• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.75-81
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• 2016

This study was conducted to investigate the effects of deep eutectic solvent (DES) treatment on BCTMP fibers and handsheets properties. DES was prepared using lactic acid and betaine (LB), and the molar ratio of these two components mixtures was controlled to 2:1 (LB 2:1) and 5:1 (LB 5:1). As results, 2% of BCTMP pulp (o.d. weight) was extracted when it was treated by LB 5:1 at $50^{\circ}C$ for 12 hours, stirring constantly at 120 rpm. In contrast, lignin was not extracted when BCTMP was mildly treated by the LB DES mixed with 50% of distilled water at the reacting condition of temperature $60^{\circ}C$ for 2 hours using water bath. These results indicate that conditioned water content and adequate reaction time are needed to achieve effective extraction of lignin. It was also found that stiffening of cellulose fiber due to the mild treatment of LB DES to BCTMP fiber leads to the increase of paper bulk without the loss of strength.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.89-96
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GTD-111 was investigated. Bonds were fabricated using a series of holding times(0-7.2ks) at three different temperatures(1403, 1418 and 1453K) under a vacuum of 13.3mPa. In raw material, ${\gamma}$- ${\gamma}$' eutectic phases, platelet η phases, MC carbide and PFZ were seen in interdendritic regions or near grain boundary and size of primary ${\gamma}$' precipitates near interdendritic regions were bigger than core region. The primary ${\gamma}$' precipitates in dendrite core were dissolved early in bonding process, but ${\gamma}$' precipitates near interdendritic regions were dissolved partially and shape changed. The dissolution rate increased with increasing temperature. Phases in interdendritic regions or near pain boundary continually changed with time at the bonding temperature. In the bonding temperature of 1403K, eutectic phases had not significantly changed, but η phases had transformed from platelet shape to needle morphology and PFZ region had widened with time. The interdendritic region and near pain boundary were liquated partially at 1423k and fully at 1453k by reaction of η phases and PFZ. In the bonding temperature of 1453K, interdendritic region and near pain boundary were liquated and then new phases which mixed with η phases, PFZ and MC carbide crystallized during cooling. Crystallized η phases transformed from rod shape to platelet shape with increasing holding time.

• Journal of Magnetics
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• v.19 no.3
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• pp.221-226
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• 2014

Significantly enhanced low-field magnetoresistance (LFMR) and maximum dMR/dH {$(dMR/dH)_{max}$} values were successfully achieved from $La_{0.7}Sr_{0.3}MnO_3$(LSMO)-manganese oxide composite samples prepared by liquid phase sintering, compared with those of the same composites prepared by solid state reaction. For this study, pure LSMO and LSMO-manganese oxide composites with various nominal compositions of (1-x)LSMO-$xMn_2O_3$ (x = 0.1, 0.2, 0.3, 0.4, and 0.8) were sintered at $1450^{\circ}C$, above the eutectic temperature of $1430^{\circ}C$, for 1 h in air. The highest LFMR value of 1.28% with the highest $(dMR/dH)_{max}$ value of 21.1% $kOe^{-1}$ was obtained from the composite sample with x = 0.3 at 290 K in 500 Oe. This enhancement of LFMR and $(dMR/dH)_{max}$ values is ascribed to efficient suppression of magnetic disorder at the LSMO grain boundary, by forming a characteristic LSMO-manganese eutectic structure.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.85-101
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• 1994

Effect of Cr, Cu and Ni metal powders addition on the alloyed layer of aluminum alloy (AC2B) has been investigated with the plasma transferred arc (PTA) overlaying process. The overlaying conditions were 125-200A in plasma arc current, 150mm/min in process speed and 5-20g/min in powder feeding rate. Main results obtained are summarized as follows: 1) It was made clear that formation of thick surface alloyed layer on aluminum alloy is possible by PTA overlaying process. 2) The range of optimum alloying conditions were much wider in case of Cu and Ni powder additions than the case of Cr powder addition judging from the surface appearance and the bead macrostructure. 3) Alloyed layer with Cu showed almost the homogeneous microstructure through the whole layer by eutectic reaction. alloyed layers with Cr and Ni showed needle-like and agglomerated microstructures, the structure of which has compound layer in upper zone of bead by peritectic and eutectic-peritectic reactions, respectively. 4) Microconstituents of the alloyed layer were analyzed as A1+CrA $l_{7}$ eutectics, C $r_{2}$al sub 11/, CrA $l_{4}$, C $r_{4}$A $l_{9}$ and C $r_{5}$A $l_{*}$ 8/ for Cr addition, Al+CuA $l_{2}$(.theta.) eutectics and .theta. for Cu addition, and Al+NiA $l_{3}$ eutectics. NiA $l_{3}$, N $i_{2}$A $l_{3}$ and NiAl for Ni addition. 5) Concerning defect of the alloyed layer, many blow holes were seen in Cr and Ni additions although there was lesser in Cu addition. Residual gas contents in blow hole for Cu and Ni alloyed layer were confirmed as mainly $H_{2}$ and a littie of $N_{2}$ Cracking was observed in compound zone of the alloyed layer in case of Cr and Ni addition but not in Cu alloyed layer.r.r.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• Nuclear Engineering and Technology
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• v.35 no.4
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• pp.356-368
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• 2003

Material properties such as coolant specific heat, film heat transfer coefficient, cladding thermal conductivity, surface diffusion coefficient of the multi-bubble are improved in MACSIS-Mod1. The axial power and flux profile module was also incorporated with irradiation history. The performance and feasibility of the updated driver fuel pin have been analyzed for nominal parameters based on the conceptual design for the KALIMER breakeven core by MACSIS-MOD1 code. The fuel slug centerline temperature takes the maximum at 700mm from the bottom of the slug in spite of the nearly symmetric axial power distribution. The cladding mid-wall and coolant temperatures take the maximum at the top of the pin. Temperature of the fuel slug surface over the entire irradiation life is much lower than the fuel-clad eutectic reaction temperature. The fission gas release of the driver fuel pin at the end of life is predicted to be $68.61\%$ and plenum pressure is too low to cause cladding yielding. The probability that the fuel pin would fail is estimated to be much less than that allowed in the design criteria. The maximum radial deformation of the fuel pin is $1.93\%$, satisfying the preliminary design criterion ($3\%$) for fuel pin deformation. Therefore the conceptual design parameters of the driver fuel pin for the KALIMER breakeven core are expected to satisfy the preliminary criteria on temperature, fluence limit, deformation limit etc.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.726-731
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• 2002

Reaction synthesis is a process to form ceramics, intermetallics and their composites from elemental powder mixture. Application of this process to a surface modification techniques has a possibilities to enable the process at a lower temperature or for a shorter time, although synthesized materials are likely to include voids and unreacted elements. This paper intend to examine the effect of Si addition to the mixture of Al and Ni on the densification of synthesized Ni-Al intermetallic compounds and to evaluate the surface properties of obtained coatings. By the Si addition, exothermic reaction temperature to form Ni-Al intermetallic was lowered to be below the melting point of Al. Si soluted $Al_3$Ni$_2$, $Al_3$Ni and $Al_{6}$Ni$_3$Si were mainly formed in the coating layer when powder mixture was heated to 973K for 300s. Besides, densification was enhanced by increasing hot press pressure, Si additions and heating rate. When the composition of eutectic Al-Si reaches 78%, void ratio of sintered compact reduced to 0.4%. It is caused by higher flowability of Al-Si liquid phase generated and its infiltration into the void. Since the hardness of NiAl(Si) compound (about 600HV) formed in the coating layer is higher than that of Ni-Al compound (about 400HV), coating layer with high density and superior wear property is obtained by hot press using reaction synthesis from Al-Ni-Si powder mixture.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.4
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• pp.113-119
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• 2013

The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magnesium alloy AZ31 with the aid of a pure Ni interlayer. A $13{\mu}m$ thick pure Ni foil was used in order to form a Mg-Ni eutectic liquid at the joint interface. The interface of reaction and composition profiles were investigated as a function of bonding time using a pressure of 0.16 MPa and a bonding temperature of $515^{\circ}C$. The quality of the joints produced was examined by metallurgical characterization and the joint microstructure developed across the diffusion bonds was related to changes in mechanical properties as a function of the bonding time.

• Journal of the Korean Ceramic Society
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• v.31 no.9
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• pp.957-968
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• 1994

Manufacturing process of porous glass by the filler method was studied. Commercial soda-lime-silicate glass powder was mixed with inorganic salt as the filler such as KCl, K2SO4, Na2SO4. Sintering shrinkages of mixed powders with the variation of sintering temperature were compared, and the effects of the fillers to shrinkages of mixed powder were increased in the order of Na2SO4${\mu}{\textrm}{m}$ of pore diameter were manufactured when the filler sizes 100~200 ${\mu}{\textrm}{m}$. The open pore volume of porous glass is determined by the quantity of filler and porous glasses having open pore volume between 30 and 70 vol% are available. Available sintering temperature range for preparation of porous glass is from the softening temperature of the glass powder to eutectic melting temperature of DTA curve of mixed powder.

• Journal of Powder Materials
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• v.11 no.1
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• pp.69-73
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• 2004

The sintering characteristics of commercial 7xxx series Al-Zn-Mg-Cu alloy have been investigated. Sintering system of this blended elemental powder has aspects of both transient and supersolidus liquid phase sintering. Transient liquids occur when the constitution point during sintering lies in a solid phase region but where the sintering temperature is greater than either the melting point of one of the constituent or a eutectic temperature. Supersolidus liquid phase sintering occurs when a preblended powder is heated to a temperature between the solidus and liquids. However, these reaction were restrained their inter diffusion due to the appearance of the oxide film. Thus, 7xxx series Al alloy is extremely sensitive to process variables, including particle size, holding time and sintering temperature. Therefore, above phenomenons were observed formation and behaviour of the liquid by using SEM and DSC.