• Elastomers and Composites
• /
• v.50 no.2
• /
• pp.103-109
• /
• 2015

In this study, epoxy/anhydride mixing ratio for the highly silica filled compounds with chromium (III) octoate catalyst was investigated at a low curing temperature ($71^{\circ}C$ for 40 hr) by evaluating the compressive strength with the weight ratio ranges from 0.3/1.0 to 1.0/1.0 of epoxy part (Part A)/anhydride part (Part B). In case of epoxy/anhydride compounds used surface unmodified silica by coupling agent, these compounds need excess anhydride unlike the weight ratio in the conventional epoxy/anhydride compounds. In curing behavior, the epoxy/anhydride compounds containing chromium (III) octoate showed high conversions at $71^{\circ}C$ for 40 hr, even if a dipropylene glycol (DPG) was not used as a polymerization initiator. Also, DPG leads to a poor epoxy network structure. In conclusion, the appropriate weight ratio of Part A/Part B of highly silica filled epoxy/anhydride compounds with chromium (III) octoate catalyst is 0.5/1.0 and the maximum amounts of silica is 1470 phr of epoxy resin.

• Journal of Adhesion and Interface
• /
• v.10 no.3
• /
• pp.117-126
• /
• 2009

Epoxy/anhydride systems with silica filler were studied to improve the cure behavior and characteristics. To study the curing process of epoxy/anhydride using DSC and a stress rheometer, it was observed that gelation temperature increased by increasing the thermal rate or in high isothermal conditions, while it was observed that the degree of cure at gelation decreased. Thermal stability of the epoxy/anhydride system showed any increment by increasing silica contents, except slight decrease of weight by containing humidity. The epoxy resin cured with 30% of silica filler decreased coefficient thermal expansion (CTE) about 33% to show $40ppm/^{\circ}C$. Specimens filled with 30 wt% of silica showed 60% increase in storage modulus at $30^{\circ}C$ to show 3909 MPa compared with neat resin to 2,377 MPa. Epoxy/anhydride systems with surface treated silica by silane coupling agent decreased storage modulus.

• Elastomers and Composites
• /
• v.49 no.1
• /
• pp.59-65
• /
• 2014

In this study, in order to complete curing reaction of the molding compound comprising an epoxy/anhydride at $71^{\circ}C$ for 40 hours, metal coordination complexes such as cobalt (II) acetylacetonate, potassium acetylacetonate, iron (III) acetylacetonate and chromium (III) octoate as a catalyst were applied to the epoxy/anhydride compounds respectively. The weight ratio of an epoxy part/an anhydride part was adjusted to improve the mechanical properties of the molding compound. According to the experimental results, an epoxy/anhydride compound containing chromium (III) octoate showed a high conversion at $71^{\circ}C$ for 40 hours as well as a proper processability at room temperature among the several metal coordination complexes. For the mechanical properties of the cured epoxy/anhydride compound, the compounds containing weight ratio from 0.9/1 to 0.5/1 of the epoxy part/anhydride part with chromium (III) octoate showed the high flexural strength, and higher compressive strength was shown with increasing of the hardener part.

• Macromolecular Research
• /
• v.10 no.5
• /
• pp.259-265
• /
• 2002

The cure kinetics of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer, poly(dimmer acid-co-alkyl polyamine), were studied using differential scanning calorimetry (DSC) under isothermal condition. On increasing the amount of polyamide copolymer in the blends, the reaction rate was increased and the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/(polyamide copolymer) blends indicate that polyamide hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m, for the initial autocatalytic reaction was not affected by blending polyamide copolymer with epoxy resin, and the value was approximately 1.3, whereas the reaction order, n, for the general n-th order of reaction was increased by increasing the amount of polyamide copolymer in the blends, and the value increased from 1.6 to 4.0. A diffusion-controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/(polyamide copolymer) blends. Complete miscibility was observed in the uncured blends of epoxy/(polyamide copolymer) up to 120 $^{\circ}C$, but phase separations occurred in the early stages of the curing process at higher temperatures than 120 "C. During the curing process, the cure reaction involving the functional group in polyamide copolymer was detected on a DSC thermogram.gram.

• Polymer(Korea)
• /
• v.28 no.6
• /
• pp.531-537
• /
• 2004

Various half-ester acrylates were prepared from anhydrides and 2-hydroxyethyl acrylate. Photocurable epoxy modified acrylates were prepared from synthesized half-ester acrylate and neopentylglycol diglycidylether. Physical properties such as hardness, yellowing, tensile strength and elongation were tested and compared as the structure of oligomer in cured-film differs. It was found that viscosity of neopentylglycol diglycidylether-hexahydrophthalic anhydride (NP-HA) was highest. Hardness and tensile strength of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride were better than those of other photocrosslinted epoxy acrylates. And 5% weight loss temperature of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride was higher than those of other photocrosslinked epoxy acrylates. Value of yellow index of photocrosslinked neopentylglycol diglycidyl ether-succinic anhydride (NP-SA) was lower than the other products.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.10a
• /
• pp.703-704
• /
• 2009

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.10a
• /
• pp.237-240
• /
• 2002

Amino terminated polyetherimide(ATPEI) has been synthesized by bisphthalic anhydride arid m-phenylenediamine, after that characterized by differential scanning calorimetry(DSC), thermogravimetric analyzer(TGA). Fourier transform (FT-IR) spectroscopy and gel permeation chromatography(GPC). ATPEI was blend to improve the toughness of bisphenol-A type epoxy resin which was cured by nadic methyl anhydride(NMA). The fracture toughness and the molphology of the toughened epoxy resin was evaluated. The toughness of ATPEI modified epoxy resin was higher than that of the PEI modified epoxy resin. In addtion, carbon fiber/ATPEI modified epoxy resin composites were fabricated and the mechanical properties of the resulted composites were investigated.

• Electrical & Electronic Materials
• /
• v.7 no.3
• /
• pp.187-199
• /
• 1994

In order to find an effect of structural changes due to variation of addition ratio of anhydride hardener and postcuring herat-treatments upon electrical properties of epoxy composites, the dielectric properties over a frequency range from 30[Hz] to l[MHz] were investigated in the temperature range of 20-180[.deg. C]. From the dielectric properties, the a peaks related with glass-transition phenomena of epoxy network appeared near 130[.deg. C], the conduction loss in high temperature region above 150[.deg. C] due to thermal dissociation of hardener started off with the low frequency side and the .betha. peak concerned with contribution of movable unreacted terminal epoxy groups and curing agents in the glass states concurred with the high-frequency side below 20[.deg. C]. And an effect of an hydride hardener upon structural changes and of postcuring heat treatments upon structural stability in epoxy composites would be explained through the estimation of the distribution of relaxation times and the activation energy for a .alpha. peak according to the WLF equations.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.05a
• /
• pp.147-150
• /
• 2002

The cure kinetics of blends of epoxy (DGEBA:diglycidyl ether of bisphenol A)/anhydride (NMA:nadic methyl anhydride) resin with synthesized amino terminated polyetherimide (AT-PEI) were studied using differential scanning calorimetry (DSC) and Dynamic Mechanical Analysizer(DMA) under isothermal condition to determine the reaction parameters and gel-vitrification behavior. The fracture toughness of AT-PEI 20phr/epoxy resin system was improved over 224% and 42.5% more than neat epoxy resin and commercial PEI/Epoxy Resin System.

• Polymer(Korea)
• /
• v.26 no.4
• /
• pp.501-507
• /
• 2002

In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature ($T_g$) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) at curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy ($E_a$) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas $T_g$, initial decomposed temperature (IDT), and decomposition activation energy ($E_t$) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.