• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.5
• /
• pp.350-354
• /
• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.366-369
• /
• 2005

Electrochemical discharge machining (ECDM) has been found to be potential fur the micro-machining of non-conductive materials such as ceramics or glass. However this machining process has its own inherent problem that the reproducibility is too low to get the available geometric accuracy fur micromachining applications. One main challenge in reaching this goal is the control of the hydrogen built around the tool-electrode in which happen the discharges. This paper proposes the methods to improve the geometric accuracy using powder-mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy by averaging and decreasing the concentration of spark energy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.391-392
• /
• 2008

최근 나노 금속의 대량 생산에 대한 기술이 확보됨에 따라, 메탈젯을 이용한 연구가 활발히 진행되고 있다. 메탈젯의 연구 범위는 RFID, PCB, MLCC 전극, 태양전지전극, PDP 전극, EMC용재료 등 그 응용 범위를 넓혀 가고 있다. 이러한 응용 기술 대표적인 배선형성 기술인 PCB 제조에 대한 연구는 40um 이하의 고해상도 기판 개발을 요구하고 있다. 선폭은 40um 이하를 유지하면서, 두께는 10um 이상으로 CCL을 대체 하기 위한 기판 형성 기술은 응용기술은 가장 어려운 난이도의 기술이다. 메탈젯 기술은 매우 복합적인 연구분야로 나노 재료의 개발, 인쇄공정의 개발, 기재 표면처리 기술, 헤드 기술의 개발을 동시에 만족할 때 가능하다. 배선 형성을 위하여 나노 잉크를 이용하여 직접 인쇄를 진행하고, 소결하여 전도성을 얻게 된다. 본 연구에서는 미세노즐에 토출 가능한 잉크젯용 잉크 조성을 결정하고, 기판과의 신뢰성을 확보하기 위하여 접착력의 평가, 전도도의 평가, 건조 시간 조절을 통한 Crack 문제 해결, 미세 선폭의 균일성 조절에 관한 실험을 진행하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.42-45
• /
• 2004

Electrochemical discharge machining (ECDM) has been found to be suitable for the micro-hole machining of nonconductive materials such as ceramics or glass compared with existing conventional and also non-conventional machining methods. However this machining process has some problems such as low geometric accuracy and low machining efficiency due to the random spark generation at the end of the electrode. This paper proposes the methods to improve the geometric accuracy of micro-hole using powder mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy of machined hole and decreased concentration of spark energy.

• 제어로봇시스템학회:학술대회논문집
• /
• 1994.10a
• /
• pp.587-592
• /
• 1994

To realize artificial device with sensing ability of the human skin, a mono-material tactile sensor with three sensing functions made of some elastic thin electro-conductive rubber sheet with eight latticed patch elements is proposed. This trial sensor provides the information of three kinds of model material characteristics such as thermal property, hardness property and the surface situation of materials by setting up three kinds of surface models as test materials. It can be finally expected to estimate unknown model materials by analyzing the data of the sensor.

• Journal of the Korean Mathematical Society
• /
• v.53 no.1
• /
• pp.161-185
• /
• 2016

We consider a mathematical model which describes the quasistatic frictional contact between a piezoelectric body and an electrically conductive obstacle, the so-called foundation. A nonlinear electro-viscoelastic constitutive law is used to model the piezoelectric material. Contact is described with Signorini's conditions and a version of Coulomb's law of dry friction in which the adhesion of contact surfaces is taken into account. The evolution of the bonding field is described by a first order differential equation. We derive a variational formulation for the model, in the form of a system for the displacements, the electric potential and the adhesion. Under a smallness assumption which involves only the electrical data of the problem, we prove the existence of a unique weak solution of the model. The proof is based on arguments of time-dependent quasi-variational inequalities, differential equations and Banach's fixed point theorem.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.1
• /
• pp.83-90
• /
• 2014

EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

• Proceedings of the KIEE Conference
• /
• 1996.07c
• /
• pp.1512-1515
• /
• 1996

Dense $SiC-ZrB_2$ electro-conductive ceramic composites were obtained by hot pressing for high temperature structural application. The influences of the $ZrB_2$ additions an the mechanical and electrical properties of $SiC-ZrB_2$ composites were investigated. Samples were prepared by adding 15, 30, 45 vol.% $ZrB_2$ particles as a second phase to a SiC matrix. Sintering of monolithic SiC and $SiC-ZrB_2$ composites were achieved by hot pressing under a $10^{-4}$ torr vacuum atmosphere from 1000 to $2000^{\circ}C$ with a pressure of 30 MPa and held for 60 minutes at $2000^{\circ}C$. SiC and $SiC-ZrB_2$ samples obtained by hot pressing were fully dense with the relative densities over 99%. Flexural strength and fracture toughness of the samples were improved with the $ZrB_2$ contents. In the case of SiC sample containing 30vol.% $ZrB_2$, the flexural strength and fracture toughness showed 45% and 60% increase, respectively compared to those of monolithic SiC sample. The electrical resistivities of $SiC-ZrB_2$ composites were measured utilizing the four-point probe method and they decreased significantly with Increasing $ZrB_2$ contents. The resistivity of SiC-30vol.% $ZrB_2$ showed $6.50{\times}10^{-4}{\Omega}{\cdot}cm$.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.21-27
• /
• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Composites Research
• /
• v.16 no.2
• /
• pp.68-73
• /
• 2003

Interfacial properties and electrical sensing fer fiber fracture in carbon and SiC fibers/epoxy composites were investigated by the electrical resistance measurement and fragmentation test. As fiber-embedded angle increased, the interfacial shear strength (IFSS) of two-type fiber composites decreased, and the elapsed time takes long until the infinity in electrical resistivity. The initial slope of electrical resistivity increased rapidly to the infinity at higher angle, whereas electrical resistivity increased gradually at small angle. Furthermore, both fiber composites with small embedded angle showed a fully-developed stress whitening pattern, whereas both composites with higher embedded angle exhibited a less developed stress whitening pattern. As embedded angle decreased, the gap between the fragments increased and the debonded length was wider for both fiber composites. Electro-micromechanical technique could be a feasible nondestructive evaluation to measure interfacial sensing properties depending on the fiber-embedded angle in conductive fiber reinforced composites.