• Journal of Welding and Joining
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• v.32 no.3
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.10
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• pp.144-149
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• 2008

Configuration of filling imbalance which is originated from imbalanced share rate of melt on runner is changed by runner layout, runner shape, material property, injection pressure, injection speed, melt temperature and mold temperature. In this paper, we conducted a study of runner layout and shape that are main factors of filling imbalance. Other factors such as the sharp corner effect and the groove corner effect are recently released were also considered. The results of study are showed that filling rate of between inside and outside cavity was influenced on shape of runner. Especially, this study suggests a new runner system for filling balance by adapting the two effects of unary branch type runner at multi cavity mold and theoretical investigated flow in the sharp corner type runner.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.152-155
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• 2004

In the semi-solid die casting process, the important thing is the flow behaviors of semi-solid material. The flow patterns of semi-solid material can make the defects during die filling. To control of the flow patterns, is very important and difficult. In this paper, the flow behaviors of the semi-solid A356 alloy material during die filling at various die gate shapes has been observed with the grain size controlled material. The effects of the gate shape on the die filling characteristics were investigated. The filling tests in each plunger strokes were experimented, also simulated on the semi-solid material die casting process by MAGMAsofi. According to the filling tests and computer simulation, the effect of the gate shape on liquid segregation had been investigated.

• Journal of the Korean Geosynthetics Society
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• v.17 no.1
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• pp.119-126
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• 2018

The ground cavity occurring in the downtown area is on the increase. However, when ground subsidence is occurred or a cavity that causes it to occur is found, time and economic difficulties are follwed in recovery. In advance, this study conducted to develop filling system for reinforcement material which is consist of polymer pouch and admixture as a new filler material. We developed a polymer pouch that is water soluble in the precedent study. Since the filling system is trenchless method and don't need any plant, it has time and economic benefits. This system uses air pressure to filling out cavity in a short time. We estimate this system with respect to filling speed and filling ratio by model experiment. In addition, we could confirm various filling condition using DEM Analysis. So, we could develop filling system and analysis it.

• The Korean Journal of Nuclear Medicine
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• v.20 no.2
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• pp.39-45
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• 1986

Resting gated blood pool scan was used to derive left ventricular functional changes in normals (N=13, mean age=43) and in patients with coronary artery disease (N=50, mean age=53). Peak filling rates, average filling rates, and ejection fractions were significantly depressed in coronary artery disease. (p<0.0005, each other). And in coronary artery disease with normal ejection fraction (N=21), peak filling rates and average filling rates were depressed also, and peak filling rates of coronary artery disease with normal ejection fraction were abnormal in 61.2% and average fillin rates were abnormal in 71.4%. It appears that (1) resting peak filling rates and average filling rates were sensitive and easily obtainable parameters of the diastolic dysfunction assosiated with coronary artery disease, (2) a significant proportion of coronary artery disease patients without any evidence of abnormal systolic function have depressed resting peak filling rates and average filling rates of the left ventricle.

• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.4
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• pp.818-839
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• 1996

The strain gage, holographic and photoelastic analysis etc. have been used for stress analysis of prosthesis, orthodontic or orthopedic appliances and filling materials. But these methods has some limitation in analyzing the internal stress. The Finite Element Analysis has been proved to compensate this defect and widely used in this area. The purpose of this study was to compare the stress distributions of the various temporary filling methods being used in pulpotomy procedure. Three different models were designed according to temporary filling material and method: amalgam filling with ZOE base(Model I), amalgam filling with ZPC sub-base and ZOE(Model II), IRM filling only(Model III). The results of the experiment were as follows: 1. In model I under the load case 6 and 1, the significant stress was shown to be concentrated on the buccal portion of crown. 2. Model II showed the similar pattern of stress distribution to Model I. 3. In model III under load case 2, the stress was mainly distributed on the buccal cusp tip and buccal margin of filling material. In same model under the load case 3, the stress was distributed on the lingual cusp tip. 4. Based on the above data, IRM can be assumed to have advantage over the other tested materials in reducing the incidence of crown fracture by localized the stress within the filling materials.

• Restorative Dentistry and Endodontics
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• v.14 no.1
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• pp.121-133
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• 1989

In order to compare the accessory canal filling effects of the three root canal filling methods with gutta-percha, the author fabricated artificial root canal mold with the first and second accessory canals of chrome-cobalt alloy. After the artificial root canal was filled with gutta-percha by lateral condensation, vertical condensation and low-temperature thermoplasticized gutta-percha injection-molded method, twenty five times respectively, the gutta-percha forced into the first and second accessory canals were measured with caliper for length. The results were as follows: 1. The filling in both accessory canals was most effective in low-temperature thermoplasticized gutta-percha injection-melded method followed in such order as: vertical condensation method and lateral condensation method (p < 0.01). 2. The filling effect of the second accessory canal was more or less higher than that of the first one (p < 0.05). 3. Low-temperature thermoplasticized gutta-percha injection-molded method was fastest in time needed for root canal filling followed by lateral condensation method and vertical condensation method.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• Restorative Dentistry and Endodontics
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• v.13 no.1
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• pp.139-150
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• 1988

The purpose of this study was to evaluate the marginal adaptation of Class V resin restorations by the filling techniques. The cavities were filled with Heliosit$^{(R)}$ light curing composite resin system in accordance with the following three filling techniques - bulk-pack placement technique, apical to occlusal layering placement technique, and buccolingual layering placement technique. And the interface between the restoration and the tooth structure was observed with scanning electron microscope. The following results were obtained. 1. Marginal adaptation of enamel showed excellent irrespective of the filling techniques. 2. Marginal leakage of dentin was observed irrespective of the filling techniques. 3. No difference of marginal adaptation according to the filling techniques was observed in light curing composite resin.

• Journal of Broadcast Engineering
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• v.26 no.3
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• pp.327-330
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• 2021

In this paper, a new noise filling method is proposed for improving the performance of the 3D audio codec. In the new method, the core band is limited up to MAX_SFB, not up to the IGF start frequency. And the noise filling is applied to all frequency range of the IGF source patches. We conduct the MUSHRA test and find that the proposed noise filling method demonstrates better performance than the conventional method.