• Title/Summary/Keyword: electroplating operation

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Manufacturing of Ni-63 Sealed Source for Betavoltaic Battery Using the Small-scale Electroplating Device (소형 전기도금장치를 이용한 베타전지용 Ni-63 밀봉선원 제작)

  • Kim, Jin Joo;Choi, Sang Mu;Son, Kwang Jae;Hong, Jintae
    • Journal of Radiation Industry
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    • v.11 no.3
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    • pp.173-179
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    • 2017
  • The small-scale electroplating device was designed and fabricated for Ni-63 sealed source (foil type) with a high specific activity needed for production of betavoltaic battery. The condition of Ni electroplating was optimized by using fabricated electroplating device to establish a Ni-63 electroplating condition on the Ni foil. The results showed that the optimum surface morphology and thickness of Ni deposit was obtained for 1,758 seconds at a current density of $15mA{\cdot}cm^{-2}$ with 0.5% tween 20. Radioisotope Ni-63 electroplating was implemented under established condition. The radioactivity of Ni-63 sealed source was calculated to $28mCi{\cdot}cm^{-2}$, and the thickness of Ni-63 deposit was about $2.4{\mu}m$.

A Study of Improvement on Collaboration Treatment Method of Electroplating Wastewater (도금폐수의 공동처리를 위한 공정개선에 관한 연구)

  • 이내우;최재욱;안병환
    • Journal of the Korean Society of Safety
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    • v.12 no.4
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    • pp.93-101
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    • 1997
  • A modified procedure for electroplating wastewater treatment using formaldehyde and hydrogen peroxide can destroy free cyanide. The representative diagram which is quite sensitive on reaction temperature is showed for this kinds of treatment. Principally free cyanide and some kinds of cyanide complex should be treated first, and then toxic heavy metals can be removed because cyanide component will be inhibited to remove other pollutants, if it is not destroyed perfectly. Formaldehyde and hydrogen peroxide are added in controlled amounts to cyanide treatment tank. Reasonable amounts of these chemicals are (HCHO/CN)=0.9 and ($H_2O_2/CN$)=1.1 in molar ratios, it is also variable on reaction temperature. Of course, actual treatment processes depending on plating material and chemical are good applicable, also to systematize operation manual for treating electroplating wastewater process, further works are desirable.

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Factors Influencing Edge Dendritic Plating of Steel Sheet in the Electro-Galvanizing Line

  • Du-Hwan Jo;Moonjae Kwon;Doojin Paik;Myungsoo Kim
    • Corrosion Science and Technology
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    • v.23 no.3
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    • pp.215-220
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    • 2024
  • Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m2) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.

Stable Atmospheric Plasma Generation at a Low Voltage using a Microstructure Array (대기압 플라즈마 발생용 마이크로 전극 제작 및 저전압 동작 특성)

  • Han, Sung-Ho;Kim, Young-Min;Kim, Jae-Hyeok
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.4
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    • pp.773-776
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    • 2007
  • A microstructure array has been proposed for micro plasma generation using electroplating and double exposed process. A stable atmospheric plasma has been generated at a low voltage by utilizing the micro electrode gap. Self-aligned microstructure can provide uniform electrode overlap with precisely controlled gap between the electrodes. The proposed structure allows for triode operation, which can expand the generated plasma over a large area by applying a lateral electric field. Electrical characteristics of the micro triode confirm the large numbers of the plasma ions are drifted to the secondary cathode by the lateral electrical field.

Electrochemical Destruction of Cyanide Ions and Recovery of Zinc Ions from Electroplating Wastewater (도금폐수 중의 시안착이온의 전기화학적 분해 및 아연 회수에 관한 연구)

  • Niu, Lin;Ro, Byung-Ho;Jung, Cheul;Lee, Yong-Ill
    • Analytical Science and Technology
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    • v.13 no.6
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    • pp.699-704
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    • 2000
  • A study has been made for the electrochemical destruction of cyanide ions and removal of zinc ions from a simulated electroplating wastewater by the use of a platinum platized-titanium anode and a stainless steel cathode. Several experimental parameters, including electrolysis time, cell current, additives, and chloride concentration, have been investigated and used for efficient destruction of cyanide waste and removal of zinc ions from aqueous solutions. It was found that cell current and type of additives gave great effects on the destruction of cyanide ions and removal of zinc ions. The optimized conditions (electrolysis time: 1hr, current: 12A, additive: 0.5 M NaCl) have been defined to destroy cyanide ions and remove zinc ions with high efficiency and low operation cost. The proper reaction mechanism leading to the destruction of cyanide on the anode has also been discussed.

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A Study on Worker Exposure to Chromium and Degreasing Solvent at Eleetroplating Operation in Small Industry in Korea (우리나라 중소기업 도금공정 근로자의 크롬 및 세척제 폭로에 관한 연구)

  • Paik, Nam Won;Zong, Moon Shik;Lee, Hong Keun;Yun, Chung Ski;Ceong, Hoe Kyeong;Lee, Kyeong Hee;Lee, Na Roo
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.3 no.1
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    • pp.110-126
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    • 1993
  • Worker exposures to total chromium, hexavalent chromium (VI), sulfuric acid and alkaline dust at electroplating operations and worker exposures to trichloroethylene (TCE) and methyl chloroform (MCM) at degreasing operations in eleven small industrial plants were evaluated. Appropriate local exhaust ventilation systems for both operations were designed and recommended. Results of the study are summarized as follows ; 1. Out of 134 measurements for airborne hexavalent chromium concentrations, seven were exceeding the Korean occupational health standard of $50{\mu}g/m^3$ and 45 were exceeding the NIOSH standard of $1{\mu}g/m^3$. With an exception of one measurement, concentrations of total chromium were below the Korean standard of $500{\mu}g/m^3$. 2. Worker exposures to chromium were closely related to the existing control methods at the electroplating operations. Local exhaust systems, partial coverage of the tank surface, and antifoaming agents on liquid surface were adopted as control methods. 3. With an exception of one sample, airborne concentrations of sulfuric acid and alkaline dusts were below the applicable occupational heatlth standards. 4. Three plants indicated that airborne concentrations of TCE and MCM were exceeding the Korean standards. Other plants showed lower concentrations than the standards. It should be noted that generally, the activities and workloads on the day of surveys were less than normal. 5. Since the most existing ventilation systems did not satisfy the ACGIH criteria, the ventilation systems should be improved. Some examples for designing appropriate ventilation systems are presented.

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The Study on Development of Plating Technique on Electroless Ni/Au (무전해 니켈/금도금 기술 개발에 관한 연구)

  • Park Soo-Gil;Park Jong-Eun;Jung Seung-Jun;Yum Jae-Suk;Jun Sae-ho;Lee Ju-Seong
    • Journal of the Korean Electrochemical Society
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    • v.2 no.3
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    • pp.138-143
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    • 1999
  • Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

Effect of Packing Density of ion-Exchange on the Nickel Adsorption Column in Electroplating Rinse Water (이온교환 칼럼 충진비의 변화가 도금폐수 중 니켈이온 흡착에 미치는 영향)

  • 황택성;이진혁
    • Polymer(Korea)
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    • v.26 no.5
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    • pp.551-558
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    • 2002
  • It was observed that adsorption characteristics of sulfonated fabric ion-exchanger for separating nickel ion from electroplating rinse water. Swelling ratio was increased by increasing degree of sulfonation and polarity of solvent. Ion-exchange capacity was also increased by increasing degree of sulfonation and showed 3.38 meq/g at 16% sulfonated ion-exchanger. There was little effects of pH. Adsorption equilibrium was attained within 10 min, and adsorption rate was 7.5 mg/min. Adsorption capacity was not changed after 7 cycles of regeneration process. Regeneration adsorption capacity was slightly decreased to 2.01 meq/g. It confirmed that durability of sulfonated fabric ion-exchanger was suitable for adsorption process. Adsorption equilibrium time was linearly increased by increasing L/D and adsorption capacity showed the ion exchange capacity within the range of 2.71 ∼ 3.01 meq/g in continuous process. Design of adsorption column could be possible for L/D<2. Under constant L/D condition, there is no little pH effect when rinse water is acidic solution, and operation condition of adsorption process was optimized under pH 5.

Optimization of Electrolysis Using Sacrificial Electrode for the Treatment of Electroless Nickel Plating Wastewater (희생전극을 이용한 무전해 니켈 도금 폐수의 전기분해처리 최적화)

  • Kim, Young-Shin;Jeon, Byeong-Han;Cho, Soon-Haing
    • Journal of Korean Society of Environmental Engineers
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    • v.37 no.4
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    • pp.204-209
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    • 2015
  • The effluent limit of nickel from electroplating wastewater has been strengthened from 5 mg/L to 3 mg/L from 2014. However, currently applied treatment process for nickel plating wastewater is unable to meet the effluent limit, most of the treatment concept conducted by treatment plant is dilution with other metal bearing wastewater. This can cause very significant impact to the environment of nickel contamination. With this connection, the feasibility test has been conducted with the use of electrolysis by using sacrificial electrodes. Experiments were conducted in synthetic and electroless nickel plating wastewater. Optimal condition of current density, pH were derived from the synthetic wastewater. It was found that the removal efficiency of nickel exceeded 94% at the operation condition of at pH 9 and the current density of $1{\sim}2mA/cm^2$. At this conditions, the iron sludge was generated very low amount. However, it was unsuccessful to meet the effluent limit by applying these treatment conditions to the real electroplating wastewater. This can be explained due to the matrix effect of other metals and anions contained real electroplating wastewater. From the result of further study, the optimal conditions for the real wastewater treatment were found out to be at pH 9, current density $6{\sim}7mA/cm^2$, for 5 minutes of operating time. At these conditions, 88% removal of nickel was achieved, which results the residual nickel concentration was below 3 mg/L.

A Study on Characteristics of Light Emitting Diode with Porous Silicon (다공성 실리콘을 이용한 LED의 발광 특성에 관한 연구)

  • Lee Sung-Hoon;Lee Chi-Woo
    • Journal of the Korean Electrochemical Society
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    • v.3 no.1
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    • pp.39-43
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    • 2000
  • The light emitting diode (LED) was fabricated from n-type porous silicon. We investigated both the current-voltage characteristics of the LED with various electrode materials and changes of electroluminescence with applied current density. Also we probed changes in electroluminescence as a function of operation time at a given current. In order to Improve the contact area between the electrode material and porous silicon layer, we deposited indium on porous silicon layer by electroplating and investigated the electric characteristics of the LED and changes of electroluminescence.