• Title/Summary/Keyword: flexible flat display

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Effective ELA for Advanced Si TFT System on Insulator

  • Noguchi, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.45-48
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    • 2006
  • Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.

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Characterization of Aluminum Oxide Thin Film Grown by Atomic Layer Deposition for Flexible Display Barrier Layer Application

  • Kopark, Sang-Hee;Lee, Jeong-Ik;Yang, Yong-Suk;Yun, Sun-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.746-749
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    • 2002
  • Aluminum oxide thin films were grown on a poly ethylene naphthalate (PEN) substrate at the temperature of 100$^{\circ}C$ using atomic layer deposition method. The film showed very flat morphology and good adhesion to the substrate. The visible spectrum showed higher transmittance in the range from 400 nm to 800 nm than that of PEN. The water vapor transmission value measured with MOCON for 230nm oxide-deposited PEN was 0.62g/$m^2$/day @ 38$^{\circ}C$, while that of PEN substrate was 1.4g/$m^2$/day @ 38$^{\circ}C$.

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PI 기판 위에서의 dLTA 공정을 이용한 Grain Boundary와 Grain Size 특성 분석

  • Kim, Sang-Seop;Lee, Jun-Gi;Kim, Gwang-Ryeol;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.338-338
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    • 2011
  • 최근 FPD (Flat Pannel Display) 시장이 커짐에 따라 고효율, 저비용 제작 공정이 화두로 떠오르고 있다. ELA (Excimer Laser Annenling)을 이용한 LTPS (Low Temperature Poly Silicon) 공정은 mobility와 전류 점멸비 등에서 장점을 가지지만, 고비용, 대면적과 short-range에서 uniformity가 어렵다는 단점이 있다. 이를 극복하기 위한 방법으로 dLTA (diode Laser Thermal Annealing) 공정에 대한 연구가 진행되고 있다. 본 연구에서는 Flexible Display을 만들기 위한 방법으로 dLTA 공정을 진행하였다. 이 방법은 PI (Poly imide) 기판 위에 a-Si을 ICP CVD로 증착시킨 후, Diode Laser (980 nm)를 이용한 annealing을 통하여 a-Si이 poly-Si으로 결정화가 되는 것을 확인하였고, 에너지 조사량에 따른 grain boundary와 grain size을 통하여 비교 분석하였다. 실험 결과 ELA 공정을 이용한 것과 버금가는 실험 결과를 얻을 수 있었다.

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Design Optimization of Differential FPCB Transmission Line for Flat Panel Display Applications (평판디스플레이 응용을 위한 차동 FPCB 전송선 설계 최적화)

  • Ryu, Jee-Youl;Noh, Seok-Ho;Lee, Hyung-Joo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.5
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    • pp.879-886
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    • 2008
  • This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

Calibration Technology for Precise Alignment of Large Flat Panel Displays (대형 평판 디스플레이의 정밀 정렬을 위한 캘리브레이션 기술)

  • Hong, Jun-Ho;Shin, Dongwon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.3
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    • pp.100-109
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    • 2022
  • In this study, calibration technology that increases the alignment accuracy in large flexible flat panels was studied. For precise of calibration, a systematization of the calibration algorithm was established, and a calibration correction technique was studied to revise calibration errors. A coordinate systems of camera and UVW stage was established to get the global position of the mark, and equations for translational and rotational calibration were systematically derived based on geometrical analysis. Correction process for the calibration data was carried, and alignment experiments were performed sequentially in cases of the presence or absence of calibration-correction. Alignment results of both calibration correction and non-calibration correction showed accuracy performance less than 1㎛. On the other hand, the standard deviation in calibration-correction is smaller than non-calibration correction. Therefore, calibration correction showed improvement of the alignment repeatability.

Analysis and Design Optimization of Interconnects for High-Speed LVDS Applications (고속 LVDS 응용을 위한 전송 접속 경로의 분석 및 설계 최적화)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.761-764
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    • 2007
  • This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

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The Next Wave in Display Innovation

  • Webster, Steven C.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.4-4
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    • 2008
  • The progress in flat panel displays over the last two decades has been astonishing. In just 20 years, the LCD-TV grew up from a 2-inch curiosity, to an industry that will sell about 120 million flat panel TV's this year, with viewing area up to 4000 times larger. That success is based on continuous innovation, especially in manufacturing processes. For the next decade to bring another doubling of the business, progress will need to continue in four major areas: Human factors, ecological impact, visual quality, and of course continued drive towards affordability. This talk will detail the technology advances that can allow this industry to meet those challenges. Human factors. Today, we adapt our lifestyle to our technology. People organize their offices, and their homes, around displays. We pass around mobile phones to share images, rather than experiencing them as a group. Billions of newspapers continue to be sold daily. Advances in flexible displays can lead to large portable displays. "New era projection" includes the handheld Pico Projectors that are already on the market, and will ultimately appear integrated in mobile phones the same way cameras do today. "Eco" impact. Today TV's are one of the top energy consumers in a U.S. home, and the fastest growing. Watching a large flat panel TV can cost twice as much as running a large refrigerator. With today's concern about energy consumption, regulations are starting to emerge worldwide to limit TV electrical use. Fortunately, good solutions exist in using light management films to eliminate bulbs, saving power without increasing cost. Going forward, LED backlights will drive another step downward. OLED displays might be the ultimate solution. Visual quality. The color of an LCD-TV is still often considered inferior to a far less expensive CRT. And almost all displays suffer from representing a three-dimensional world on a two dimensional surface. The technology to improve color is available today, and will likely move from premium sets into the mainstream as costs come down. 3D is now arriving in movie theaters worldwide, and that will drive up the demand for similar realistic images in home theaters. And the technology is emerging today for 3D representation to move beyond specialized applications into everyday use, on screens large and small. Affordability. The world takes cost-down miracles for granted in consumer electronics. Each of these other advances will be balanced with a drive for affordability, especially as the market grows in emerging countries. The other three challenges must be met without increasing cost. Putting this all together, the next few years will emphasize "eco friendly" designs, and enhanced images such as 3D. By 2013 we will start to see serious penetration by emissive technologies (OLED, high efficiency plasma, or other), with the "ultimate display" likely not in the market for a decade. Lots of opportunities for innovation remain ahead of us.

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Transparent Conductive Single-Walled Carbon Nanotube Films Manufactured by adding carbon nanoparticles

  • Lee, Seung-Ho;Kim, Myoung-Soo;Goak, Jung-Choon;Lee, Nae-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.417-417
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    • 2009
  • Although a transparent conductive film (TCF) belongs to essential supporting materials for many device applications such as touch screens, flat panel displays, and sensors, a conventional transparent conductive material, indium-tin oxide (ITO), suffers from considerable drawback because the price of indium has soared since 2001. Despite a recent falloff, a demand of ITO is expected to increase sharply in the future due to the trend of flat panel display technologies toward flexible, paper-like features. There have been recently extensive studies to replace ITO with new materials, in particular, carbon nanotubes (CNTs) since CNTs possess excellent properties such as flexibility, electrical conductivity, optical transparency, mechanical strength, etc., which are prerequisite to TCFs. This study fabricated TCFs with single-walled carbon nanotubes (SWCNTs) produced by arc discharge. The SWCNTs were dispersed in water with a surfactant of sodium dodecyl benzene sulfonate (NaDDBS) under sonication. Carbon black and fullerene nanoparticles were added to the SWCNT-dispersed solution to enhance contact resistance between CNTs. TCFs were manufactured by a filtration and transfer method. TCFs added with carbon black and fullerene nanoparticles were characterized by scanning electron microscopy (SEM), UV-vis spectroscopy (optical transmittance), and four-point probe measurement (sheet resistance).

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High Temperature Crystallized Poly-Si on the Molybdenum Substrate for Thin Film Transistor Applications (몰리브덴 기판 위에 고온 결정화된 다결정 실리콘 박막 트랜지스터 특성에 관한 연구)

  • 박중현;김도영;고재경;이준신
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.202-205
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    • 2002
  • Polycrystalline silicon thin film transistors (poly-Si TFTs) are used in a wide variety of applications, and will figure prominently future high-resolution, high-performance flat panel display technology However, it was very difficult to fabricate high performance poly-Si TFTs at a temperature lower than 300$^{\circ}C$ for glass substrate. Conventional process on a glass substrate were limited temperature less than 600$^{\circ}C$ This paper proposes a high temperature process above 750$^{\circ}C$ using a flexible molybdenum substrate deposited hydrogenated amorphous silicon (a-Si:H) and than crystallized a rapid thermal processor (RTP) at the various temperatures from 750$^{\circ}C$ to 1050$^{\circ}C$. The high temperature annealed poly-Si film illustrated field effect mobility higher than 30 $\textrm{cm}^2$/Vs, achieved I$\sub$on//I$\sub$off/ current ratio of 10$^4$ and crystall volume fraction of 92%. In this paper, we introduce the new TFTs Process as flexible substrate very promising roll-to-roll process, and exhibit the properties of high temperature crystallized poly-Si Tn on molybdenum substrate.

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A Study on the Mannequins for the Display of Hanbok (한복 전시를 위한 마네킹에 관한 연구)

  • Kim, Yeo Kyung;Kim, Jeong Min;Hong, Na Young
    • Journal of the Korean Society of Costume
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    • v.63 no.6
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    • pp.113-126
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    • 2013
  • The purpose of this study is to analyze the current use of mannequins that are designed to display Hanbok and put forward suggestions for improvement. In order to carry out the study, an analysis on the mannequins that are currently in the market was conducted along with a survey with professionals who are in charge of the display. The significance of the study is that it has gathered the opinions of professionals who are currently participating in the displays of Hanbok to lay the foundation for improvements. As Hanbok is a flat-pattern costume unlike the Western ones, the most prominent way to display is to lay them on the floor or hang them on the wall. Nevertheless, the mannequin displays are needed to show the beauty of Hanbok as the silhouette can only be completed when it is put on a body. A new type of mannequins that can portray the distinctive features of Korean beauty more effectively need to be developed. Although the museum and enterprise slightly differ in their preferences and requirements for the mannequins, both agree on the following criteria; the shape should be adjusted: the protruding breasts of the mannequin are not suitable for Hanbok, the body should be disassembled: all parts of the body should be separable and it should be flexible at the joints so that it can produce various poses, the face should represent the "koreaness" and the material should be soft. Based on these findings, we put forth the suggestion that a more suitable mannequin should be developed to portray the beauty of Hanbok.