• Clean Technology
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• v.25 no.1
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• pp.14-18
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• 2019

In general after the etching process, waste etching solution contains metals. (ex. Nickel (Ni), Chromium (Cr), Zinc (Zn), etc.) In this work, we proposed a recycling process for waste etching solution and refining from waste liquid contained nickel to make nickel metal nano powder. At first, the neutralization agent was experimentally selected through the hydrolysis of impurities such as iron by adjusting the pH. We selected sodium hydroxide solution as a neutralizing agent, and removed impurities such as iron by pH = 4. And then, metal ions (ex. Manganese (Mn) and Zinc (Zn), etc.) remain as impurities were refined by D2EHPA (Di-(2-ethylhexyl) phosphoric acid). The nickel powders were synthesized by liquid phase reduction method with hydrazine ($N_2H_4$) and sodium hydroxide (NaOH). The resulting nickel chloride solution and nickel metal powder has high purity ( > 99%). The purity of nickel chloride solution and nickel nano powders were measured by EDTA (ethylenediaminetetraacetic) titration method with ICP-OES (inductively coupled plasma optical emission spectrometer). FE-SEM (field emission scanning electron microscopy) was used to investigate the morphology, particle size and crystal structure of the nickel metal nano powder. The structural properties of the nickel nano powder were characterized by XRD (X-ray diffraction) and TEM (transmission electron microscopy).

• Resources Recycling
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• v.31 no.4
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• pp.34-39
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• 2022

In this study, effects of ultrasonic energy on the cementation reaction and copper recovery rate were investigated for different types of iron samples, such as plate, chip, and powder, for recovering copper from waste etchant, which contained ~3.5% copper. The cementation reaction using the ultrasonic energy was more effective than the simple stirring reaction, with the former exhibiting a high copper recovery rate than the latter for the same time interval. When cementation was performed for 25 min with ultrasonic treatment, rather than simple stirring, the copper recovery rate of the plate, chip, and powder improved from 7.0% to 12.0%, 14.0% to 46.1%, and 41.9% to 77.2%, respectively. Therefore, the use of ultrasonic energy could detach the copper recovered by the cementation reaction from the surface of the iron samples, thereby increasing the copper recovery rate. Owing to the use of ultrasonic energy, the copper recovery rate increased by 2-6 times, and the recovered copper exhibited a decreased particle size compared to that obtained via simple stirring.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.1
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• pp.21-29
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• 2024

In this study, EMC(Epoxy molding compound) waste from the semiconductor molding process is recycled and synthesized into silica nanoparticles, which are then applied as abrasive materials contains CMP(Chemical mechanical polishing) slurry. Specifically, silanol precursor is extracted from EMC waste according to the ultra-sonication method, which provides heat and energy, using ammonia solution as an etchant. By employing as-extracted silanol via a facile sol-gel process, uniform silica nanoparticles(e-SiO₂, experimentally synthesized SiO₂) with a size of ca. 100nm are successfully synthesized. Through physical and chemical analysis, it was confirmed that e-SiO₂ has similar properties compared to commercially available SiO₂(c-SiO₂, commercially SiO₂). For practical CMP applications, CMP slurry is prepared using e-SiO₂ as an abrasive and tested by polishing a semiconductor chip. As a result, the scratches that are roughly on the surface of the chip are successfully removed and turned into a smooth surface. Hence, the results present a recycling method of EMC waste into silica nanoparticles and the application to high-quality CMP slurry for the polishing process in semiconductor packaging.

• The korean journal of orthodontics
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• v.34 no.4 s.105
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• pp.325-332
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• 2004

A self-etching primer that combines the etchant and primer in one chemical compound saves time and should be mote cost-effective to the clinician and patient. The purpose of this study was to evaluate the clinical effectiveness of a self-etching primer by measuring shear bond strengths according to various conditions and observing adhesive failure patterns. For this Investigation, 120 upper and lower premolars extracted for orthodontic purposes were used and randomly divided into six groups of twenty teeth each. Human premolars were embedded in a metal cylinder with orthodontic resin. Metal brackets and ceramic brackets were bonded with XT primer and self-etching primer by means of XT adhesive. Upon curing, plasma arc light and visible light were used. After bonding, the shear bond strength was tested by Instron universal testing machine, and the amount of residual adhesive that remained on the tooth after debonding was measured by stereoscope and assessed with an adhesive remnant index. The results were as fellows: 1. When brackets were bonded, if other conditions remained the same, there was no significant difference in shear bond strength due to the type of primer - either self-etching primer or XT primer. 2. When metal brackets were bonded, there was no significant difference in shear bond strength according to the source of light - plasma arc light or visible light - and type of primer. 3. There was a very significant difference in shear bond strength according to the type of brackets - metal or ceramic brackets. The shear bond strength of ceramic brackets was stronger than metal brackets. 4. When the adhesive failure patterns of metal brackets bonded with self-etching primer were observed by using the adhesive remnant index, the bond failure of the metal bracket occurred more frequently at the bracket-adhesive. The failure of the ceramic bracket, however, occurred more frequently at the enamel-adhesive interface. The adhesive failure patterns of metal brackets bonded with XT primer observed the same patterns. The above results suggest that self-etching primer can be clinically useful for bonding the brackets without fear of a decrease in shear bond strength.

• The korean journal of orthodontics
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• v.26 no.5 s.58
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• pp.497-507
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• 1996

The aim of present study in vitro was to evaluate and compare the effects of different washing times of enamels etched with low phosphoric acid solution which makes unsoluble salts and etched but contaminated with saliva on shear bond strength of an orthodontic adhesive to enamel, and to observe the washing effect on the etched enamel surface by scanning electron microscope. All brackets were bonded with Mono-$Lok2^{TM)}$) on the labial surface of extracted human bicuspids after etching with $20w/w\%\;and\;37w/w$ and phosphoric acid solution for 60seconds and then washing for 0,5,10 and 20seconds respectedly. After etching with $37w/w\%$ phosphoric acid solution and contaminating with saliva for 30seconds and then washing for 0,5,20 and 30seconds and re-etching for 10seconds. After 24hours passed in the $37^{\circ}C$ water bath, the shear bond strengths were measured on Universal Test Machine. The data were evaluated and tested by ANOVA and Duncan's multiple range test, and those results were as follows. 1. There was no significant differences between (p>0.05) shear bond strength of bonded brackets with 5, 10, 20seconds washing etched enamel using $37{\%}w/w{\%}$ phosphoric acid solution. 2. The shear bond strength of bonded brackets with $20w/w\%$ phosphoric acid and then washing for 5seconds showed bonded strength durable to occlusal force but its coefficiency score was high and etched surface was not cleaned completely and therefore it was assumed that its clinical application is not applicable. 3. There was no significant differences between (p>0.05) shear bond strengths of bonded brckets with washing for 5seconds etched enamel using $37w/w\%$ phosphoric acid solution and 10,20 seconds washing etched enamel using $20w/w\%$ phosphoric acid solution. 4. The shear bond strength of washing for 5seconds etched enamel which was contaminated with saliva showed sufficient bonded strength durable to occlusal force but its coefficiency score was high and therefore its clinical application was not applicable. 5. After etching, the sample contaminated with saliva showed the sufficient shear bond strength even washing 20seconds without re-etching.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.