• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.434-439
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• 2008

Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of $Bi_2O_3$ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a $Bi_2O_3$ content of 60 wt%, owing to the open microstructure formed at the firing temperature of $600^{\circ}C$. When the $Bi_2O_3$ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.12
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• pp.1988-1994
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• 2001

The CRT(Cathode-ray Tube) of salvage is a process of separating the panel and funnel to recycle a cathode-ray tube. In this paper, the thermal properties of glass for CRT were studied to improve its recycling ratio. In the salvage process, several patterns of breakage, as called 'comer pull', were easily generated on the sealing surface of panel or funnel glass due to the residual tensile stress, which had correlations with some parameters of the manufacturing process of CRT and the initial material properties of glass. Finite element analyses and experimental approaches on the flit sealing process were carried out to obtain the major characteristic of glass related to the residual stress. From this study, it was identified that the thermal expansion coefficient of glass had much influence on the residual stress of panel glass after frit sealing process. Therefore, the optimal conditions of thermal properties for CRT glass were proposed to achieve an effective salvage process. By using these optimal conditions, the size of comer pull on the panel and funnel glass was reduced to 10% level compared with the original size, and the recycling ratio of CRT was increased in the salvage process.

• Journal of the Korean Ceramic Society
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• v.39 no.6
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• pp.582-588
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• 2002

IrO$_2$-RuO$_2$ films were deposited on plasma sprayed TiO$_2$ buffer layer above Ti metal by sol-gel and dip-coating method. Organic vehicle (ethyl cellulose and $\alpha$-terpineol) and glass frit were added to improve adherence of the coatings. Taguchi method and L$_{18}$ (2$^1$$\times$3$^{7}$ ) orthogonal arrays were evalvated in terms of current density to determine the optimal combination of levels of factors that best satisfy the bigger is better quality characteristic. The observed conditions were as fellows: ethyl cellulose (100 cp), drying temperature and time (17$0^{\circ}C$,20 min), heat treatment temperature and time (75$0^{\circ}C$,10 min), the weight ratio of IrO$_2$-RuO/powders to glass frit (99:5), final heat treatment time (120 min) and flow rate of air (5 sccm), respectively. ANOVA analysis suggested that the influence of the factors within $\alpha$= 0.1 was significant with a 90% confidence level.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.613-618
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• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.548-551
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• 2004

For the improvements in high transmittance, one of the most important factors of transparent dielectric is pore contents and pore size. This study have investigated the effect of frit size on the transmittance of zinc-boric system with a Pb-free composition. A mixed glass paste was used for thick films, which were made by screen printing methods on a glass substrate (PD200). These dielectric layers were measured for surface roughness, pores content and transmittance. The results show that increase of pore size and content have detrimental effects on the transmittance of films compared to those found in the PbO system.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1360-1363
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• 2007

The bus electrode is composed of two layers. One is the black matrix(BM) and silver layer is formed on top of black layer. The BM paste is made by mixing $Co_3O_4$ black powder with photosensitive vehicle and rheological additives. In this work we studied the effect of $Co_3O_4$ black powder and glass frit on the rheological property of photosensitive BM paste. We also examined how the size and content of black powder and glass frit affect the transmittance and reflectance of the BM layer after sintering.

• Journal of the Korean Chemical Society
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• v.35 no.6
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• pp.699-706
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• 1991

The moderate power (500 W) Microwave Induced Plasma was generated with helium gas and was used for the direct analysis of aqueous samples. Usually, the helium plasma obtained with a modified Beenakker type cavity forms a cylindrical one. Though, by the careful controls of gas flows, a "toroidal" shape plasma could be made but its analytical performances were found to be worse. Using the glass frit nebuliser, the detection limits for metal ions obtained were around 10~100 ppb and that for chloride was about 50ppm.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.71-75
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• 2001

The first step for recycling the CRT bulb is to remove frist seals between the panel and funnel. For this purpose, various kinds of methods have been used. One of those is to use the nitric acid, which is a proven technology and widely used in CRT-making industries. The process. however. has a problem of NOx generation. Such a drawback can be overcome by using a new chemical. This new chemical can remove the frit without NOx generation. This paper describes the dissolution ability of the chemical for lead and zinc oxides and the application to the separation of the CRT panel from its funnel.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.236-240
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• 2012

Limiting thermal exposure time using rapid thermal processing(RTP) has emerged as promising simplified process for manufacturing of solar cell in a continuous way. This paper reports the simplification of co-firing using RTP. Actual temperature profile for co-firing after screen printing is a key issue for high-quality metal-semiconductor contact. The plateau time during the firing process were varied at $450^{\circ}C$ for 10~16 sec. Glass frit in Ag paste etch anti-reflection layer with plateau time. Glass frit in Ag paste is important for the Ag/Si contact formation and performances of crystalline Si solar cell. We achieved 17.14% efficiency with optimum conditions.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.