• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.2.2-2.2
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• 2011

In this talk, the general concept of roll-to-roll printing technologies will be introduced with basic fundamentals of ink formulations for printing electronic devices as the first part of the talk. As the second part, based on the R2R printing process, key factors for printing TFTs, IC, PV and display would be presented using the information from the case study of R2R gravure and offset.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.545-548
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• 2002

$(Ba_{0.6-x}Sr_{0.4}Ca_x)TiO_3$(BSCT) (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. The structural properties as a faction of the composition ratio were studied. As a result of the differential thermal analysis (DTA), exothermic perk was observed at around $860^{\circ}C$ dne to the formation of the polycrystalline perovskite phase. The BSCT thick films sintered at $1350^{\circ}C$ for 2h showed the average grain size of $2{\sim}7{\mu}m$. The average thickness of BSCT thick films, obtained by 3 times of screen-printing, was approximately $85{\mu}m$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.384-385
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• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.689-693
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• 2005

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.354-357
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• 2002

박막과 후막을 구분하고 현재에는 막의 형성 구분에 따라 박막에는 진공증착 후막에는 Screen Printing, Dipping, Brashing, Rolling으로 구분한다. 기술에는 여러 가져가 있는데, 금속 분말 제조기술, 유리분말제조기술, 유기바인더제조기술, 첨가제배합기술, 전자측정기술, 분체제어기술이 있다. 본 연구의 목표는 용도에 알맞은 최적화된 새로운 제조기술을 제시하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.3
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• pp.263-271
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• 2010

e-Printing is a new manufacturing technology for electronic products and is based on traditional printing technology. The electronic products require a large area to facilitate printing and to be economical. A gravure printing system that supports a roll to roll (R2R) manufacturing process can be used to reduce the cost and to achieve the required accuracy. Many factors such as drying method, drying temperature, tension,-printing velocity, ink viscosity, ink conductivity, pattern accuracy, and dot geometry influence the performance of printed electronics. These factors are closely interrelated. The optimum condition for printing must be determined to enhance the performance of the printed electronics. In this study, lines and areas are printed using a gravure printer with conductive ink under different conditions of the above mentioned factors. The results are analyzed to investigate the influence of various factors on the performance of the printed electronics.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.11
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• pp.969-974
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• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.382-393
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• 2024

The Microplotter system with a fluid dispensing method, sprays fluid based on ultrasonic pumping through piezoelectric devices. This technique can possible for various materials with a wide range of viscosities to be printed in microscale. In this paper, we introduces dispenser printing technology as well as aim to understand and apply various processes using the equipment. In addition, we will explain how to optimize the equipment by adjusting parameters such as spray intensity, tip height during printing, and patterning speed. By utilizing Microplotter's advantage of being compatible with a wide range of fluids, including metal nanoparticles, carbon nanotubes, DNA, and proteins, it is expected to be used in various fields such as printed electronics, biotechnology, and chemical engineering.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.645-646
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• 2007