• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Current Photovoltaic Research
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• v.8 no.4
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• pp.129-133
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• 2020

It is very important to optimize the reflectance of incident light in solar modules for improving output power and reducing loss of cell-to-module (CTM). It is assumed that a higher reflectance backsheet may improve optical efficiency. However how much output power is related to optical properties by reflectance property of backsheets have not been revealed clearly yet. A total of 3 types of industrial backsheets with 3 type of industrial encapsulants (EVA or POE) were analyzed as fabricated mini modules used shingled cells. According to the type of backsheets, the difference between the highest and lowest average reflectance in the range of 400 nm to 1200 nm was found to be 13.08% by UV-visible spectroscopy. Also, when using the same encapsulant, the maximum gap value of the output power increase was measured by about 3.755 mW% (166.02 mW). The correlation between reflectance and output power was experimentally found by measuring the output property of the fabricated shingled mini modules.

• Current Photovoltaic Research
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• v.8 no.4
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• Journal of Radiation Protection and Research
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• v.20 no.4
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• pp.237-243
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• 1995

An estimate is made on the potential generation rate of H: from radiolysis of the Paraffin-wax encapsulant Proposed for the solidified liquid concentrate wasteform. The results show that the radiolytic Production of $H_2$ from paraffin-wax-encapsulated waste is dominated by the radiation energy released from $^{60}Co$. The radiolytic production of $H_2$ will proceed at an initial rate equivalent to aproximately $4.4{\times}10^2cm^3yr^1$ in 200 litre drums that are partly filled with 120 litres of encapsulated waste. The gas production rate will fall to a value of $7.2cm^3yr^1$ after 100 years. The lower flammable limit for $H_2$ in air will be reached in about 25 years and the lower explosive limit for $H_2$ in air would not be reached in 1000years. The timescale in which these safety-related limits are reached is strongly dependent on the level of filling of each waste drum. A reduction of the air space inside each drum would reduce the time required to reach the lower flammable limit.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.55-60
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• 2020

The PERC photovoltaic (PV) modules installed in PV power plant are still reports potential-induced degradation (PID) degradation due to high voltage potential differences. This is because Na+ ions in the cover glass of PV modules go through the encapsulant (EVA) and transferred to the surface of solar cells. As positive charges are accumulated at the ARC (SiOx/SiNx) interface where many defects are distributed, shunt-resistance (Rsh) is reduced. As a result, the leakage current is increased, and decrease in solar cell's power output. In this study, to prevent of this phenomenon, a Moth-eye nanostructure was deposited on the rear surface of an optical film using Nano-Imprint Lithography method, and a solar mini-module was constructed by inserting it between the cover glass and the EVA. To analyze the PID phenomenon, a cell-level PID acceleration test based on IEC 62804-1 standard was conducted. Also analyzed power output (Pmax), efficiency, and shunt resistance through Light I-V and Dark I-V. As a result, conventional solar cells were decreased by 6.3% from the initial efficiency of 19.76%, but the improved solar cells with the Moth-eye nanostructured optical film only decreased 0.6%, thereby preventing the PID phenomenon. As of Moth-eye nanostructured optical film, the transmittance was improved by 4%, and the solar module output was improved by 2.5%.