• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 추계학술대회 논문집
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• pp.127-133
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• 2001

Photoelastic isochromatic fringes related to the difference of principal stresses have some bandwidth whose light intensities are not constant and unsymmetrical in experimental image. Hence it is difficult to measure fringe order accurately at a data point by visual observation. In this study, the method of fringe sharpening, which can extract sharpened lines from both full-and half-order fringes by digital image processing, is developed. To test the method, various simple photoelastic fringe patterns are simulated and their image are processed to yield sharpened lines. The method is than applied to general problem such as image of a circular disk compressed by concentrated loads and a cylinder subjected to internal pressure. The procedure is proved to be capable of extracting sharpened lines accurately from photoelastic isochromatic fringes.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.265-268
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• 2004

In this paper, we improved the reliability of a spiral spring in semi-auto sliding mechanism of mobile phones. In an semi-auto opening mechanism of mobile phone, the spring must have sufficient reliability such that the spring force does not reduce under a half of initial value after 100000 operations. Since the inner space of the mechanism is very small, it is difficult to design a spring having sufficient reliability. We designed a spiral spring satisfying such conditions and analyzed its elastic performances using finite element method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.826-829
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• 1995

The oil-pressure type torque sensor has been adopted in steering system of major automobiles. However, it has been well known that this type of torque sensor needed many subcomponents and produced inaccurate responses. This paper intends to suggest new type of torque sensor based on the shape design by using finite element. A dedicated mesh generation, analysis and post result display program has been developed. As for shape design purpose, the half shape of torque sensor is considered. The result of this study has shown that the design automation for precise torque sensor for control of high velocity rotation shaft can be achieved whithout any expensive investment to the design software.

• 한국정밀공학회지
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• 제16권7호
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• pp.158-167
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• 1999

Heat and moisture transfer associated with porous materials are investigated. The heat and moisture transfer in porous materials caused by the interaction of moisture gradient, temperature gradient, conduction, and evaporation are considered. The variations of temperature and moisture not only change the volume but also induce the hygro-thermal stress. The finite element formulation for solving the temperature and moisture transfer as well as the associated hygro-thermal stresses is developed. In order to verify the finite element formulation, the heat and moisture moving boundary problem in a half space and the hygro-thermo-mechanical problem in an infinite plate with a circular hole are analyzed. Temperature profile, moisture profile, and hygro-thermal stresses are compared with those of analytic solution and other investigator. Good agreements are examined

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.841-844
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• 1997

Sandwich structure is widely used in various fields of industry due to its excellent strength and stiffness compared with weight. We studied the buckling and bending behavior with respect to the variation of design parameters such as length, height, and thickness of honeycomb sandwich core. We found that as the density and the thickness of core become higher, the value of critical bucking load increased significantly. We found that the effect of bending stress due to critical buckling load resulted in high bending stress and the value of bending stress decreased in half according to the increase of length of core. The effect by bending stress is dominant above the portion of the intersection line between bending stress and the effect of buckling is dominant below the potion of it. We could get proper thickness ratio and density of core according to applied load conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1760-1763
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• 2003

In this paper, we propose a new weaving trajectory algorithm for the are welding of a articulated manipulator. The algorithm uses the theory of Bezier spline. We make a comparison between the conventional algorithms using Catmull-Rom curve and the new algorithms rising Bezier spline. The proposed algorithm has been evaluated based on the MATLAB environment in order to illustrate its good performance. The algorithm has been implemented on to the industrial manipulator of DR6 so as to show its real possibility. Through simulations and real implementations, the proposed algorithm can result in high-speed and flexible weaving trajectory planning and can reduce the processing time because it needs one-half calculation compared to the conventional algorithm using Catmull-Rom curve.

• 한국정밀공학회지
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• 제19권12호
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• pp.127-133
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• 2002

The objective of this study is to investigate fatigue life and fatigue crack propagation behavior The experiment of fatigue life for MMC have been carried out for the stress ratio R＝0.1 at 20Hz. Fatigue lift limit of AC4CH alloy is about 70 ㎫ and Fatigue limit of MMC has been increment to 120 ㎫, therefore, fatigue limits of MMC is about 71 % higher than that of AC4CH alloy Crack propagation tests on half-size CT specimen of thickness 12.5mm were conducted by using sinusoidal waveform. The crack length was monitored by compliance method. Test conditions were at 0.1 and 0.05 of load ratio at 10Hz of loading frequency and test load was 2.3kN. The effects of stress ratio on the fatigue crack propagation behavior for MMC was discussed within the Paris law. As the results of this study, Fatigue crack propagation increased with increasing the load ratio.

• 한국정밀공학회지
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• 제14권6호
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• pp.142-148
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• 1997

In this paper, forging of internal triangular and involute serrations are analyzed by upper bound method. Kinematically admissible velocity fields for half pitch of the serration were proposed. It was assumed that the shape flow surface during forging is a straight line perpendicular to plane of symmetry. Using the suggested velocity fields, forging loads and relative pressures were calculated by numerical method. Experiments were carride out with commercial AI 2024 aluminium alloy. As a result, the calculated solutions are good agreement with experimental results, so it is useful to predict the loads for forging of internal serrations.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.761-765
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• 1996

This paper describes the forging of circular tooth profiled gears as a series of development of simulator for non-axisymmetric parts that being used at the pump pulley, timing belt pulley etc. in automobiles. The half pitch of gear is divided into 6 deformation regious and kinematically admissible velocity fields for those regions are proposed. The neutral surface is introduced torepresent inner flow of material during forging operation with flat punch and, for each step, it is assumed as a circle. The upper bound solutions obtained from the suggested kinematically admissible velocity fields are in good agreement with experimental results and they are useful to predict the capacity of forging press for forging of circular gears.

• 한국정밀공학회지
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• 제22권2호
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• pp.46-52
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• 2005

The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.