• Title/Summary/Keyword: free drop impact

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Experimental investigation of slamming impact acted on flat bottom bodies and cumulative damage

  • Shin, Hyunkyoung;Seo, Byoungcheon;Cho, Sang-Rai
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.10 no.3
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    • pp.294-306
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    • 2018
  • Most offshore structures including offshore wind turbines, ships, etc. suffer from the impulsive pressure loads due to slamming phenomena in rough waves. The effects of elasticity & plasticity on such slamming loads are investigated through wet free drop test results of several steel unstiffened flat bottom bodies in the rectangular water tank. Also, their cumulative deformations by consecutively repetitive free drops from 1000 mm to 2000 mm in height are measured.

Experimental Study on Wedge Slamming Considering Fluid-Structure Interaction (유체-구조 상호 간섭을 고려한 쐐기 슬래밍에 대한 실험적 연구)

  • Ahn, Kang-Su;Kwon, Sun-Hong
    • Journal of Ocean Engineering and Technology
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    • v.31 no.1
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    • pp.22-27
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    • 2017
  • This paper presents the results of an experimental study on the wedge slamming impact problem, including the fluid-structure interaction. A free drop test was performed to estimate the hydroelasticity. Three wedges were fabricated of 5 mm thick steel plate. The deadrise angles were $15^{\circ}$, $20^{\circ}$, and $25^{\circ}$. Plate thicknesses of 2 mm and 3 mm were used to determine the effect of the structural rigidity. The drop heights were 25 cm, 50 cm, 75 cm, and 100 cm. The pressure on a rigid part of the wedge and strain of the elastic plate were measured at four different locations. The pressure was compared using the Wagner theory and generalized Wagner theory.

Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-free Solder Bump (리플로우 횟수와 표면처리에 따른 Sn-Ag-Cu계 무연 솔더 범프의 고속전단 특성평가)

  • Jang, Im-Nam;Park, Jai-Hyun;Ahn, Yong-Sik
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.3
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    • pp.11-17
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    • 2009
  • The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

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Experimental and Numerical Study on Board Level Impact Test of SnPb and SnAgCu BGA Assembly Packaging (BGA Type 유.무연 솔더의 기계적 충격에 대한 보드레벨 신뢰성 평가)

  • Lim, Ji-Yeon;Jang, Dong-Young;Ahn, Hyo-Sok
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.4
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    • pp.77-86
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    • 2008
  • The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

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Development and Verification of ELT System Using the MEMS Accelerometer (MEMS 가속도계를 적용한 ELT 시스템 개발과 검증)

  • Lee, Sang-Chul;Lee, Dong-Kyu;Kang, Ja-Young
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.38 no.3
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    • pp.294-299
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    • 2010
  • ELT(Emergency Locator Transmitter) is used to send distress signal in the event of an aircraft crash. It is very useful but the ELT may transmit wrong signal caused by misjudging between crash and hard-landing. The reason of this problem is the low accuracy of the mechanical G-switch currently in use. To improve the ELT, we developed an ELT system using the MEMS(Micro Electro-Mechanical Sensor) accelerometer. The ELT system consists of acceleration data acquisition/analysis system, program of crash recognition, and GPS receiving system for the position information of an aircraft crash site. A free-drop table was developed for verification of the ELT system. The free-drop table was designed to replicate the acceleration and the pulse duration of the hard landing and the crash. By using the free-drop table, we showed that the ELT system performed well.

Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes (OSP.ENIG 표면 처리된 기판과 Sn-3.0Ag-0.5Cu 솔더 접합부의 낙하충격 신뢰성 평가)

  • Ha, Sang-Ok;Ha, Sang-Su;Lee, Jong-Bum;Yoon, Jeong-Won;Park, Jai-Hyun;Chu, Yong-Chul;Lee, Jun-Hee;Kim, Sung-Jin;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.33-38
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    • 2009
  • The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

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A Study on the Impact Absorbing Characteristics for Various Shape and Hardness of Cylindrical Rubber Structures (원주형 고무구조물의 형상과 재질변화에 따른 충격흡수특성)

  • Kim, Dong-Jin;Kim, Wan-Doo;Lee, Young-Shin
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.441-446
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    • 2004
  • Mechanical systems with rubber parts have been used widely in industry fields. The evaluation of the physical characteristics of rubber is important in rubber application. Rubber material is useful to machine component for excellent shock absorbing characteristics. The impact characteristics of rubber were examined by experimental and finite element method. The impact test was conducted with a free-drop type impact tester. The ABAQUS/Explicit was used for finite element analysis. The effects of thickness and diameter of the cylindrical rubber structures were investigated. The impact absorbing ratio of the rubber material was studied order to compare the peak reaction force of the specimen which only contained aluminum against the specimen with the inserted rubber part.

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Experimental investigation of impact behaviour of shear deficient RC beam to column connection

  • Murat, Aras;Tolga, Yilmaz;Ozlem, Caliskan;Ozgur, Anil;R. Tugrul, Erdem;Turgut, Kaya
    • Structural Engineering and Mechanics
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    • v.84 no.5
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    • pp.619-632
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    • 2022
  • Reinforced concrete (RC) structures may be subjected to sudden dynamic impact loads such as explosions occurring for different reasons, the collision of masses driven by rockfall, flood, landslide, and avalanche effect structural members, the crash of vehicles to the highway and seaway structures. Many analytical, numerical, and experimental studies focused on the behavior of RC structural elements such as columns, beams, and slabs under sudden dynamic impact loads. However, there is no comprehensive study on the behavior of the RC column-beam connections under the effect of sudden dynamic impact loads. For this purpose, an experimental study was performed to investigate the behavior of RC column-beam connections under the effect of low-velocity impact loads. Sixteen RC beam-column connections with a scale of 1/3 were manufactured and tested under impact load using the drop-weight test setup. The concrete compressive strength, shear reinforcement spacing in the beam, and input impact energy applied to test specimens were taken as experimental variables. The time histories of impact load acting on test specimens, accelerations, and displacements measured from the test specimens were recorded in experiments. Besides, shear and bending crack widths were measured. The effect of experimental variables on the impact behavior of RC beam-column connections has been determined and interpreted in detail. Besides, a finite element model has been established for verification and comparison of the experimental results by using ABAQUS software. It has been demonstrated that concrete strength, shear reinforcement ratio, and impact energy significantly affect the impact behavior of RC column-beam connections.

Investigation of lateral impact behavior of RC columns

  • Anil, Ozgur;Erdem, R. Tugrul;Tokgoz, Merve Nilay
    • Computers and Concrete
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    • v.22 no.1
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    • pp.123-132
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    • 2018
  • Reinforced concrete (RC) columns which are the main vertical structural members are exposed to several static and dynamic effects such as earthquake and wind. However, impact loading that is sudden impulsive dynamic one is the most effective loading type acting on the RC columns. Impact load is a kind of impulsive dynamic load which is ignored in the design process of RC columns like other structural members. The behavior of reinforced concrete columns under impact loading is an area of research that is still not well understood; however, work in this area continues to be motivated by a broad range of applications. Examples include reinforced concrete structures designed to resist accidental loading scenarios such as falling rock impact; vehicle or ship collisions with buildings, bridges, or offshore facilities; and structures that are used in high-threat or high-hazard applications, such as military fortification structures or nuclear facilities. In this study, free weight falling test setup is developed to investigate the behavior effects on RC columns under impact loading. For this purpose, eight RC column test specimens with 1/3 scale are manufactured. While drop height and mass of the striker are constant, application point of impact loading, stirrup spacing and concrete compression strength are the experimental variables. The time-history of the impact force, the accelerations of two points and the displacement of columns were measured. The crack patterns of RC columns are also observed. In the light of experimental results, low-velocity impact behavior of RC columns were determined and interpreted. Besides, the finite element models of RC columns are generated using ABAQUS software. It is found out that proposed finite element model could be used for evaluation of dynamic responses of RC columns subjected to low-velocity impact load.

Development of a Miniature Pendular Type Impact Testing Machine Using a Magnetic Powder Brake (마그네틱 파우더 브레이크를 이용한 소형 진자형 충격시험기 개발)

  • You, In-Dong;Lee, Man-Suk;Kim, Ho-Kyung
    • Tribology and Lubricants
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    • v.27 no.3
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    • pp.140-146
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    • 2011
  • A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.