• Title/Summary/Keyword: electronic break

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Evaluation of Breaking Performance of New Contact Material for the Vacuum Interrupter (진공인터럽터용 신규 접점소재에 대한 차단 성능 평가)

  • Cha, Young-Kwang;Lee, Il-Hoi;Ju, Heung-Jin;Shin, Tae-Yong;Park, Kyong-Tae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.1
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    • pp.50-55
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    • 2021
  • Copper-chromium alloys have been used as contact materials of vacuum interrupters in circuit breakers, but new materials with highly stable performance are required to break the high voltage and high current barrier due to the recent increase in breaking capacity. In this paper, a new contact material was fabricated from a ternary alloy instead of existing Cu-Cr alloys. Its breaking performance and endurance were verified from a synthetic test and compared with that of various contact materials. The test results verified that the breaking performance of the new contact material was excellent.

Quantification Method of Driver's Dangerous Driving Behavior Considering Continuous Driving Time (연속주행시간을 고려한 운전자 위험운전행동의 정량화 방법)

  • Lee, Hyun-Mi;Lee, Won-Woo;Jang, Jeong-Ah
    • The Journal of the Korea institute of electronic communication sciences
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    • v.17 no.4
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    • pp.723-728
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    • 2022
  • This study is a method for evaluating and quantifying driver's dangerous driving behavior. The quantification method calculates various driving information in real time after starting the vehicle operation such as the time that the vehicle has been continuously driven without a break, overspeed, rapid acceleration, and overspeed driving time. These quantified risk of driving behavior values can be individually provided as a safe driving index, or can be used to objectify the evaluation of a group of drivers on roads, or vehicle groups such as cargo/bus/passenger vehicles.

Study of Meniscus Formation in a Double Layer Slot Die Head Using CFD (CFD를 이용한 Double Layer 슬롯 다이 헤드의 메니스커스 형성 연구)

  • Gieun Kim;Jongwoon Park
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.2
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    • pp.65-70
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    • 2024
  • Using a computational fluid dynamics(CFD) simulation tool, we have provided a coating guideline for slot-die coating with a double layer slot die head. We have analyzed the fluid dynamics in terms of the coating speed, flow rate ratio, and viscosity ratio, which are critical for the stability of coating meniscus. We have identified the common coating defects such as break-up, air entrainment, and leakage by varying the coating speeds. The flow rate ratio is the critical parameter determining the wet film thickness of the top and bottom layers. It is shown that when the flow rate ratio exceeds or equals 1.8, air entrainment occurs due to insufficient hydraulic pressure in the bottom layer, even though the total flow rate remains constant. Furthermore, we have found that the flow of the bottom layer is significantly affected by the viscosity of top layer. The viscosity ratio of 4 or higher obstructs the flow of the bottom layer due to the increased hydraulic resistance, resulting in leakage. Finally, we have demonstrated that as the viscosity ratio increases from 0.1 to 10, the maximum coating speed rises from 0.4 mm/s to 1.6 mm/s, and the minimum wet film thickness decreases from 800 ㎛ to 200 ㎛.

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A Study on Characteristic of AWG Router in Optical WDM Interconnections (광WDM 인터커넥션에서 AWG 라우터의 특성 연구)

  • Kim, Hoon;Choi, Hyun-Ho;Park, Kwang-Chae
    • Proceedings of the IEEK Conference
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    • 2001.06a
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    • pp.375-378
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    • 2001
  • A 640Gb/s very advanced ATM switching system using 0.25um CMOS VLSI, 40 layer ceramic MCM and 10Gb/s, 8 wavelength 8$\times$8 optical WDM interconnection has been fabricated. To break though the interconnection bottleneck, optical WDM interconnection is used. It has 20Gb/s 8 wavelength 8$\times$8 interconnection capability. It realizes 640Gb/s interconnections within a very small size. Preliminary tests show that 800b1s ATM switch MCM and optical WDM interconnection technologies can be applied to future high speed broadband networks

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Comparison of ab initio Effective Valence Shell Hamiltonian with Semiempirical Theories of Valence: Pairing Theorem

  • Sun, Ho-Sung;Kim, Un-Sik;Kim, Yang
    • Bulletin of the Korean Chemical Society
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    • v.6 no.3
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    • pp.168-170
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    • 1985
  • The pairing properties of electronic structure are investigated from ab initioists' point of view. Numerical results of exact ab initio effective valence shell Hamiltonian are compared with simple semiempirical Hamiltonian calculations. In the oxygen atom case it was found that effective three-electron interaction terms break the similarity between electron-states and hole-states. With the trans-butadiene as an example the pairing theorem was studied. Even for alternant hydrocarbons, the deviation from the pairing was found to be enormous. The pairing theorem, which is usually stated for semiempirical Hamiltonians, is not valid when the exact effective Hamiltonian is considered. The present study indicates that comparisons between the pairing theorem of semiempirical methods and ab initio effective Hamiltonian give important information on the accuracy of semiempirical methods.

Gravure Offset Printed on Fine Pattern by Developing Electrodes for the Ag Paste (Gravure Offset 인쇄에 의한 미세 전극용 Ag Paste 개발)

  • Lee, Sang-Yoon;Jang, Ah-Ram;Nam, Su-Yong
    • Journal of the Korean Graphic Arts Communication Society
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    • v.30 no.3
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    • pp.45-56
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    • 2012
  • Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

The network reliability based OLSR protocol (네트워크의 신뢰도를 고려한 OLSR 프로토콜)

  • Woo, Hyun-Jae;Lee, Dong-Yul;Lee, Chae-Woo
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.45 no.6
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    • pp.68-76
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    • 2008
  • It is difficult to maintain mutes in the mobile ad hoc network (MANET) due to the high probability of disconnected routes break by frequent change of topology. The links can have the different reliability about data transmission due to these characteristics. Hence a measure which can evaluate this reliability and a algorithm which reflects this are required. In this paper, we propose routing algorithm based on reliability about transmission. First the bayesian inference which infers the hypothesis by past information is considered to obtain the link's transmission reliability. The other is that the link-based reliability estimation model which considers each link's reliability additionally is proposed while the standard uses only Dijkstra's shortest path algorithm. the simulation results using NS-2 show that the performance of proposed algorithm is superior to the standard OLSR in terms of throughput and stability.

Preparation and Physical Properties of Poly(ethylene-co-ethyl acrylate)/Carbon Nanotube Nanocomposites (폴리에틸렌에틸아크릴레이트/카본나노튜브 나노복합체의 제조 및 물성)

  • Kook, Jeong Ho;Jeong, Kwang-Un;Yang, Jong Seok;Park, Dae Hee;Go, Jin Hwan;Nah, Changwoon
    • Applied Chemistry for Engineering
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    • v.19 no.2
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    • pp.161-167
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    • 2008
  • Multi-walled carbon nanotubes (MWCNT)-reinforced poly(ethylene-co-ethyl acrylate) (EEA) nanocomposites were prepared by both melt and solution mixing methods. The mechanical, thermal, and electrical properties were investigated as a function of type and loading of CNT. The tensile strength and modulus increased, while elongation at break decreased with increasing MWCNT content. The hollow-type MWCNT showed an improved tensile strength and elongation at break compared with a conventional MWCNT. The thermal degradation temperature was increased by around $40^{\circ}C$ with increasing the amount of MWCNT. The melt-mixed composites showed the highest volume resistivity. In the case of solution-mixed composites, the conventional MWCNT was estimated to show much lower volume resistivity than that of hollow MWCNT. The number and length of extruded CNT onto the fractured surface increased by both increasing the content of CNT and employing the tensile strain to the sample. The melt-mixed specimens showed much smaller number and shorter length of extruded CNT.

Interface Control to get Higher Efficiency in a-Si:H Solar Cell

  • Han, Seung-Hee;Kim, En-Kyeom;Park, Won-Woong;Moon, Sun-Woo;Kim, Kyung-Hun;Kim, Sung-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.193-193
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    • 2012
  • In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is the most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. Single-chamber PECVD system for a-Si:H solar cell manufacturing has the advantage of lower initial investment and maintenance cost for the equipment. However, in single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of single-chamber PECVD system. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. In order to remove the deposited B inside of the plasma chamber during p-layer deposition, a high RF power was applied right after p-layer deposition with SiH4 gas off, which is then followed by i-layer, n-layer, and Ag top-electrode deposition without vacuum break. In addition to the p-i interface control, various interface control techniques such as FTO-glass pre-annealing in O2 environment to further reduce sheet resistance of FTO-glass, thin layer of TiO2 deposition to prevent H2 plasma reduction of FTO layer, and hydrogen plasma treatment prior to n-layer deposition, etc. were developed. The best initial solar cell efficiency using single-chamber PECVD system of 10.5% for test cell area of 0.2 $cm^2$ could be achieved by adopting various interface control methods.

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Dielectric and Electric Properties of Mutilayer Ceramic Capacitor with SL Temperature Characteristics (SL 온도특성을 가지는 적층 칩 세라믹 캐패시터용 유전체의 유전 및 전기적 특성)

  • Yoon, Jung-Rag;Lee, Sang-Won;Kim, Min-Ki;Lee, Kyoung-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.7
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    • pp.645-651
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    • 2008
  • To reduce noise in high frequency and distortion of signal, the composition of $(Ca_{0.7}Sr_{0.3})(Zr_{0.97}Ti_{0.03})O_3$ and $(Ba_{0.2}Ca_{0.4}Sr_{0.4})TiO_3$ was developed. The composition was not solid solution, but mixtures of various phases composed of Ca, Sr, Zr, Ti and Ba oxides. The dielectric constant increased, the quality factor and the insulation resistance decreased with $(Ba_{0.2}Ca_{0.4}Sr_{0.4})TiO_3$ content. The composition of $0.4(Ba_{0.2}Ca_{0.4}Sr_{0.4})TiO_3$ satisfied the electric characteristics and the temperature coefficient of dielectric constant (TCC). In addition, the glass frit and $MnO_2$ also affected the electric characteristics. From the result of the best fit simulation, $MnO_2$ 0.3 mol%, the glass frit 0.6 wt% showed the insulation resistance $906{\Omega}{\cdot}F$, the quality factor 821, and the dielectric constant 92. With the selected composition, MLCC capacitors sized $4.5{\times}3.2{\times}2.5mm$ were manufactured with 105 layered of the dielectric thickness $16{\mu}m$ using Ni inner electrode, They represented the capacitance $98{\sim}102$ nF, the quality factor 1,200 and the insulation resistance $1,500{\Omega}{\cdot}F$. Also, they had high break-down voltage with $107{\sim}115V/{\mu}m$, and satisfied the SL TCC characteristics.