• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.831-836
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• 2004

Vibration of electric-powered hand grinder comes from the parts of motor, gear, bearing, and fan. Excessive vibration can be harmful to workers. To reduce vibration of a hand grinder we analyzed the frequency components from the routing electric-powered grinder and did modal test to find the natural frequencies of the each part. It shows that the vibration is due to the resonance of the case. To remove the resonance, the case structure is modified and the bearing cap is replaced on a basis of the results from the rotor dynamic analysis using SAMCEF. As a result the vibration of the hand grinder is reduced greatly.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.10
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• pp.1035-1040
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• 2004

The vibration of an electric hand grinder originates from the motor, gear, bearing, and fan. Its excessive vibration can be harmful to workers. To reduce the vibration of an electric hand grinder. frequency analysis for the vibration signals of a running electric hand grinder and modal test for the each part were done. The results show that the vibration is due to the resonance of the case. To remove the resonance, the case structure was modified and the bearing cap was replaced on a basis of the results of the rotor dynamic analysis using SAMCEF. As a result, the vibration of the electric hand grinder was reduced greatly.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1087-1091
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• 2004

In this study, the ultra precision centerless grinder for ferrule grinding was designed. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed. The grinding and regulating wheel spindle units were composed of hydrostatic spindle and feeding table was hydrostatic table. The prototype of hydrostatic table was manufactured and tested.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.11-14
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• 2003

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.6-9
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• 2005

In this study, the ultra precision centerless grinder for ferrule grinding was designed. As the good-qualified ferrule is required a precise and fine grinding, grinding machine for ferrule must have a high accuracy and a sufficient stiffness. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed. The grinding and regulating wheel spindle units were composed of hydrostatic spindle and feeding table was hydrostatic table. The prototype of hydrostatic table was manufactured and tested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.52-58
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• 2000

the quality of a TV is closely connected with the high quality surface of Braun tube. To get high quality surface an improved grinding system is needed. It has three main parts : the housing part of supporting frame the outershaft part rotat-ed by motor and the innershaft part having eccentricity from the rotation axis of the outershaft. the housing part and the outershaft part are connected by outerbearings, The outershaft part and the innershaft part are connected by innerbearings. Although the outershaft part is rotated at high-speed the innershaft part is not rotated by offset coupling. The high quality grinding surface can be obtained by this mechanism of panel surface grinder, Because the innershaft is unbalanced by eccentricity from rotation axis of outershaft the unbalancing vibration is resulted In this rotor system with high-speed rota-tion the unbalancing vibration makes the opertion unstable. In this research the transfer function is obtained bythe frequency response analysis of finite element model. The simu-lation result is proved by comparing with the experimental result measured by signal analyzer Then the results are corre-lated. in order to improve the design an optimization method is used instead of two-planes balancing method The parts of the 3-dimensional panel surface grinder satisfy the each constraint, The result shows that the design of the panel surface grinder can be optimized.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.91-96
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• 2017

One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.82-87
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• 2019

One of the most critical aspects of the semiconductor industry is the quality of the wafer surface. And the vibrations of wafer grinder are supposed to be the most dominant factors to damage the wafer surface quality. In this study, structure of a wafer grinder has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.

• 제어로봇시스템학회:학술대회논문집
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• 1992.10a
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• pp.71-74
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• 1992

This paper describes the automation of the surface grinder for a grinding wheel by application of programmable logic controller(PLC) with a position sensor, and a limit switch. The control system is designed to provide feeding a workpiece on the turn table and pressing it by the upper disk automatically. In this development the automation of checking the thickness of a grinding wheel is most important. In order to measure the relative displacement, the proximity sensors were employed and the sensitivities of the sensors were investicated and discussed the superiority. It has been shown by model experiment that the automation system of the surface grinder is performed satisfactory.