• Korean Journal of Materials Research
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• v.7 no.4
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• pp.310-316
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• 1997

The effects of carbide and matrix structures on the abrasion wear resistance of multi-component white cast irons with 3.0 mass%C have been studied in this paper. Four different heats were poured in order to obtain the specimens with different combinations of the carbide structures: a basic iron(3.0 mass%C-5.0 mass%Cr-5.0 mass%V-5.0 mass% Mo-12.5mass%W)for M$_{6}$C and M$_{7}$C$_{3}$ carbides, and a Cr free iron(3.0 mass%C-5.0 mass%V-2.5mass%Mo-12.5 mass%W) for MC and M6C carbides. A conventional high Cr free free iron(3.0 mass%C-5.0 mass%V-2.5 mass%Mo-12.5 mass%W) for MC and M6C carbides. A conventional high Cr white cast iron was also poured to compare its wear resistance with those of the multi-component white cast irons. In the as-cast condition, the range of abrasive wear rate(Rw=mg/min) was from 4.15 to 5.98 . The lowest Rw, which means the highest wear resistance, was obtained in the basic iron with nodular MC, lamellar M$_{2}$C and cellular M$_{7}$C$_{3}$ carbides. On the other hand, the Rw of the high Cr white cast iron ranked between the basic iron and the Mo and W free iron. In each alloy, the Rw of air hardened or tempered specimen was lower than that of the as-cast one because of the change of matrix structures by the heat treatments. The Rw of the hear treated speci-mens increased in the order Mo and W free iron, basic iron, Cr free iron, high Cr iron, and V free iron.n.n.n.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.434-438
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• 2003

The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process. In this paper, we have developed the desktop-type precision punching system to investigate the burr formation mechanism and present kinematically Punch-die auto aligning methodology, for the purpose of burr unifomizing and minimizing, between the rectangular shaped punch and die. By using the scanning electron microscope, the aligned punching results are compared with the miss-aligned ones. Also, we measured the relative burr heights using the self-designed laser measuring device for insitu self aligning. Since it is hard to get the perfect, so called, burr-free edges during the shearing process, we introduced the ultrasonic do-burring machine. The de-burring operation was carried out by a novel do-burring method, the reversal flow resistance method, under different machining loads and abrasive types. The final do-burring results show the validity of our punching do-burring system pursuing the burr-free punched elements.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.149-158
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• 2002

Recently, the minimum line width shows a tendency to decrease and the multi-level increases in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. However there are several defects in CMF, such as micro-scratches, abrasive contaminations and non-uniformity of polished wafer edges. Wet etching process including spin-etching can eliminate the defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(Interlayer-Dielectric) was removed by CMP and wet etching process using DHF(Diluted HF) in order to investigate the possibility of planrization by wet etching mechanism. In the thin film wafer, the results were evaluated from the viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And the pattern step heights were also compared for the purpose of planarity characterization of the patterned wafer. Moreover, Chemical polishing process which is the wet etching process with mechanical energy was introduced and evaluated for examining the characteristics of planarization.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.33 no.4
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• pp.419-426
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• 2023

Objectives: This study aims to develop an Occupational Safety and Health (OSH) guide for the safe cleaning of contaminated machinery, equipment, and parts used in the electronics manufacturing process. Methods: A literature review, field investigations, and discussions were conducted. An initial draft of an OSH guide was developed and reviewed by experts with significant experience in maintenance work in the electronics manufacturing process in order to refine the guide. Results: Workers involved in cleaning processes with chemicals, solvents, and abrasive blasting can face exposure to a wide range of chemicals, abrasives, and noise. Identifying potential risks associated with each cleaning technique was an essential first step toward enhancing safety measures. The OSH guide comprises approximately eleven to twelve sections spanning 20-25 pages. It includes engineering and administrative protocols systematically organized to address the necessary actions before, during, and after cleaning tasks, depending on the technique. It is recommended that airline respirator masks be used in conjunction with an air purification system to ensure adherence to air quality standard "D" for atmosphere level. The use of an oil-free air compressor is advised, preferably a stationary model that does not rely on fuel sources like diesel. Conclusions: This OSH guide is designed to protect workers involved in maintenance activity in the electronics industry and aligns with global standards, such as those from the International Organization for Standardization (ISO) and Semiconductor Equipment and Material International, ensuring a higher level of safety and compliance.

• Journal of Mechanical Science and Technology
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• v.17 no.3
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• pp.391-399
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• 2003

The thermo-acoustic emission (AE) technique has been applied for nondestructive characterization of composite laminates subjected to cryogenic cooling. Thermo-AE events during heating and cooling cycles showed a Kaiser effect. An analysis of the thermo-AE behavior obtained during the 1st heating period suggested a method for determining the stress-free temperature of the composite laminates. Three different thermo-AE types classified by a short-time Fourier transform of AE signals enabled to offer a nondestructive estimation of the cryogenic damages of the composites, in that the different thermo-AE types corresponded to secondary microfracturing in the matrix contacting between crack surfaces and some abrasive contact between broken fiber ends during thermal load cycles.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.537-542
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• 2004

Machinble Ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. Lapping used diamond slurry and lapping by in-process electrolytic dressing is developed to solve this problem. On this paper, a comparative study of processing ability of lapping used diamond slurry and lapping by in-process electrolytic dressing.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1169-1175
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• 1994

Five Al2O3/SiC/metal composites with four different particle sizes of green SiC abrasive grains are grown by the directed oxidation of an commercially available Al-alloy. Oxidation was conducted in air at 100$0^{\circ}C$, 96 hours long. Slip casted SiC-fillers were placed on the alloy or SiC powder deposited up to the required layer thickness. Their microstructures are described and measurements of density, elastic constants, frexural strength, fracture toughness and work of fracture are reported. The results are compared with those of commercial dense sintered Al2O3. The properties of produced materials have a strong relationship to not only the properties of Al2O3, SiC, Al and Si but also to the phase share and phase distribution. The composite materials are dense (0.5% porosity), tough (KIC = 3.4~6.4 MPa{{{{ SQRT { m} }}), strong ({{{{ sigma }}B = 170~345 MPa) and reasonably shrinkage free producible. The reinforcements is attained mainly through the plastic deformation of ductile metal phase.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.692-697
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• 1997

This paper presents a method of grinding and polishing automation of precision die after CNC machining. The method employs a robot system equipped with a pneumatic spindle and a special abrasive film pad. The robote program is automatically generated off-line from a PC and downloaded to robot controller. Position and orientation data for the program is supplied from cutter contact (CC) data of NC machining process. This eliminates separate robot teaching process. This paper aims at practical automation of die finishing process which is very time consuming and suffering from shortage of workpeople. Time loss for changeover from one product to next is eliminated by off-line programming exploiting appropriate NC machining data. Dextrous 6-axis robot with rigid wrist and simple tooling enables the process applicable to larger, rather complex 3 dimensional free surfaces

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1047-1050
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• 2000

As the progress of new industrial products or parts technology, the precise and fine machining technologies are needed more and more. Micro fabrication technology of these products are usally consisted of mechanical machining or MEMS technology. Direct machining by mechanical method is not applicable to mass production. MEMS technology also has several problems such as low mechanical strength, bad surface roughness and difficulty of 3 dimensional machining. In this study, we introduce several micro fabrication technology to make micro molds and dies and our project to develop these machining technology.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.9-17
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• 1999

This paper presents a method of grinding and polishing automation of precision die after CNC machining. The method employs a robot system equipped with a pneumatic spindle and a special abrasive film pad. The robot program is automatically generated off-line program form a PC and downloaded to robot controller. Position and orientation data for the program is supplied form cutter contact (CC) data of NC machining process. This eliminates separate robot teaching process. This paper aims at practical automation of die finishing process which is very time consuming and suffering from shortage of workpeople. Time loss due to changeover from one product to another is eliminated by PC off-line programming exploiting appropriate NC machining data. Dextrous 6-axis robot with rigid wrist and simple tooling enables the process applicable to larger, rather complex 3 dimensional free surfaces.