• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 A
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• pp.79-81
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• 1994

A solution of magnetic fields for amorphous core transformer has been tried using homogenization technique. The technique, which is derived by applying asymptotic expansion to the standard finite element method, is helpful to analyse a joint part of amorphous core transformer microscopically. A butt-lap-step joint type of lamination method is modeled and its equivalent reluctivity is calculated to analyse various quantities of the magnetic fields. The algorithm is also applicable to other electric devices which have complicated material structure with repeated patterns.

• Journal of Welding and Joining
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• 제4권2호
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• pp.30-39
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• 1986

In manufacturing of pipe walls for boiler units, distortion can result in pipe-web-pipe joints from the nonuniform expansion and contraction of the weld metal and the adjacent base metal during heating and cooling cycle of the welding process. In this study, the stresses and strains during longitudinal welding of the plate-to-pipe joint were investigated. Using the method of successive elastic solution, longitudinal stresses and strains during and after welding were calculated from the information of temperature distributions obtained by Rosenthal's equations. In order to confirm the validity of the numerical results, the temperature and residual stress distributions were measured and compared with the calculated results. In spite of some assumptions, the one-dimensional analytical results of residual stresses were in fairly good agreement with the experimental ones. The residual stresses due to welding of plate-to-pipe joints are tensile near the weld line and compressive in the base metal as in the welding of plates. the amount and distribution of residual stresses were deeply dependent on the heat input ratio of the plate and pipe.

• 한국철도학회논문집
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• 제3권1호
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• pp.19-26
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• 2000

The rail temperature is important to preserve the joint gap for standard length of rail and to determine the installation temperature which has direct influence on the rail buckling and failure in welded part for continuous welded rail(CWR), Therefore, we have measured and investigated various characteristics of rail temperature for each kind of rail. As the results of this, the correlation between the atmosphere temperature and the rail temperature which is commonly used by Korean Railway should be reconsidered. Also, the daily highest '||'&'||' lowest rail temperature was occurred when each temperature is higher and when it's lower. For the light rail, the rail temperature by the sun-light increases quickly and decreases late. But the time where the highest temperature is attained is same. There are some differences between the shade and sunny place about 3.0∼4.0$\^{C}$. The temperature of rail web is almost close to the conversion rail temperature for rail expansion. The wind of 1 m/s has an influence on the rail temperature around 5$\^{C}$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• 한국공간구조학회논문집
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• 제21권3호
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• pp.35-42
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• 2021

An experimental study was carried out to evaluate the shear performance at the interface composed of structural laminates and concrete. The main variables are the number of CLT layers and the shape of the shear connector. The number of CLT layers consisted of 3 and 5 layers. A total of 6 test specimens for shear performance evaluation were prepared in the form of a shear connector, a direct screw type and a vertically embedded type. As a result of the experiment, similar behavior was shown in all specimens, regardless of the number of layers, including direct screw type (SC series) and vertically embedded type (VE series). The behavior at the joint surface was damaged due to the occurrence of initial shear cracks, expansion of shear groove cracks, and splaying at the interface after the maximum load.After the maximum load, the shear strength decreased gradually due to the effect of the shear connector. It can be seen that the shear strength of all specimens is determined by shear and compression stress failure of concrete at the interface of the notch joint.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2004년도 춘계학술대회 논문집
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• pp.1057-1064
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• 2004

For New In-Cheon Airport. South Approach Section of Young long Great Bridge is to be special concerned to CWR due to substructure was already constructed former railroad bridge design specification. So we applied maintenance free system and CWR (Continuous Welded Rail) by ZLR(Zero Longitudinal Restraint) at bridge expansion joint part. This thesis generally introduce for CWR by ZLR at South Approach Section of Young long Great Bridge.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2000년도 추계학술대회 논문집
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• pp.396-401
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• 2000

There are three examples of noise reduction test by rail welding. One of them is tested at electric car running area and another is tested at expansion joint and long welded rail and the third is tested at open deck bridge. We can know from the result that the noise reduction effect of rail welding is very different to the type of track and the car. The condition of the test has some differences, but it may be useful reference of noise reduction.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.79-79
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• 2004

벨로우즈는 형상자체가 가지는 유연성으로 인하여 배관시스템에서 발생하는 변형을 흡수하여 시스템의 파손을 방지하기 위해 주로 사용한다. 특히 자동차, 항공기, 선박의 파이프 배관시스템 설계시 열, 고압에 의한 변형 방지, 배기계의 진동 흡수 등을 위해 가장 널리 사용되고 있다. 또한 벨로우즈는 파이프라인에는 모든 경우에 사용이 가능하고, 설치와 유지보수가 간단하다는 이점이 있다.(중략)

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1998년도 가을 학술발표회 논문집
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• pp.389-396
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• 1998

One solution to prevent deterioration due to expansion joint and to extend lifetime of short span bridges, is jointless integral abutment bridge. To understand behavior of pile foundation of skewed plate girder bridge with integral abutment, finite element analysis was performed for the model of different skew angle from 90。 to 50。. Comparison of stresses at pile and abutment was made for each case. It is found that effect of temperature change is major factor to influence the behavior of skewed integral abutment bridge.