin-film strain-gauges are sputter-deposited onto a micromachined Si diaphragms with buried cavity for overpressure protectors. The proposed device takes advantages of the good mechanical properties of single-crystalline Si as diaphragms fabricated by SDB and electrochemical etch-stop technology, and in order to extend the operating temperature range, it incorporates relatively the high resistance, stability and gauge factor of Cr thin-films. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is 1.097~1.21 $mV/V{\cdot}kgf/cm^2$ in the temperature range of $25{\sim}200^{\circ}C$ and the maximum non-linearity is 0.43 %FS.

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