• Restorative Dentistry and Endodontics
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• 제25권1호
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• pp.56-62
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• 2000

The purpose of this study was to assess the effects of restorative materials on the marginal leakage of wedge-shaped class V cavity. The study was performed in vitro in 25 defect-free permanent, extracted teeth. Wedge-shaped class V cavities were prepared and then the teeth were randomly selected and restored according to the following. Group A : restoration with Tetric Ceram(composite resin) Group B : restoration with Tetric flow(flowable resin) Group C : restoration with Compoglass after acid etching(compomer) Group D : restoration with Compoglass(compomer) Group E : restoration with Fuji II LC improved(resin-modified GIC) After thermocycling, the specimens were immersed in 5% basic fuchsin solution for 6 hours and sectioned longitudinally through the center of the restoration. The degree of marginal leakage was measured as the extent of dye penetration under the stereomicroscope. The data were analysed using one-way ANOVA. When significant differences found, multiple comparisons were made using Duncan's Multiple Range Test. The results were as follows: 1. The occlusal margins of all groups except for Fuji II LC improved showed lesser leakage than gingival margins and there was statistically significant difference(p<0.05). 2. At the occlusal margins, group A, B showed same marginal leakage scores, and others were decreased as group C, D, E in that order. There were statistically significant difference between group A, Band group D, E, group C and group E(p<0.05). 3. At the gingival margins, group B, C showed same marginal leakage scores, and others were decreased as group A, D, E in that order. But there was statistically significant difference between group B, C and group E(p<0.05). 4. In the Compoglass restoration, acid-etching technique was beneficial for marginal sealing ability at all of margins. But there was no statistically significant difference (p>0.05). In the restorations for wedge-shaped class V cavities, resin restoration with acid etching technique is recommended.

• Nuclear Engineering and Technology
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• 제50권3호
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• pp.432-438
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• 2018

The occurrence of saturation in the CR-39 detector reduces and limits its detection dynamic range; nevertheless, this range could be extended using spectroscopic techniques and by measuring the net bulk rate of the saturated CR-39 detector surface. CR-39 detectors were irradiated by 1.5 MeV high alpha-particle fluence varying from $0.06{\times}10^8$ to $7.36{\times}10^8\;alphas/cm^2$ from Am-241 source; thereafter, they were etched in a 6.25N NaOH solution at a temperature of $70^{\circ}C$ for different durations. Net bulk etch rate measurement of the 1.5 MeV alpha-irradiated CR-39 detector surface revealed that rate increases with increasing etching time and reaches its maximum value at the end of the alpha-particle range. It is also correlated with the alpha-particle fluence. The measurements of UV-Visible (UV-Vis) absorbance at 500 and 600 nm reveal that the absorbance is linearly correlated with the fluence of alpha particles at the etching times of 2 and 4 hour. For extended etching times of 6, 10, and 14.5 hour, the absorbance is saturated for fluence values of $4.05{\times}10^8$, $5.30{\times}10^8$, and $7.36{\times}10^8\;alphas/cm^2$. These new methods pave the way to extend the dynamic range of polymer-based solid state nuclear track detectors (SSNTDs) in measurement of high fluence of heavy ions as well as in radiation dosimetry.

• 한국전자통신학회논문지
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• 제14권5호
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• pp.871-876
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• 2019

본 논문에서는 플루오린화 수소산(Hydrofluoric acid: HF) 수용액과 광섬유에 인가된 $1.55{\mu}m$ 파장의 레이저를 통해 유도된 광열 효과를 이용하여 오목한 광섬유 팁을 제작하였다. 제작 과정에서 인가한 레이저의 세기, 식각 시간, HF 수용액의 농도에 따른 광섬유 팁 오목 면의 곡률 반경을 광학 현미경을 이용하여 측정하였으며 곡률 반경이 세 변인에 대하여 어떻게 변화하는지 분석하였다. 또한, Free Spectral Range(FSR)와 Scanning electron microscope(SEM) 촬영을 통해 현미경을 이용한 측정 방법의 신뢰성을 검증하였다. 본 논문을 통해 광섬유 팁의 오목 면 제작 과정에서 변인에 따라 곡률 반경을 조절할 수 있게 됨으로써 기존의 HF 수용액을 이용한 광섬유 식각 방법의 한계점을 극복할 수 있었다.

• 한국재료학회지
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• 제29권11호
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• pp.697-702
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• 2019

In this study, using a wet chemical process, we evaluate the effectiveness of different solution concentrations in removing layers from a solar cell, which is necessary for recovery of high-purity silicon. A 4-step wet etching process is applied to a 6-inch back surface field(BSF) solar cell. The metal electrode is removed in the first and second steps of the process, and the anti-reflection coating(ARC) is removed in the third step. In the fourth step, high purity silicon is recovered by simultaneously removing the emitter and the BSF layer from the solar cell. It is confirmed by inductively coupled plasma mass spectroscopy(ICP-MS) and secondary ion mass spectroscopy(SIMS) analyses that the effectiveness of layer removal increases with increasing chemical concentrations. The purity of silicon recovered through the process, using the optimal concentration for each process, is analyzed using inductively coupled plasma atomic emission spectroscopy(ICP-AES). In addition, the silicon wafer is recovered through optimum etching conditions for silicon recovery, and the solar cell is remanufactured using this recovered silicon wafer. The efficiency of the remanufactured solar cell is very similar to that of a commercial wafer-based solar cell, and sufficient for use in the PV industry.

• 한국전자통신학회논문지
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• 제17권6호
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• pp.1175-1180
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• 2022

STI는 반도체 소자의 소형화 및 고집적화에 따른 광역 평탄화를 위한 공정 기술로써 많은 연구가 이루어져 왔다. 본 연구에서는 STI의 profile 개선을 위한 방법으로 STI 건식각 후 HF 용액에 의한 pad oxide 습식각과 O₂+CF₄ 건식각을 제안하였다. 이 공정 기술은 기존의 방법보다 소자의 밀집도에 따른 패턴간의 프로파일 불균형과 누설전류의 개선을 나타내었다. 또한 동일한 STI 깊이와 HLD 증착를 갖는 디바이스에 대하여 CMP 후 HLD 두께를 측정한 결과 디바이스 밀도에 따라 측정값이 다르게 나타났고 이는 CMP 후 디바이스 밀도에 따른 질화막의 두께 차이 및 슬러리의 선택비에 기인됨을 확인하였다.

• 한국정보통신학회논문지
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• 제15권11호
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• pp.2439-2443
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• 2011

태양전지를 제작하는데 실리콘기판 표면에서의 광 흡수를 증가시키기 위한 표면조직화를 위해서 염기 용액을 이용한 습식방법을 이용하여 샘플을 제작하였다. 이렇게 준비된 염기성 에칭용액을 이용한 실리콘 웨이퍼의 표면 상태를 관찰하여 광학적 특성과의 연관성을 조사하였다. 표면조직화가 표면 전체적으로 고르게 이루어진 샘플에서 반사도가 낮았으며, 광학적 특성이 좋게 나타났다. 에칭이 과도하게 일어난 샘플에서는 오히려 반사도가 증가하여 광학적 특성이 떨어지는 것을 확인 하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.48.1-48.1
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• 2010

단결정 실리콘 태양전지 제조 공정이 진행되는 과정에서 각종 오염물에 의해 표면이 오염된다. 태양전지의 효율 개선을 위한 표면 texturing 공정은 주로 wet etch을 주로 사용한다. Wet etch 공정 시 주로 사용되는 KOH 용액은 texturing 후 실리콘 웨이퍼 표면에 K+ 이온을 남기고 이는 태양전지 표면에서의 불순물로 작용하여 효율을 저하시키는 요인이 된다. 이를 제거하기 위해 불산 및 오존에 의한 세정 공정이 추가로 필요로 하게 된다. 이러한 공정을 최소화 하며 잔존하는 알칼리 금속도 제거하기 위해, etchant로 알카리 용액이 아닌 ethylenediamine을 사용하여 texturing 후 KOH 용액과 비교해 보았다.

• 대한전자공학회논문지SD
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• 제42권1호
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• pp.19-24
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• 2005

본 논문에서는 압저항 효과를 이용한 Si 압력센서 제작을 최적화하였다. Si 압저항형 압력센서의 제작공정에 있어서 압저항과 알루미늄 회로 패턴 이후에 Si 이방성 식각을 통하여 수율이 개선되었다. 압저항의 위치와 공정 파라메터는 각각 ANSYS와 SUPREME 시뮬레이터를 이용하여 결정하였다. Boron-depth 프로파일 측정으로부터 p-형 Si 압저항의 두께를 측정한 결과 SUPREME 시뮬레이션으로부터 얻은 결과와 잘 부합하였다. 다이아프램을 위한 Si 이방성 식각 공정은 암모늄 첨가제 AP(Ammonium persulfate)를 TMAH(Tetra-methyl ammonium hydroxide) 용액에 첨가함으로써 최적화되었다.

• 한국전기전자재료학회논문지
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• 제27권7호
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• pp.448-451
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• 2014

Anodic aluminum oxides (AAO) fabricated by the two-step anodizing process have attracted much attention for the fabrication of nano template because of pore structure with high aspect ratio, low cost process and ease of fabrication. AAOs are characterized by a homogeneous morphology of parallel pores that grow perpendicular to the template surface with a narrow distribution of diameter, length and inter-pores spacing, all of which can be easily controlled by suitably choosing of the anodizing parameters such as pH of the electrolyte, anodizing voltage and duration of anodizing. In this study, AAO templates were characterized by X-ray diffraction and field-emission scanning electron microscope (FE-SEM). The dependence of the pore size change according to the amount of addition of phosphoric acid, which was used to remove the initial alumina oxide layer, was not observed.

• 한국전기전자재료학회논문지
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• 제13권12호
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• pp.1063-1068
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• 2000

Water treeing in underground distribution power cable is not easy to observe by nondestructive method and it has very complex patterns. This study describes the principles and practices of a continuous observation of initiation and growth of tree in polymeric insulation material using an image measurement technique. Using this technique we could observe water tree and the growing process of electrical tree due to the water tree and the growing process of electrical tree due to the water tree. All of these growing process is analyzed quantitatively by image measurement program composed of borland c++. We fabricated the thin film type specimen to observe water tree easier and also the needle electrode was prepared by etching method using electrolytes. Initiation and the growth of three was observed somewhat different depending on the applied voltage and the water electrode. AgNO$_3$solution electrode accelerates the initiation and the growth of water tree, compared to those of distilled water electrode. The water and the electrical tree occurred by water tree has discontinuous growth characteristic.