• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1115-1120
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• 2003

In this paper, we investigated the position dependent stress distribution of indium-tin-oxide (ITO) film on Polycarbonate (PC) substrate by external bending force. It was found that there are the maximum crack density at the center position and decreasing crack density as goes to the edge, In accordance with crack distribution, it was observed that the change of electrical resistivity of ITO islands is maximum at the center and decrease as goes to the edge. From the result that crack density is increasing at same island position as face plate distance (L) decreases, it is evident that the more stress is imposed on same island position as L decreases.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.364-366
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• 2009

We successfully fabricated flexible electronic paper display (EPD) by using toner particles on plastic (PC) substrate. It has high resolution (WVGA : 800 ${\times}$ 480) and 7 inch diagonal viewable image size. The response time was about 0.25 msec at 90 V, a contrast ratio of about 2, a driving voltage of 60 V which we successfully demonstrated to display several images at.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.710-712
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• 2007

The effects of stress on the IZO/PC substrate and the electro-optical properties of a flexible LCD with microstructure in bending were investigated. It showed that the IZO/PC substrate and the periodic cross spacers are good enough to be employed in the application of the ECB or polarization rotation LC mode.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.745-748
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• 2007

Hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) were fabricated on a flexible metal substrate at $150\;^{\circ}C$. To increase the stability of the flexible a-Si:H TFTs, they were thermally annealed at $230\;^{\circ}C$. The field effect mobility was reduced because of the strain in a- Si:H TFT under thermal annealing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.444-445
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• 2006

We prepared ZnO:Al thin films under various sputtering conditions by using facing targets sputtering (FTS) method. ZnO:Al thin films were deposited on polyethersulfon (PES) substrate which is the thickness of 200um at room temperature. the electrical, optical and crystallographic properties of ZnO:Al were investigated. From the results, prepared alll ZnO:Al thin films showed (002) diffraction peaks. ZnO:Al thin film with a resistivity of $8.4{\times}10^{-4}{\Omega}cm$ and a transmittance of over 80% in visible range was obtained.

• Korean Journal of Materials Research
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• v.26 no.11
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• pp.635-643
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• 2016

Graphene has shown exceptional properties for high performance devices due to its high carrier mobility. Of particular interest is the potential use of graphene nanoribbons as field-effect transistors. Herein, we introduce a facile approach to the fabrication of graphene nanoribbon (GNR) arrays with ~200 nm width using nanoimprint lithography (NIL), which is a simple and robust method for patterning with high fidelity over a large area. To realize a 2D material-based device, we integrated the graphene nanoribbon arrays in field effect transistors (GNR-FETs) using conventional lithography and metallization on highly-doped $Si/SiO_2$ substrate. Consequently, we observed an enhancement of the performance of the GNR-transistors compared to that of the micro-ribbon graphene transistors. Besides this, using a transfer printing process on a flexible polymeric substrate, we demonstrated graphene-silicon junction structures that use CVD grown graphene as flexible electrodes for Si based transistors.

• Journal of Electrical Engineering and Technology
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• v.13 no.1
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• pp.400-405
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• 2018

This paper presents a compact ultra-wideband (UWB) flexible monopole antenna design on a paper substrate. The proposed antenna is made of iterations of a circular slot inside an octagonal metallic patch. This fractal-based geometry has been deployed to achieve compactness along with improved bandwidth, measured reflection coefficient -10 dB bandwidth ranging from 2.7 to 15.8 GHz. The overall size of the antenna is $26mm{\times}19mm{\times}0.5mm$, which makes it a compact one. The substrate used is paper and the main features like environment friendly, flexibility, green electronics applications and low cost of fabrication are the key factors for the proposed antenna. The aforementioned UWB prototype is suitable for many wireless communication systems such as WiMAX, WiFi, RFID and WSN applications. Antenna has been tested for the effect of bending by placing it over a curved surface of a very small radius of 10 mm.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.287-287
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• 2010

We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.

• Electronic Materials Letters
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• v.14 no.6
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• pp.749-754
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• 2018

Previous studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55 V and also the threshold voltage shift under positive bias temperature stress by 2 ${\times}$ compared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.244.1-244.1
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• 2016

Recently, the technology for flexible electronics such as flexible smart phone, foldable displays, and bendable battery is under active development. With approaching the real commercialization of flexible electronics, the electrical and mechanical reliability of flexible electronics have become significantly important because they will be used under various mechanical deformations such as bending, twisting, stretching, and so on. These mechanical deformations result in performance degradation of electronic devices due to several mechanical problems such as cracking, delamination, and fatigue. Therefore, the understanding of relationship between mechanical loading and electrical performance is one of the most critical issues in flexible electronics for expecting the lifetime of products. Here, we have investigated the effect of monotonic tensile and cyclic deformations on metal interconnect to provide a guideline for improving the reliability of flexible interconnect.