• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07b
• /
• pp.851-856
• /
• 2003

We have investigated the material and electrical properties of $Bi_{4-x}La_xTi_3O_{12}$ (BLT) ferroelectric thin film for ferroelectric nonvolatile memory applications of capacitor type and single transistor type. The 120nm thick BLT films were deposited on $Pt/Ti/SiO_2/Si$ and $SiO_2/Nitride/SiO_2$ (ONO) substrates by the sol-gel spin coating method and were annealed at $700^{\circ}C$. It was observed that the crystallographic orientation of BLT thin films were strongly affected by the excess Bi content and the intermediate rapid thermal annealing (RTA) treatment conditions regardeless of two type substrates. However, the surface microstructure and roughness of BLT films showed dependence of two different type substrates with orientation of (111) plane and amorphous phase. As increase excess Bi content, the crystallographic orientation of the BLT films varied drastically in BLT films and exhibited well-crystallized phase. Also, the conversion of crystallographic orientation at intermediate RTA temperature of above $450^{\circ}C$ started to be observed in BLT thin films with above excess 6.5% Bi content and the rms roughness of films is decreased. We found that the electrical properties of BLT films such as the P-V hysteresis loop and leakage current were effectively modulated by the crystallographic orientations change of thin films.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.3 s.36
• /
• pp.259-265
• /
• 2005

Characteristics of electroplated Ni films and $Ni-Al_2O_3$ composite films, such as yield strength, fracture elongation, and $Al_2O_3$ content, were evaluated as a function of electroplating current density. $Al_2O_3$ content was $11.48\~11.64\;vol\%$ for $Ni-Al_2O_3$ composite films electroplated at $5\~20\;mA/cm^2$, and decreased to $8.41\;vol\%$ at $30\;mA/cm^2$ $Ni-Al_2O_3$ possessed yield strengths higher than those of Ni films. Especially, $Ni-Al_2O_3$ fabricated at $5\;mA/cm^2$ exhibited $50\%$ improved yield strength. Fracture elongations of Ni and $Ni-Al_2O_3$ decreased with increasing the electroplating current density. $Ni-Al_2O_3$ electroplated at $5\;mA/cm^2$ exhibited more uniform dispersion of $Al_2O_3$ and higher yield strength and larger fracture elongation than the composite films processed at other current densities.

• Korean Journal of Optics and Photonics
• /
• v.21 no.1
• /
• pp.33-37
• /
• 2010

We performed time-domain terahertz (THz) spectroscopy to determine optical constants of highly conductive carbon nanotube (CNT) films. The CNT films have been fabricated on a flexible plastic substrate by using spin-coating or vacuum filtration. We found that the transmission of THz waves can be controlled by manipulating the thickness of the films and by post-treatments. From amplitude and phase information of the transmitted THz waves, we obtain optical constants such as refractive indices and dielectric constants of the CNT films. The frequency dependent dielectric constants show good metallic behaviors, relevant to the Drude free electron models with high plasma frequencies. It is also found that the dielectric constants are higher for the acid-treated films. Finally, the frequency dependent dielectric constants which are free from substrate effects have been demonstrated by using CNT films deposited on cellulose membranes.

• Journal of Mushroom
• /
• v.16 no.3
• /
• pp.131-139
• /
• 2018

The king oyster mushroom (Pleurotus eryngii) is widely consumed because of its flavor, texture, and its functional properties such as antioxidant activity and prebiotic effects. However, long-term product storage and transportation (e.g., export) are difficult because of its limited durability. The shelf-life of king oyster mushroom is affected by environmental factors such as temperature, humidity, gas composition, and ventilation, which may affect sensory characteristics including respiration rate, texture, moisture, flavor, color, and pH. The major problems regarding storage of mushrooms are browning, flavor changes, and softening. To address these problems, novel preservation techniques were developed, and more durable variants were bred. Different drying methods, gamma irradiation, chitosan coating, modified atmosphere (MA) packaging, and controlled atmosphere (CA) storage were evaluated in order to extend the shelf-life of king oyster mushrooms. Freeze drying showed better results for the preservation of mushrooms than other drying methods. Irradiation with 1 kGy was more effective for extending mushroom shelf-life than higher doses. The preservative performance of chitosan-based films was improved by combining the compound with other hydrocolloids, such as oil, protocatechuic acid, and wax. The CA storage conditions recommended for king oyster mushrooms are 5kPa $O_2$ and 10 to 15kPa $CO_2$ at temperatures below $10^{\circ}C$. Active MA packaging with microperforated PP film was also effective for maintaining quality during storage.

• Journal of the Korean Vacuum Society
• /
• v.11 no.3
• /
• pp.176-182
• /
• 2002

Amorphous $TiO_2$ thin films were deposited on glass substrates by ion beam sputtering in which the ratio of $O_2$/Ar gas used as discharged gas was varied from 0 to 2. After optical and microstructure properties and chemical composition of thin films was analyzed, antireflection coating layers were fabricated with $SiO_2$/$TiO_2$ multi-layers. Thin films deposition was performed at room temperature and ion beam voltage and ion current density for sputtering of target were fixed at 1.2 kV and 200 $\mu\textrm{A}/\textrm{cm}^2$, respectively. Refractive indexs of the deposited $TiO_2$films were 2.40-2.45 at a wavelength of 633 nm. $TiO_2$films had high transmission and stoichiometry when ratio of $O_2$/Ar was 1. Rms roughness of deposited $TiO_2$ film was below 7 $\AA$. In excessive $O_2$ environments, however Rms roughness increased over 50 $\AA$. Transmittance decreased by scattering of rough surface. Reflectance of $SiO_2$/$TiO_2$multi-layers was below 1% in visible light.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.6
• /
• pp.583-590
• /
• 2013

Variable emittance radiators can be used in a thermal management system in space because their total emittance changes depending on the temperature of the system. When the temperature of the system decreased, the emittance also decreased so as to minimize the heat loss to the environment. In contrast, when the temperature of the system increased, the emittance also increased such that radiation cooling could occur. Thermochromic materials, whose emittance is a function of the temperature, are often used in variable emittance radiators because no additional parts are needed. In this study, we fabricated a variable-emittance coating by using a sol-gel method based on LSMO ($La_{1-x}Sr_xMnO_3$) and experimentally characterized the emittance change with respect to temperature. Furthermore, we also examined the stability of LSMO film in space environments by exposing it to extremely low pressure and temperature.

• Korean Journal of Materials Research
• /
• v.23 no.12
• /
• pp.672-679
• /
• 2013

$Fe_4[Fe(CN)_6]_3$ coated on a mica or $TiO_2$/mica surface as infrared reflective blue pigment was prepared by a hydrothermal method. $Fe_4[Fe(CN)_6]_3$, used as coloring agent, was uniformly coated on mica or $TiO_2$/mica under the optimized condition of a 1.2 : 1 weight ratio between iron(III) chloride hexahydrate and potassium ferrocyanidetrihydrate at the initial pH level of 4.5 at $70^{\circ}C$. The infrared (IR)-reflective pigments were characterized by SEM, Zeta-potenial, FT-IR, and UV-VIS NIR spectrophotometry. Especially the CIE color coordinate and total solar reflectance(TSR) properties of the pigments were investigated in relation to variation of the coating and coated substrate thicknesses. Isolation-heat paint was prepared with 20 wt% blue pigments fully dispersed in acryl-urethane resin and several additives to coat the film uniformly. The films were also measured with CIE color coordinate, TSR, and the surface temperature was recorded by an isolation-heat measuring system. The pigments and films of $Fe_4[Fe(CN)_6]_3$ coated on mica and $TiO_2$/mica showed high TSR values compared with the TSR value of $Fe_4[Fe(CN)_6]_3$ itself. According to the increase of TSR value, the property of isolation-heat is effective. To realize the optimal blue color, we applied the the pigment to $TiO_2$ coated mica(TM(b)) which has blueish interference color. The pigment of $Fe_4[Fe(CN)_6]_3$ coated on TM(b) shows a strong blue color compared with that of $Fe_4[Fe(CN)_6]_3$ coated on $TiO_2$/Mmca(TM(w)), which has a whitish interference color.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.431-432
• /
• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Microbiology
• /
• v.37 no.2
• /
• pp.130-136
• /
• 2001

The killing effects of two types(one-phase reactor and two-phase reactor) of UV-TiO$_2$photocatalytic system on the microorganisms have been studied. The UV-lamp which emits maximum 39 watts at 254 nm was prepared in these system. Three types of $TiO_2$ coating method were adopted. One type is thin film coated form on the quartz tube in the reactor and another one is surface rough coated form on the glass bead. The other one is $TiO_2$-mixed alginate bead form. UV irradiation was carried out for 1 min. In case of one phase reactor, the bactericidal efficiencies of E. coli by $TiO_2$-coated quartz tube and $TiO_2$-coated glass bead were 63.2% and 89.9%, respectively. In the air-bubbling system, the bactericidal efficiency was 95%, however, the efficiency decreased to 90.6% in the non-bubbling system. In the $TiO_2$-mixed alginate bead system, bactericidal efficiency was 86%. When $H_2O$$_2$ was treated (10, 15, 20, and 25 mg/ι) to the $TiO_2$-coated glass bead reactor, bactericidal efficiency significantly increased according to the concentration of $H_2$$O_2$. Two phase reactor showed more elevated efficiency. E. coli was more sensitive to the reaction than S. cerevisiae.

• Applied Chemistry for Engineering
• /
• v.23 no.1
• /
• pp.1-7
• /
• 2012

In this article, I will introduce recent developments of environmental-friendly materials fabricated using atomic layer deposition (ALD). Advantages of ALD include fine control of the thin film thickness and formation of a homogeneous thin fim on complex-structured three-dimensional substrates. Such advantages of ALD can be exploited for fabricating environmental-friendly materials. Porous membranes such as anodic aluminum oxide (AAO) can be used as a substrate for $TiO_2$ coating with a thickness of about 10 nm, and the $TiO_2$-coated AAO can be used as filter of volatile organic compound such as toluene. The unique structural property of AAO in combination with a high adsorption capacity of amorphous $TiO_2$ can be exploited in this case. $TiO_2$ can be also deposited on nanodiamonds and Ni powder, which can be used as photocatalyst for degradation of toluene, and $CO_2$ reforming of methane catalyst, respectively. One can produce structures, in which the substrates are only partially covered by $TiO_2$ domains, and these structures turns out to be catalytically more active than bare substrates, or complete core-shell structures. We show that the ALD can be widely used not only in the semiconductor industry, but also environmental science.