• Title/Summary/Keyword: epoxy bonding

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Tribological Property of Surface Modified Carbon Nanotube Reinforced Polymer Matrix Composites (표면 개질화된 탄소나노튜브 강화 고분자 복합재료의 마모 특성)

  • Park, Joo-Hyuk;Abu Bakar, Sulong
    • Tribology and Lubricants
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    • v.21 no.6
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    • pp.302-305
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    • 2005
  • Various carbon nanotubes (CNTs) are added into the epoxy matrix as reinforcements to investigate the effect on the wear behavior. Effects to the tribological properties of different loading concentrations and types of surface modification are investigated by using a linear reciprocal wear tester. As increasing the concentration of CNTs shows the reduction of the wear loss. Moreover, surface modified CNTs give better tribological property than as produced CNTs. It is due that the functional groups on the surface of CNTs increase the interfacial bonding between CNTs and epoxy matrix through chemical bonding. Changes in worn surface morphology are observed by optical microscope and SEM to investigate the wear behavior. CNTs in the epoxy matrix near the surface are exposed and it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the CNTs.

Influence of Allylamine Plasma Treatment Time on the Mechanical Properties of VGCF/Epoxy

  • Khuyen, Nguyen Quang;Kim, Jin-Bong;Kim, Byung-Sun;Lee, Soo
    • Advanced Composite Materials
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    • v.18 no.3
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    • pp.221-232
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    • 2009
  • The allylamine plasma treatment is used to modify the surface properties of vapor grown carbon fibers (VGCF). It is to improve the interfacial bonding between the VGCF and epoxy matrix. The allylamine plasma process was performed by batch process in a vacuum chamber, using gas injection followed by plasma discharge for the durations of 20, 40 and 60 min. The interdependence of mechanical properties on the VGCF contents, treatment time and interfacial bonding between VGCF/ep was investigated. The interfacial bonding between VGCF and epoxy matrix was observed by scanning electron microscopy (SEM) micrographs of nanocomposites fracture surfaces. The changes in the mechanical properties of VGCF/ep, such as the tensile modulus and strength were discussed. The mechanical properties of allylamine plasma treated (AAPT) VGCF/ep were compared with those of raw VGCF/ep. The tensile strength and modulus of allyamine plasma treated VGCF40 (40 min treatment)/ep demonstrated a higher value than those of other samples. The mechanical properties were increased with the allyamine plasma treatment due to the improved adhesion at VGCF/ep interface. The modification of the carbon nanofibers surface was observed by transmission electron microscopy (TEM). SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

Effect of Atmospheric Plasma Treatments on Mechanical Properties of VGCF/Epoxy

  • Khuyen, Nguyen Quang;Kim, Jin-Bong;Kim, Byung-Sun;Lee, Soo
    • Advanced Composite Materials
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    • v.17 no.2
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    • pp.167-175
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    • 2008
  • Vapor grown carbon fibers (VGCF) were treated with atmospheric plasma enhancing the surface area in order to improve the bonding to the matrix in epoxy composites. The changes in the mechanical properties of VGCF/epoxy nanocompostes, such as tensile modulus and tensile strength were investigated in this study. VGCF with and without atmospheric plasma treatment for surface modification were used in this investigation. The interdependence of these properties on the VGCF contents and interfacial bonding between VGCF/epoxy matrix were discussed. The mechanical properties of atmospheric plasma treated (APT) VGCF/epoxy were compared with raw VGCF/epoxy. The tensile strength of APT VGCF/epoxy nanocomposites showed higher value than that of raw VGCF. The tensile strength was increased with atmospheric plasma treatment, due to better adhesion at VGCF/epoxy interface. The tensile modulus of raw VGCF and APT VGCF/epoxy matrix were of the similar value. The dispersion of the VGCF was investigated by scanning electron microscopy (SEM), SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

Enhancing Structural Integrity of Composite Sandwich Beams Using Viscoelastic Bonding with Tapered Epoxy Reinforcement

  • Rajesh Lalsing Shirale;Surekha Anil Bhalchandra
    • Korean Journal of Materials Research
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    • v.34 no.3
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    • pp.125-137
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    • 2024
  • Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

EXPERIMENTAL STUDY ON PROBABILITY OF STRENGTH FOR EPOXY ADHESIVE-BONDED METALS

  • Seo, Do-Won;Lim, Jae-Kyoo;Jeon, Yang-Bae;Yoon, Ho-Cheol
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.688-693
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    • 2002
  • Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

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Bonding Properties of Epoxy-Concrete Interface in RC Beams Strengthened by Steel Plate (강판으로 보강된 RC보의 에폭시-콘크리트 계면의 부착특성)

  • 박윤제;신동혁;이광명;신현목
    • Journal of the Korea Concrete Institute
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    • v.13 no.3
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    • pp.221-227
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    • 2001
  • Both strength and stiffness of RC structures strengthened by a steel plate greatly increase and however, their ductility might not be sufficient because premature failures usually occur at the adhesive-concrete interface. In this study, Mohr-Coulomb criterion was adopted to examine the bonding failure mechanism, and the diagonal shear bonding test, the direct shear bonding test, and the flexural test on RC beams strengthened by a steel plate were carried out to measure the bonding properties. It is found from the experimental and numerical results that the cohesive strengths of epoxy-concrete interfaces are ranging from 50 kgf/㎠ to 70 kgf/㎠ when the friction angle is 45°. Bonding failure loads can be predicted by applying the bonding properties to the structural analysis of RC beams strengthened by steel plate. By considering them in the design of strengthened beams, the premature failure would be effectively prevented.

Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging (반도체 패키징용 에폭시 기반 접합 소재 및 공정 기술 동향)

  • Eom, Y.S.;Choi, K.S.;Choi, G.M.;Jang, K.S.;Joo, J.H.;Lee, C.M.;Moon, S.H.;Moon, J.T.
    • Electronics and Telecommunications Trends
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    • v.35 no.4
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    • pp.1-10
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    • 2020
  • Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

Performance Improvement of Thin Pavement Layer using Epoxy and Ceramics Composite Materials (에폭시와 세라믹스를 결합한 혼합물 이용 박층 포장공법의 성능개선)

  • Kim, Wan-Sang;Kim, Nak-Seok
    • Journal of the Korean Society of Hazard Mitigation
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    • v.8 no.5
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    • pp.65-70
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    • 2008
  • Asphalt concrete pavements are susceptible to deformation and failure compared to cement concrete pavements. Epoxy is commonly used to enhance the bonding and durability of structures. Based on this concept, an epoxy and ceramics combined mixture was developed and applied to the field to estimate the pavement performance, Laboratory and field performance tests were conducted to observe the applicability of epoxy and ceramics composite materials compared to the conventional one. In this research, the epoxy and ceramics composite mixturewas used in two ways. 7 mm and 15 mm of thin surface layers using the mixture were constructed on cement and asphalt concrete pavements, respectively, after surface treatment. 12 months of field performance surveys were conducted to observe the resistances to the crack and deformation. According to the field performance tests, epoxy and ceramics combined mixture showed better bonding and field performances than the conventional one.

Application of the Infusion Method to the Repair of Damage in Wind Turbine Blades (진공성형 공법을 이용한 풍력발전기 블레이드의 수리)

  • Lee, Kwangju;Jang, Han Seul;Seon, Seokwoon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.8
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    • pp.4756-4762
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    • 2014
  • Damaged wind turbine blades are repaired conventionally using a hand lay-up method with epoxy, where the bonding strength is not high. Epoxy has poor curing characteristics at low temperatures. The infusion method with polyester was proposed. Infusion method is believed to distribute resin uniformly. Polyester is used because it hardens better than epoxy at low temperatures. At room temperature, the proposed method increased the bonding strength by 77.7% compared to the conventional method. Using the proposed method at 15 and $5^{\circ}C$, the bonding strength increased compared to the conventional method. This paper proposes a new method for repairing wind turbine blades, even at temperatures where the conventional method cannot be used because epoxy resin does not harden. The bonding strength of the proposed method at low temperatures is higher than that of the conventional method at room temperature.

Synthesis of Poly(epoxy-imide)-Nano Silica Hybrid Film via CS Sol-gel Process and Their Dielectric Properties (CS졸을 이용한 Poly(epoxy-imide)-나노 Silica 하이브리드 필름의 합성과 유전특성)

  • Han, Se-Won;Han, Dong-Hee;Kang, Dong-Pil;Kang, Young-Taec
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.1
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    • pp.35-40
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    • 2007
  • The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.