• Journal of the Korean Applied Science and Technology
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• v.28 no.1
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• pp.35-47
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• 2011

For the synthesis of water soluble acrylic modified epoxyester resin, fatty acid/epoxy ratio of 50/50 was used, and introduced maleic anhydride. Ratio of styrene/acrylic acid of acrylic monomers was fixed 85/15 and ratio of epoxyester/acrylic monomer was controlled 80/20, 75/25, 70/30, 65/35, and degree of neutralization were changed 65%, 80%, to 100%. As a result, 40% solids acrylic modified epoxyester resins were synthesized. Resins were evaluated water soluble stability, drying time, water resistant, storage stability and physical properties. And the white paints were prepared, and were evaluated viscosity, drying time, water resistance, adhesion, sagging, spray workability, gloss, salt spray resistance, skinning, whiteness and flash rust. As a result, the degree of neutralization of 100% and the ratio of epoxyester/acrylic monomer of 75/25 showed the best properties.

• ETRI Journal
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• v.38 no.6
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• pp.1179-1189
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• 2016

A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.