• Title/Summary/Keyword: grain quality

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Pulse Rectifier For Electroplating (전기도금용 펄스 전원장치)

  • 권순걸
    • Proceedings of the KIPE Conference
    • /
    • 2000.07a
    • /
    • pp.685-688
    • /
    • 2000

  • Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.

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