• International Journal of Naval Architecture and Ocean Engineering
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• v.6 no.4
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• pp.1111-1129
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• 2014

A 9300 TEU container carrier was equipped in 2006 with instrumentation aimed at wave induced accelerations, and motions. In 2010 the system was extended with strain sensors to include structural loads. Section loads for vertical bending could be readily obtained but the originally intended derivation of horizontal bending and torsion from the measured strains was found to be unreliable. This paper addresses an alternative approach that was adopted in the post processing of results. In particular the concept to use acceleration sensors to capture global hull deformations along the length of the hull, and the use of a data fusion procedure to obtain section loads from combined sensor data and finite element calculations. The approach is illustrated by comparison of actually measured accelerations and local strains with values obtained from the data fusion model. It is concluded that the approach is promising but in need of further validation and development. In particular the number and shapes of the modes used may not have been sufficient to represent the true deflection and thus strain distributions along the high loaded areas.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.04a
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• pp.478-485
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• 2002

The shape memory alloys (SMAs) are often used in smart materials and structures as the active components. Their ability to provide a high recovery force and a large displacement has been used in many applications. In this paper the radial displacement of an externally pressurized elliptic composite cylinder where SMA liner or strips actuators are bonded on its inner or outer surface is investigated numerically. The elliptic composite cylinders consisting of an inlet duct system with SMAs are designed and analyzed to determine the feasibility of such a system for the removal of stiffeners from an externally pressurized duct of an aircraft inlet. The deformations caused by prestrained SMAs placed on either surface of an elliptic composite cylinder are studied when activated. The externally pressurized elliptic composite cylinders with the SMA actuators were analyzed using the 3-D finite element method incorporated with 3-D SMA behaviors. The results show that the role of stiffeners may be switched by the activated light SMA actuators.

• Structural Engineering and Mechanics
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• v.5 no.6
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• pp.817-837
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• 1997

In the present contribution an interface crack model is introduced which is capable of modelling crack initialisation and growth in aluminium as well as in Fibre Metal Laminates. Interface elements are inserted in a finite element mesh with a yield function which bounds all states of stress in the interface. Hardening occurs after a state of stress exceeds the yield stress of the material. The hardening branch is bounded by the ultimate stress of the material. Thereafter, the state of stress is reduced to zero while the inelastic deformations grow. The energy dissipated by the inelastic deformations in this process equals the fracture energy of the material. The model is applied to calculate the onset and growth of cracking in centre cracked plates made of aluminium and GLARE$^{(R)}$. The impact of the model parameters on the performance of the crack model is studied by comparisons of the numerical results with experimental data.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

• Structural Engineering and Mechanics
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• v.52 no.2
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• pp.369-389
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• 2014

Two-layer coupled or composite beams with discrete shear connectors of finite dimensions are commonly encountered in pre-fabricated construction. This paper presents the development of simplified closed-form solutions for such type of coupled beams for practical applications. A new coupled beam element is proposed to represent the unconnected segments in the beam. General solutions are then developed by an inductive method based on the results from the finite element analysis. A modification is subsequently considered to account for the effect of local deformations. For typical cases where the local deformation is primarily concerned about its distribution over the depth of the coupled beam, empirical modification factors are developed based on parametric calculations using finite element models. The developed analytical method for the coupled beams in question is simple, sufficiently accurate, and suitable for quick calculation in engineering practice.

• Journal of Ship and Ocean Technology
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• v.11 no.3
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• pp.14-23
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• 2007

Welding processes cause undesirable problems, such as residual stresses and deformations due to the thermal loads imposed by local heating, melting, and cooling processes. This paper presents a computational modeling technique to simulate the Gas Metal Arc Welding (GMAW) process, emphasizing the effect of the melting bead on the residual stress distribution. Both a three-bar analogy and a three-dimensional thermo-mechanical finite element analysis are carried out in order to explain the effect. Element (de)activation, enthalpy, and adjustment of the reference temperature of thermal strain are considered with respect to the effect of the weld filler metal added to the base metal during a thermo-elastic-plastic analysis. Stress distributions obtained by the present study are compared with measured values and available data from other studies. The effect of the melting bead on the residual stress distribution is discussed and demonstrated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.1
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• pp.73-82
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• 1997

High temperature densification behaviors of alumina powder compacts were investigated under hot pressing and hot isostatic pressing. An alumina part of valve-head shape was fabricated under hot pressing and its forming process was simulated by finite element calculation. an alumina powder compact encapsulated by a stainless steel container was also densified under hot isostatic pressing. Inhomogeneous deformations during hot isostatic pressing due to the canning effect were observed experimentally and predicted by finite element analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.677-684
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• 2004

Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.171-176
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• 2002

This paper is the study on stress analysis of spur gear using a finite element method. Gear drives constitute very important mechanisms in transmitting mechanical power processes compromising several cost effective and engineering advantages. The load transmission occurred by the contacting surfaces arises variable elastic deformations which are being evaluated through finite element analysis. The automatic gear design program is developed to model gear shape precisely. This gear design system developed was used by pre-processor of FEM packages. The distribution of stresses at contacting surfaces was examined when a pair of gear contact.