• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.78-78
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• 2009

Glass sealing method is used glass bond as called frit in LCD, PDP process. but new sealing method is need to consider the endurance and economy. This paper present the new glass sealing method using high density gas torch in the furnace and process variable are defined by experiment. Taguchi Robust Experimental Design methods were applied for optimizing these four main processing parameters.

• 한국세라믹학회지
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• 제52권2호
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• pp.119-122
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• 2015

Laser sealing with glass frits appears a promising technology for sealing various electronic devices (e.g., solar cells, displays) due to its several advantages. The purpose of this study is to understand the relationship between the composition of glasses and their laser-heating conditions. To allow glass to be sealed using laser heating, CuO was added to two different glass systems, in different amounts. The optical absorptivity of the glass samples was related directly to their CuO content. The laser-heating temperature and the CuO content exhibited a proportional relationship. Furthermore, the heating temperature increased linearly with the laser power used. From these results, we could determine the appropriate laser-heating conditions and CuO content for sealing electronic devices using laser-sealing technology.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.373-376
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• 2008

New glass compositions for lead free, low temperature sealing glass frit was examined in $ZnO-V_2O_5-P_2O_5$ glass system which can be used sealing material for PDP to be made of soda lime glass substrates. Among many glass compositions, KFS-C glass showed low glass transition point (Tg) and good fluidity and adhesion characteristics when it was tested by flow button method at low temperature of $420^{\circ}C$. Its Tg was $317^{\circ}C$ and thermal expansion coefficient (CTE) was $70{\times}10^{-7}/K$. The glass frit was mixed with an organic vehicle to make a paste and it was dispensed and sealed with soda lime glass substrates at $420^{\circ}C$ for 10min. Sealed glass panels also showed good adhesion strength even sealed at low temperature of $420^{\circ}C$.

• 한국세라믹학회지
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• 제56권2호
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• pp.173-177
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• 2019

Thermal properties of a SiO₂-B₂O₃-BaO ternary glass system depending on compositional change of BaO have been examined to find a proper sealing material for reversible oxide cells. Glass transition temperature and thermal expansion coefficients increased simultaneously up to 55 mol% of BaO content. The structural role of BaO with regard to the thermal properties has been discussed on the basis of Raman spectroscopy results. Flowability of the glass at sealing temperature has been examined with packed glass powders of 12 mm diameter along with a high temperature optical microscope. The practical sealing property of the glass was also examined with YSZ coated with NiO-yittria stabilized zirconia (NiO-YSZ) and it showed good adhesion without noticeable reaction with NiO-YSZ layer.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.571-576
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• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.976-980
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• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• 한국산학기술학회논문지
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• 제14권3호
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• pp.1016-1021
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• 2013

수소혼합가스토치를 이용하여 유리 모서리 접합 시 접합부의 형상은 수소혼합가스의 유량, 토치의 이송속도, 토치와 유리사이의 거리 등 많은 공정변수들에 의해 영향을 받는다. 모서리 접합형상은 유리패널의 단열 및 기밀, 강도성능에 영향을 미치므로, 공정변수에 따른 접합부 형상예측에 대한 연구가 수행되어야 한다. 따라서 본 논문에서는 공정변수 설정 및 실험분석을 통하여, 공정변수에 따른 단면형상을 예측할 수 있는 회귀식을 도출하였다. 도출된 회귀식에 각 공정변수값을 적용하여 접합형상을 예측하고, 실제 모서리 접합 실험결과와 비교하여 회귀식의 타당성을 검증하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.169-170
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• 2009

• 한국산학기술학회논문지
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• 제13권3호
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• pp.961-966
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• 2012

고유가 시대를 맞아 에너지 절약이 사회적으로 이슈화됨에 따라 진공유리에 대한 관심이 높아지고 있다. 진공유리 개발을 위한 핵심 공정 중 유리모서리 접합공정은 두 장의 유리 사이를 진공으로 유지하기 위해 높은 신뢰도를 요한다. 본 논문에서는 유리 모서리 접합 시 기존 프릿을 이용하여 접합하는 방법과 달리 고밀도열원인 수소혼합가스를 이용하여 모서리를 접합하는 공정을 제시하였다. 또한 유리의 파손 및 변형방지를 위해 전기로내의 분위기 온도를 설정하고 균일도를 측정하였다. 기초시험을 통해 모서리접합 공정변수를 설정하고 공정변수에 따른 유리 모서리 접합부 면적과의 수학적관계식을 다중회귀분석으로 도출하였다.

• 한국세라믹학회지
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• 제43권9호
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.