• Applied Chemistry for Engineering
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• v.10 no.5
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• pp.701-706
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• 1999

The effect of siloxane oligomer content on thermal stability and internal stress of DGEBA epoxy resin was investigated. Siloxane-epoxy polymers having terminal epoxy group were prepared by reaction of siloxane-DDM prepolymer with DGEBA epoxy resin. Thermal stability was studied in terms of the initial decomposition temperature(IDT), temperature of maximum rate of weight loss($T_{max}$), integral procedural decomposition temperature(IPDT), and decomposition activation energy($E_t$) using TGA data. The thermal stability increased with increasing the siloxane oligomer content and showed a maximum value in the case of 5 wt% siloxane oligomer content in the blend system. While, the coefficient of thermal expansion(${\alpha}_r$) and the flexural modulus($E_r$) allowed us to study internal stress of the blend system. As the content of siloxane oligomer increases, the internal stress systematically decreases as decreasing both ${\alpha}_r$ and $E_r$.

• Macromolecular Research
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• v.14 no.6
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• pp.610-616
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• 2006

An azoinitiator linked to an epoxy oligomer, which could easily diffuse into the organoclay gallery and swell it, was used as an initiator to enhance the delamination of an organoclay, Cloisite 25A, in a matrix of styrenic polymers, poly(styrene-co-acrylonitrile) and polystyrene, during the preparation of a nanocomposite via an in-situ polymerization method. X-ray diffraction results and transmission electron microscopic observation of the morphology showed that the epoxy segment enhanced not only the delamination but also the extrication of ammonium cations from the organoclay gallery into the polymer matrix. The latter phenomenon induced the structural change of the alkyl group of ammonium cations in the gallery from a bilayer to monolayer structure, and also decreased the glass-rubber transition temperature as measured by a differential scanning calorimeter and dynamic mechanical analyzer.

• Journal of Adhesion and Interface
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• v.10 no.2
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• pp.98-105
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• 2009

Poly(amic acid) was synthesized from the reaction of p-PDA/ODA and PMDA/BPDA and silane oligomer containing epoxy group was also synthesized from the reaction of tetramethylorthosilicate (TMOS) and glycidol. After hybridizing poly (amic acid) and silane oligomer, they were effectively converted into polyimide/silica hybrid films by thermal imidization process. As the silica contents in hybrid films increased, CTE values decreased from 17 ppm/K to 10 ppm/K and the tensile modulus increased, in spite of decreasing tensile strength. In addition, the peel test showed that the adhesion strength of hybrid film was enhanced from $0.43kg_f/cm$ to $1.02kg_f/cm$. Therefore, it could be concluded that the polyimide/silica hybrid film is effective to enhance adhesion strength for FCCL films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.228-229
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• 2006

본 연구에서는 PCB에 적용하기 위한 폴리머 타입 후막저항의 하나로서, 포토공정으로 저항 패턴의 형성이 가능한 페이스트를 제조하였다. 기존의 폴리머 후막저항은 스크린 인쇄를 패터닝의 주요 방법으로 하고 있어 패턴의 정밀성이 떨어지는 단점이 있었다. 이를 개선하여 고정밀 저항 패턴의 형성이 가능하도록 Photoimageable Resin을 저항 페이스트의 개발에 도입하였다. Acrylated oligomer 및 monomer, 그리고 Novolac Epoxy를 주 기지상 재료로서 사용하였으며, acrylate와 epoxy의 함량비에 따른 저항 페이스트의 현상성 및 시트저항을 평가하였다. 전도성 Filler 재료로 카본블랙을 이용하였는데, 그 물리적 특성차와 함량이 저항 페이스트의 현상성과 저항값에 미치는 영향을 평가하였다. 실험결과 Acrylate와 epoxy의 비가 2.5:1일 때 현상성이 가장 양호하였으며, 이 조성에 XC72R 카본블랙을 2g 첨가하였을 때 시트저항의 평균값은 약 $6\;k{\Omega}\{\square}$였다.

• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.587-592
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• 2002

Photocrosslinkable chalcone-epoxy compound comprising 1,3-bis-(4-hydroxy-phenyl)-propenone was synthe-sized for fabricating the photo-alignment layer of liquid crystals. Chalcone group was introduced into the main chain unit of the epoxy oligomer. We observed a photodimerization behavior and an optical anisotropy of this material by irradiation of a linearly polarized UV(LP-UV) light. With a trace amount of cationic photoinitiator (TRS-HFA), polymerization of epoxy groups was also conducted at the similar wavelength range used for photodimerization. Linearly polarized UV irradiation on the chalcone-epoxy films with cationic photoinitiator induced optical anisotropy of the film and the resultant film can be used for alignment layers for low molecular weight nematic liquid crystals.

• Applied Chemistry for Engineering
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• v.23 no.2
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• pp.157-163
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• 2012

Using six kinds of epoxy acrylates and a conductive carbon black, photosensitive resistor pastes were fabricated and then their developability in alkaline aqueous solution and the resistance values after thermal curing were evaluated. In order to impart the photocurability by UV exposure and the developability on alkaline solution, epoxy acrylate oligomers with carboxyl group, acrylate monomers, a photoinitiator and so forth were used. In addition, an organic peroxide was added into the paste to get a thermally curable composition. As a result, some of the pastes were not developed depending on the kinds of oligomers and, in the developed pastes, the measured resistance showed the different values depending on their compositions, even though they contain the same amount of carbon black. Finally, the optimum oligomer was selected and then, by adjusting the amount of carbon black, the kind of monomer and the curing temperature, the photosensitive resistor paste composition which showed the sheet resistance of about 0.5 $k{\Omega}/sq.$ could be obtained.

• Composites Research
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• v.37 no.3
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• pp.215-218
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• 2024

Liquid crystalline thermosetting epoxy oligomer DD-A was synthesized with Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene (DGE-DHMS) and aniline in a ratio of 2:1 and cured with a catalytic curing agent, 1-Methyl Imidazole. The gelation times and vitrification times were measured to create Time-Temperature-Transition Diagrams with liquid crystalline phase changes. It was found that the gelation and vitrification times were decreased as the concentration of curing agent increased, and the vitrification curve showing a typical S-shape was confirmed.

• Textile Coloration and Finishing
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• v.29 no.1
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.301-304
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• 2012

Epoxy/microsilica (65 phr)/nanosilica (0~5 phr) composites (EMNC) were prepared in order to develop a high-voltage insulation material, where phr means parts per hundred relative to the epoxy oligomer. Tensile and flexural tests of the composites were carried out, and the AC electrical breakdown strength was measured, after which all the data were estimated by Weibull statistical analysis. As the nanosilica content increased, the tensile strength increased, and the highest value was 117.7 MPa in the EMNC system with 3 phr nanosilica, which was ca. 10% higher than that of the system without nanosilica. The value then decreased after 3 phr. The flexural strength and AC electrical breakdown strength showed the same tendencies as the tensile strength. The highest value of the flexural strength was 184.6 MPa in the EMNC system with 3 phr of nanosilica, which was ca. 15% higher than that of the system without nanosilica. The strongest value of the AC electrical breakdown strength was 79.0 kV/0.5 mm in the EMNC system with 3 phr of nanosilica, which was ca. 34% higher than that of the system without nanosilica.

• Applied Chemistry for Engineering
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• v.24 no.5
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• pp.499-506
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• 2013

As the usuage of tempered glass for touch panel increased rapidly with the development of industry, the amount of UV curable coating solution used to protect glass surfaces during a tempered glass manufacturing process increased as well. The UV curable coating has advantages compared to thermal curing such as shortened curing time and non-solvent. Appropriated polymer and monomer were used as an acid polymer to grant an alkali peeling ability. The monomers were 2-hydroxyl methylacrylate, 1,6-hexanediol diacrylate and dipentaerythritol hexaacrylate which have acryl groups of 1, 2, and 6, respectively. The combination of three different types of photoinhibitors were used and bisphenol A epoxy diacrylate was used as an oligomer. In this study, experiments were carried out by controlling the amount of photoinitiator, oligomer, and additive while maintaining the constant content of the acid polymer and the acrylic monomer. The changes in physical properties according to the additive content were investigated. It was found that the combination of photoinitiators was necessary to achieve the hardness above 4H and it was possible to control the delamination type of the coating film from a sheet to pieces by the addition of TPO as an initiator. The increase in oligomer contents increased the hardness and adhesiveness alongside dissection time. Talc content of 20 wt% showed the best results.