• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Magazine of the Korean Society of Agricultural Engineers
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• v.15 no.3
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• pp.3053-3058
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• 1973

1. This study was conducted to examine the effects of change of the short range nozzle hole on the travelling distance. The results of this study are summarized as follows; a) Effect of change of the cap hole diameter on the travelling distance of sprayed particles was generally a linear, the increasing rate was about 0.27. b) When the difference between the sectional area of cap hole and that of grooves of swirl plate, was small the travelling distance was decreased by the decreasing of spraying speed at cap hole. 2. This study was conducted to examine the effects of change of the short range nozzle hole on the size of spraying particles. The results of this study are summarized as follows; a) The diameter of sprayed particles on travelling distances in the short range nozzle did not coincide with the kinetic energy principle derived from the momentum and the resistance. b) The average diameter of sprayed particle between 1m and 3m in which amount of sprayed particle was particularly a great deal, was big, because that some of sprayed particles were absorbed each other on the way to fall c) Effect of increase of cap hole diameter was generally enlarged the average diameter of sprayed particle with small rate.

• Progress in Superconductivity
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• v.12 no.1
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• pp.12-16
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• 2010

We have measured the trapped field of YBCO bulk with different configuration by applying the magnetic field of $Nb_3Sn$ superconducting magnet. Initially the circular type of YBCO bulk superconductor was prepared and then hole, parallel to the c-axis and located at the center of bulk was mechanically drilled. The YBCO bulk with hole was filled with resin. Typical size of hole in YBCO bulk was 10 mm in diameter. Trapped field characteristics were compared with different specimen conditions. Our preliminary result indicates the increment rate of trapped field, 0.232 kG, measured on the YBCO without hole was much higher than that, 0.011 kG, measured on YBCO with hole.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.90-90
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• 2012

The electron/hole injections in organic electronic devices have long been an issue due to the large energy level mismatches between electrode and organic layer. To utilize the organic materials in electronic devices, functional thin layers have been used, which reduce the electron/hole injection barrier from electrode to organic material. Typically, inorganic compounds and organic molecules are used as an electron and hole injection layer, respectively. Recently, CsN3 and 1,4,5,8,- naphthalene-tetracarboxylic-dianhydride (NTCDA) are reported as a potential electron and hole injection layers. CsN3 shows unique properties that it breaks into Cs and N and thus Cs can dope organic layer into n-type. On the other side, hole injection anode, NTCDA forms gap states with anode material. In this presentation, we show the electronic structure changes upon the insertion of CsN3 and NTCDA at proper interfaces to reduce the charge injection barriers. These barrier reductions are correlated with device characteristics.

• Journal of Electrical Engineering and Technology
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• v.6 no.5
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• pp.671-676
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• 2011

A multilayer square-type piezoelectric transformer with a hole at the center was investigated in this paper. Temperature distribution at the center was improved by using this construction, therefore increasing input voltage and output power. This model was simulated and investigated successfully by applying a finite element method (FEM) in ATILA software. An optimized structure was then fabricated, examined, and compared to the simulation results. Electrical characteristics, including output voltage and output power, were measured at different load resistances. The temperature distribution was also monitored using an infrared camera. The piezoelectric transformer operated at first radial vibration mode and a frequency area of 70 kHz. The 16 W output power was achieved in a three-layer transformer with 96% efficiency and $20^{\circ}C$ temperature rise from room temperature under 115 V driving voltage, 100 ${\Omega}$ matching load, $28{\times}28{\times}1.8mm$ size, and 2 mm hole diameter. With these square-type multilayer piezoelectric transformers, the temperature was concentrated around the hole and lower than in piezoelectric transformers without a hole.

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.826-827
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• 2005

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.42-45
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• 2004

Electrochemical discharge machining (ECDM) has been found to be suitable for the micro-hole machining of nonconductive materials such as ceramics or glass compared with existing conventional and also non-conventional machining methods. However this machining process has some problems such as low geometric accuracy and low machining efficiency due to the random spark generation at the end of the electrode. This paper proposes the methods to improve the geometric accuracy of micro-hole using powder mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy of machined hole and decreased concentration of spark energy.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.235-235
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• 2006

Triphenylamine derivatives play important roles as hole transporting materials in organic light emitting devices. However, low molecular weight triphenylamine derivatives show low glass transition temperature and aggregation behavior, and the vapor deposition step of low molecular weight materials is incompatible with large area display fabrication. Conventional polymer PEDOT-PSS HTL has serious drawbacks such as the ITO anode corrosion, poor surface energy match with aromatic EMLs. To solve these problems, we introduced crosslinkable units to triphenylamine-based polymers to make insoluble HTL by thermal curing following spin-coating. Electrochemical and optical properties of the new hole transporting materials were investigated. In addition, the device characteristics obtained with new hole transporting polymers were investigated in details.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.435-441
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• 2010

In this study, numerical simulations were carried out to investigate the effect of verification core hole on the shaft tip capacity. The verification core extreted at shaft tip may deteriorate the shaft tip capacity when the clay shales (Taylor Marl) surrounding the shaft degrades and the empty core hole remains unfilled. Series of finite element analyses were conducted using Mohr-Coulomb model with total stress material parameters that were obtained from laboratory testing. The numerical analyses indicate that the shaft tip capacity does not decrease for most cases, and the maximum reduction does not exceed 5%.