• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.32 no.11B
• /
• pp.693-699
• /
• 2007

In this Paper we present analysis of efficiency for various encapsulation methods to transport IP datagram over terrestrial digital multimedia broadcasting (T-DMB). The multimedia broadcasting system transmitted in one-way needs the data reliability for efficient transmission. And then It is able to select the independent data service using If encapsulation over T-DMB. We examine the compatibility in adopting T-DMB and the overhead of transmission occurring encapsulation. it also needs the full analysis of data framing because the cost of return channel is relatively higher. We do analysis based on theoretical calculation and propose an efficient, reliable and adaptable method in T-DMB.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.3
• /
• pp.22-26
• /
• 2021

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al₂O₃ and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al₂O₃/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP₂ precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.4
• /
• pp.17-22
• /
• 2000

In this paper, methods to analyze wire sweep during the semiconductor chip encapsulation have been studied. The wire sweep analysis is used to analyze the deformation of bonding wires that connect the chip to the leadframe during encapsulation. The analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The results from the numerical simulation are closest to the experimental results.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08b
• /
• pp.1699-1702
• /
• 2007

We will discuss encapsulation of OLEDs on both flexible and rigid glass substrates. Accelerated testing at 6CC/90RH and 85C/85RH is compared and acceleration factors for OLED and Calcium test samples are discussed.We have tested the stability and performance of our barrier coating to much higher temperatures: up to 140 C. Water Vapor Transmission rates at temperatures from 60 to 140 C are presented. Rates and methods for low cost manufacturing on a large scale are analysed

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.1634-1637
• /
• 2008

We will discuss encapsulation of OLEDs on both flexible and rigid glass substrates. Accelerated testing at 6CC/90RH and 85C/85RH is compared and acceleration factors for OLED and Calcium test samples are discussed.We have tested the stability and performance of our barrier coating to much higher temperatures: up to 140 C. Water Vapor Transmission rates at temperatures from 60 to 140 C are presented. Rates and methods for low cost manufacturing on a large scale are analysed.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2003.12a
• /
• pp.154-159
• /
• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Review of KIISC
• /
• v.14 no.5
• /
• pp.44-49
• /
• 2004

비밀키 암호의 키 관리 문제를 해결하기 위해 제안된 공개키 암호는 효율성이나 제한된 메시지 영역으로 인해, 실제로는 메시지의 암호화에는 비밀키 암호를 사용하고 이때 사용되는 키를 메시지를 보낼 상대방과 안전하게 공유하기 위한 용도로 공개키 암호를 사용하는 하이브리드 형태가 일반적으로 사용된다. 최근 Shoup에 의해 제안된 Key Encapsulation Mechanism (KEM)은 이러한 공개키 암호의 실제 사용 용도를 감안하여 제안된 모델로 Data Encapsulation Mechanism (DEM)과 함께 안전한 하이브리드 공개키 암호를 설계하는 하나의 이론적인 모델을 제시하며, 이를 이용하여 만들어진 하이브리드 암호는 최근의 공개키 암호 표준화 작업에서 하나의 주류로 받아들여지고 있다. 본 논문에서는 최근 공개키 암호의 새로운 적용 방식으로 주목받고 있는 KEM과 함께, 이와 관련된 공개키 암호 표준화 작업에 대해서 구체적으로 알아본다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.395-395
• /
• 2012

We fabricate organic-inorganic hybrid thin film for the purpose of encapsulation by molecular layer deposition (MLD) using Trimethylaluminium (TMA) and Adipoyl Chloride (AC). Ellipsometry was employed to verify self limiting reaction of ALD. Linear relationship between number of cycle and thickness was obtained. We found that desirable organic thin film fabrication is possible by MLD surface reaction in nanoscale. Purging was carried out after dosing of each precursor to form monolayer in each sequence. We also confirmed roughness of the organic thin film by atomic force microscopy. We deposit TMA and AC at $70^{\circ}C$ and that 1.78A root mean square was obtained which indicates that uniform organic thin film was formed. We confirmed precursor's functional group by IR spectrum. We calculated WVTR of organic-inorganic hybrid super-lattice epitaxial layer using Ca test. WVTR indicates superlattice film can be possibly use as encapsulation in flexible devices.

• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 2000.10a
• /
• pp.215-218
• /
• 2000

Workflow Management System(WfMS) enables corporations to manage business processes efficiently The purpose of this research is to develop a management system that is capable of managing complicated business processes efficiently under distributed environment where many companies or divisions are participating. Run-time encapsulation proposed in this paper is a system design methodology that enables appropriate response to the dynamically changing processes by using nested processes. We have implemented WfMS under Web environment using run-time encapsulation. Run-time encapsulation using nested process is an efficient development methodology for implementing heterogeneous and distributed WfMS under web environment.

• Proceedings of the Polymer Society of Korea Conference
• /
• 2006.10a
• /
• pp.167-167
• /
• 2006

Photo-/electroactive donor-acceptor (D-A) chromophores were synthesized and investigated for energy- and electron-transfer (ET/eT) properties, for which the chromophores are supramolecularly integrated by encapsulation with helical amylose, rendering the chromophores aggregation-free and rigidified along the helical axis and thus, a remarkably enhanced fluorescence intensity. Fluorescence quenching studies indicated that the helical encapsulation gives the ET/eT a clear D-A distance dependence unlike with the encapsulation-free counterparts, being reflected in their florescence decay profile. Another notable difference is that the helical supramolecule of the chromophores forms a perpendicularly oriented self-assembly. Transport behavior in the solid state will be also discussed.