• Korean Journal of Materials Research
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• v.24 no.2
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• pp.105-110
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• 2014

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.

• Proceedings of the Korean Geotechical Society Conference
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• 2008.10a
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• pp.1415-1426
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• 2008

Stone columns, locally called "GCP (granular compaction pile)" can be used to improve strength and resistance against lateral movement of a foundation soil like rigid piles and piers. Also installation of such a discrete column facilitates drainage, and densifies and reinforces the soil in the sense of ground improvement. The integrity of the GCP has been indirectly controlled with the records of each batch including depth and the quantity of stone filled. An integrity testing was attempted using crosshole S-wave logging. The method is conceptionally same as the crosshole sonic logging (CSL) for drilled piers. The only and critical difference is that S-wave should be used in the logging, because P-wave velocity of the stone column is less than that of ground water. The crosshole sonic logger does not have the capability to measure S-wave propagating through the skeleton of crushed stone. An electro-mechanical source, which can generate either P- or SH-waves, and a 1-D geophone were used to measure SH-waves. Two 76mm diameter cased boreholes were installed 1 meter apart across the nominal 700mm diameter stone column. At every 10cm of depth, shear wave was measured across the stone column. One more borehole was also installed 1 meter outward from the one of the above boreholes to measure the shear wave profile of the surrounding soil. The diametric variation of the stone column with respect to depth was evaluated from the shear wave arrival times across the stone column, and shear wave velocities of crushed stone and surrounding soil. The volume calculated with these variational diameters is very close to the actual quantity of the stone filled.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.144-144
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• 2008

Blue light emitting diode structures consisting of the InGaN/GaN multiple quantum wells were grown by metalorganic chemical vapor deposition at different growth temperatures for the p-GaN contact layers and the influence of growth temperature on the emission and microstructural properties was investigated. The I-V and electroluminescence measurements showed that the sample with a p-GaN layer grown at $1084^{\circ}C$ had a lower electrical turn-on voltage and series resistance, andenhanced output power despite the low photoluminescence intensity. Transmission electron microscopy (TEM) revealed that the intense electro luminescence was due to the formation of a p-GaN layer with an even distribution of Mg dopants, which was confirmed by TEM image contrast and strain evaluations. These results suggest that the growth temperature should be optimized carefully to ensurethe homogeneous distribution of Mg as well as the total Mg contents in the growth of the p-type layer.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.5
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• pp.738-744
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• 2016

Current rating of a power cable can be calculated by the maximum allowable temperature in an insulating material considering the heat transfer from cable conductor. Therefore, it is very important to calculate the current rating using electrical equivalent circuit by calculated cable thermal circuit parameters but, it has not been fully investigated yet. In this paper, in order to determine the current rating of power cable, conventional calculation method has been reviewed considering the conductor resistance, loss factor of sheath, dielectric losses and thermal resistances based on the maximum allowable temperature of 345 kV $2500mm^2$ XLPE cable. To confirm the calculation result of the current rating, the conductor temperature should be examined whether it reaches the maximum allowable temperature by the thermal equivalent circuit of the cable. Then, utilizing EMTP (Electro-Magnetic Transient Program) which is a conventional program for electrical circuit, the thermal equivalent circuit was transformed to an electric equivalent circuit using an analogous relationship between thermal circuit and electrical circuit, and temperature condition including cable conductor, sheath, cable jacket could be calculated by the current rating of 345 kV $2500mm^2$ XLPE cable.

• KSBB Journal
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• v.5 no.2
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• pp.175-182
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• 1990

Protoplasts, isolated from leaf of N. tabacum NR-/SR+ and N. glottnosa were electrofused and divided with a plating efficiency of 30∼35% in AAPI 9M medium. Green callus lines were selected in protoplast-derived colonies on MSNO3 selection medium with 1.2mg/ml streptomycin sulfate on the basis of nitrate reductase proficiency and streptomycin resistance. Four putative hybrid plant lines regenerated from the green callus lines had intermediate morphology between that of parents with respect to floral shape, corolla length and ovate leaf blade. Zymograms of leaf peroxidase and esterase from these putative hybrid plant lines showed isozyme profiles derived from both parents and also, they exhibited additional and lost bands. Cytological analysis of two putative hybrid plant lines gave chromosome counts of 2n=66 in L22 and 2n=54 in L44 which were less than the expected number of N. tabacum(2n=48) and N. glutinosa(2n=24).

• Journal of Information Display
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• v.2 no.2
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• pp.52-60
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• 2001

The electrical and mechanical properties in indium-tin-oxide films deposited on polymer substrate were examined. The materials of substrates were polyethersulfone (PES) which have gas barrier layer and anti-glare coating for plastic-based devices. The experiments were performed by rf-magnetron sputtering using a special instrument and buffer layers. Therefore, we obtained a very flat polymer substrate deposited ITO film and investigated the effects of buffer layers, and the instrument. Moreover, the influences of an oxygen partial pressure and post-deposition annealing in ITO films deposited on polymer substrates were clarified. X-ray diffraction observation, measurement of electrical property, and optical microscope observation were performed for the investigation of micro-structure and electro-mechanical properties, and they indicated that as-deposited ITO thin films are amorphous and become quasi-crystalline after adjusting oxygen partial pressure and thermal annealing above $180^{\circ}C$. As a result, we obtained 20-25 ${\Omega}/sq$ of ITO films with good transmittance (above 80 %) of oxygen contents with under 0.2 % and vacuum annealing. Furthermore, using organic buffer layer, we obtained ITO films which have a rather high electrical resistance (40-45 ${\Omega}/sq$) but have improved optical (more than 85 %) and mechanical characteristics compared to the counterparts. Consequently, a prototype reflective color plastic film LCD was fabricated using the PES polymer substrates to confirm whether the ITO films could be realized in accordance with our experimental results.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.10
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• pp.1364-1370
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• 2014

Power system fault analysis has been based on symmetrical component method, which describes power system elements by positive, negative and zero sequence impedance. Obtaining accurate line impedances as possible are very important for estimating fault current magnitude and setting distance relay accurately. Especially, accurate calculation of zero sequence impedance is important because most of transmission line faults are line-to-ground faults, not balanced three-phase fault. Since KEPCO has started measuring of transmission line impedance at 2005, it has been revealed that the measured and calculated line impedances are well agreed within reasonable accuracy. In case of underground transmission lines, however, large discrepancies in zero sequence impedance were observed occasionally. Since zero sequence impedance is an important input data for distance relay to locate faulted point correctly, it is urgently required to analyze, detect and consider countermeasures to the source of these discrepancies. In this paper, development of pre/post processor to ATP (Alternative Transient Program) version of EMTP (Electro-Magnetic Transient Program) for sequence impedance calculation was described. With the developed processor ATP-cable, effects of ground resistance and ECC (Earth Continuity Conductor) on sequence impedance were analyzed.

• Nuclear Engineering and Technology
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• v.39 no.3
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• pp.231-236
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• 2007

Due to the occasional occurrences of stress corrosion cracking(SCC) in steam generator tubing(Alloy 600), degraded tubes are removed from service by plugging or are repaired for re-use. Since electrodeposition inside a tube does not entail parent tube deformation, residual stress in the tube can be minimized. In this work, tube restoration via electrodeposition inside a steam generator tubing was performed after developing the following: an anode probe to be installed inside a tube, a degreasing condition to remove dirt and grease, an activation condition for surface oxide elimination, a tightly adhered strike layer forming condition between the electro forming layer and the Alloy 600 tube, and the condition for an electroforming layer. The reliability of the electrodeposited material, with a variation of material properties, was evaluated as a function of the electrodeposit position in the vertical direction of a tube using the developed anode. It has been noted that the variation of the material properties along the electrodeposit length was acceptable in a process margin. To improve the reliability of a material property, the causes of the variation occurrence were presumed, and an attempt to minimize the variation has been made. A Ni alloy electrodeposition process is suggested as a primary water stress corrosion cracking(PWSCC) mitigation method for various components, including steam generator tubes. The Ni alloy electrodeposit formed inside a tube by using the installed assembly shows proper material properties as well as an excellent SCC resistance.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.10a
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• pp.763-764
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• 2013

A three-dimensional image capturing device and its signal processing algorithm and apparatus are presented. Three dimensional information is one of emerging differentiators that provides consumers with more realistic and immersive experiences in user interface, game, 3D-virtual reality, and 3D display. It has the depth information of a scene together with conventional color image so that full-information of real life that human eyes experience can be captured, recorded and reproduced. 20 Mega-Hertz-switching high speed image shutter device for 3D image capturing and its application to system prototype are presented[1,2]. For 3D image capturing, the system utilizes Time-of-Flight (TOF) principle by means of 20MHz high-speed micro-optical image modulator, so called 'optical resonator'. The high speed image modulation is obtained using the electro-optic operation of the multi-layer stacked structure having diffractive mirrors and optical resonance cavity which maximizes the magnitude of optical modulation[3,4]. The optical resonator is specially designed and fabricated realizing low resistance-capacitance cell structures having small RC-time constant. The optical shutter is positioned in front of a standard high resolution CMOS image sensor and modulates the IR image reflected from the object to capture a depth image (Figure 1). Suggested novel optical resonator enables capturing of a full HD depth image with depth accuracy of mm-scale, which is the largest depth image resolution among the-state-of-the-arts, which have been limited up to VGA. The 3D camera prototype realizes color/depth concurrent sensing optical architecture to capture 14Mp color and full HD depth images, simultaneously (Figure 2,3). The resulting high definition color/depth image and its capturing device have crucial impact on 3D business eco-system in IT industry especially as 3D image sensing means in the fields of 3D camera, gesture recognition, user interface, and 3D display. This paper presents MEMS-based optical resonator design, fabrication, 3D camera system prototype and signal processing algorithms.