• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• 한국정밀공학회지
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• 제12권4호
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• pp.100-110
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• 1995

This paper aims at reviewing the possibility of application over normal or abnormal, detection used by AE, and the characteristics of grinding processes. In this study, when WA-vitri-fied ' resinoid bond grinding wheels:36 kinds of grinding wheel and grinding depth were tuned at the surface grinding, the zone of AE signal generation is theoretically modelled and reviewed by grinding processes. The variation of grinding resistance( F$n^{9}$ $F_{t}$) and AE signal is detected in-process by the use of AE measuring system. The tests are carried out in accordance with grain size and grade of grinding wheels, and work-pieces-STD11 and STD61. According to the experiment's results, the following can be expected;as grinding time passes by, the relation of grinding depth and quantity of AE signal, observing on AE signal and grinding burn suggest the characteristics of grinding processes and evalution on the possibility of control of grinding machine, and monitoring abnormal conditions.e, and monitoring abnormal conditions.

• 한국정밀공학회지
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• 제20권7호
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• pp.63-69
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• 2003

Through the previous works, it was found that the laminated grinding wheel is more efficient to generate smoother surface in short time than general grinding wheels. But, if the laminated grinding wheel is easily worn-out, it is impossible to apply this wheel in the real grinding process, because the periodic time for dressing is closely linked to the productivity of the process. So, it is required to investigate the wear of the laminated grinding wheel fer studying the periodic time for dressing. But it is difficult to analyze the dressing period quantitavely. Therefore, in this study, periodic times for dressing of the laminated grinding wheel and general grinding wheel are deduced from the relationship between the wear of grinding wheels and the surface roughness changes according to the number of traverse in cylindrical traverse grinding through experiments. This study shows that there are some differences in the wheel wear mechanisms between the general and laminated grinding wheels. As a result, it is also found that the periodic time for dressing of the laminated grinding wheel is longer than that of the general grinding wheel.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1076-1079
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• 2001

This investigation reports the grinding characteristics of titanium alloy(Ti-6Al-4V). Grinding experiments were performed at various grinding conditions. The grinding forces and grinding force ratio were measured to investigate the grindability of titanium alloy with the Diamond and CBN wheel. To investigate the grinding characteristics of titanium alloy grinding force ratio and grinding ratio were measured. Surface profile of wheel was also measured with tracer and the ground surfaces and chip were observed with SEM. Grinding-ratio of titanium alloy was much lower than that of other materials. Grinding-ratio of titanium alloy with Diamond wheel was almost six times larger than that with CBN wheel.

• 한국안전학회지
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• 제7권4호
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• pp.13-21
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• 1992

The purpose of this reserch is to suggest grinding temperature for high effect grinding and to clarify the sufficient grinding heat by experiment and theory(developed finite element program). Main results to be obtained are as follows : 1) The grinding temperature distribution by F. E. M is comparatively in good apreement with the experimental results. 2) The up cut grinding method of grinding methods is decreased burning effect. 3) Regardless of the table speed on the temperature distribution in grinding surface layer, cooling effect is about 6-8times when developed nozzle is used.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.285-288
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• 2000

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. The associated surface roughness and grinding force are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• 한국기계가공학회지
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• 제15권5호
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• pp.73-79
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• 2016

In this paper, the grinding characteristics in thrust internal grinding have been studied using vitreous CBN wheels with a machining center. Grinding experiments have been performed according to grinding conditions such as wheel feed speed, cut depth, workpiece speed, rate of grinding width and number of grinding passes. The machining error, shape of machined surfaces, grinding force, and surface roughness have been investigated though these experiments. Based on the experimental results, the grinding characteristics on the machined surface in the internal thrust grinding are discussed.

• 한국정밀공학회지
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• 제16권10호
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• pp.182-186
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• 1999

Structural ceramics such as $Al_2O_3$, SIC, and $Si_3N_4$ are difficult to grind materials because of their high hardness and brittleness. They are normally ground in brittle mode, but it is possible to be ground in ductile mode depending upon the grinding conditions. In this paper an experimental investigation has been carried out to see the relationship between the grinding energy and grinding mode. It has been found that the ductile mode grinding consumes more grinding energy than the brittle mode grinding. Thus, the grinding conditions of the higher specific grinding energy leads to the plastic deformation in the ground surface of workpiece and results in the better surface finish.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.113-117
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• 1995

Grinding operations is accomplished by rotating a gfinding wheel with lots of random abrasive at high speed, and its object is generally obtained the fanal workpiece surface of high quality as well as the maximization of workpiece removal rate. But, especiallysince grinding operations is related with a large amount of functional parameter, it is actually difficult to therapy that the grinding trouble occurs during the grinding process. Therefore, we trytodesign grinding trouble-shooting system utilizing the back-propagation model of neural network. The conceptual method is produced byidentifying the four parameters derived from the grinding power, and we are design te to the grinding trouble-shooting system on the basis of their data. In this paper, cognition and therapy method tothe grinding trouble which utilizes neural network based four identified models are suggested, and implementation results of computer simulation with respect to the grinding burn and chatter vibration is presented.