• 제목/요약/키워드: electrical contact properties

검색결과 542건 처리시간 0.024초

P3HT를 이용한 유기 박막 트랜지스터에 관한 연구 (Investigation on the P3HT-based Organic Thin Film Transistors)

  • 김영훈;박성규;한정인;문대규;김원근;이찬재
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 춘계학술대회 논문집 디스플레이 광소자 분야
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    • pp.45-48
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    • 2002
  • Poly(3-hexylthiophene) or P3HT based organic thin film transistor (OTFT) array was fabricated on flexible poly carbonate substrates and the electrical characteristics were investigated. As the gate dielectric, a dual layer structure of polyimide-$SiO_2$ was used to improve the roughness of $SiO_2$ surface and further enhancing the device performance and also source-drain electrodes were $O_2$ plasma treated for improvement of the electrical properties, such as drain current and field effect mobility. For the active layer, polymer semiconductor, P3HT layer was printed by contact-printing and spin-coating method. The electrical properties of OTFT devices printed by both methods were evaluated for the comparison. Based on the experiments, P3HT-based OTFT array with field effect mobility of 0.02~0.025 $cm^{2}/V{\cdot}s$ and current modulation (or $I_{on}/I_{off}$ ratio) of $10^{3}\sim10^{4}$ was fabricated.

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Zn 농도변화에 따른 ZnO 박막의 구조, 광학 및 전기적 특성 연구 (Structural, Optical and Electrical Properties of ZnO Thin Films with Zn Concentration)

  • 한호철;김익주;태원필;김진규;심문식;서수정;김용성
    • 한국세라믹학회지
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    • 제40권11호
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    • pp.1113-1119
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    • 2003
  • 저온 박막 공정을 위해 비등점이 낮은 용매인 isopropanol을 사용하였고, 용질로 zinc acetate의 몰 농도를 0.3∼1.3 mol/l까지 변화시켜 sol을 합성하였다. Zn 농도 변화에 따른 ZnO 박막의 구조 및 광학, 전기적 특성을 분석하였다. XRD 측정에서 Zn의 농도가 0.7 mol/l 일 때 c-축으로 결정 배향성이 뚜렷하였다. SEM으로 박막의 표면 morphology를 관찰한 결과 0.7 mol/l 에서 균일한 표면층을 갖는 나노구조를 이루고 있었다. UV-vis. 측정을 통한 ZnO 박막의 광투과도는 Zn의 농도가 0.7 mol/l 이하에서 87%였으나, 1.0 mol/l 이상의 농도에서는 급격히 감소하였다. 이때 광 밴드갭 에너지는 3.07∼3.22 eV의 값을 나타내며, 벌크 ZnO의 특성과 유사하였다. 박막의 전기 비저항 값은 150 $\Omega$-cm로 Zn의 농도변화에 따라 큰 변화를 보이지 않았으며, I-V 특성분석에서 전형적인 ohmic contact 특성을 보였다.

태양전지의 저가격.고효율화를 위한 Ni/Cu/Ag 전극에 관한 연구 (The Research of Solar Cells Applying Ni/Cu/Ag Contact for Low Cost & High Efficiency)

  • 조경연;이지훈;이수홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.444-445
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    • 2009
  • The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

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Ceramic PTC thermistor의 금속접촉저항과 입계전위장벽 (Analysis on Metal Contact Resistance and Grain Boundary Barrier Height of Ceramic PTC Thermistor)

  • 전용우;임병재;홍상진;소대화
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.235-236
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    • 2006
  • The contact resistance and grain boundary potential barrier of ceramic $BaTiO_3$ PTCR were investigated. The electroless plated Ni, evaporated Al, and Ag paste were chosen as electrode materials of PTCR device for comparison analysis before and after heat treatment. The contact resistance of electrode were measured by electrometer (dc), digital multimeter (dc), and LCR meter (ac). In the case of Al electroded samples, the heat treatment and protective oxide layer had high resistance and effect on the stability of PTCR effect against contact resistance degradation, but the Ag-paste had comparably high contact resistance before heat treatment and decreased after heat treatment with safe. On the other hand, the samples with electroless plated Ni electrode had good properties of contact resistance against aging.

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Pt/Si/Ti P형 4H-SiC 오옴성 접합에서 낮은 접촉 저항에 관한 연구 (Low resistivity ohmic Pt/Si/Ti contacts to p-type 4H-SiC)

  • 양성준;이주헌;노일호;김창교;조남인;정경화;김은동;김남균
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.521-524
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    • 2001
  • In this letter. we report on the investigation of Ti. Pt/Si/Ti Ohmic contacts to p-type 4H-SiC. The contacts were formed by a 2-step vacuum annealing at $500^{\circ}C$ for 1h. $950^{\circ}C$ for 10 min respectively. The contact resistances were measured using the transmission line model method. which resulted in specific contact resistivities in the $3.5{\times}10^{-3}$ and $6.2{\times}10^{-4}ohm/cm^{2}$, and the physical properties of the contacts were examined using x-ray diffraction. microscopy. AES(auger electron spectroscopy). AES analysis has shown that, at this anneal temperature, there was a intermixing of the Ti and Si. migration of into SiC. Overlayer of Pt had the effect of decreasing the specific contact resistivity and improving the surface morphology of the annealed contact.

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Pt/Si/Ti P형 4H-SiC 오옴성 접합에서 낮은 접촉 저항에 관한 연구 (Low resistivity ohmic Pt/Si/Ti contacts to p-type 4H-SiC)

  • 양성준;이주헌;노일호;김창교;조남인;정경화;김은동;김남균
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
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    • pp.521-524
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    • 2001
  • In this letter, we report on the investigation of Ti, Pt/Si/Ti Ohmic contacts to p-type 4H-SiC. The contacts were formed by a 2-step vacuum annealing at 500$^{\circ}C$ for 1h, 950$^{\circ}C$ for 10 min respectively. The contact resistances were measured using the transmission line model method, which resulted in specific contact resistivities in the 3.5x10$\^$-3/ and 6.2x10$\^$-4/ ohm/$\textrm{cm}^2$, and the physical properties of the contacts were examined using x-ray diffraction, microscopy, AES(auger electron spectroscopy). AES analysis has shown that, at this anneal temperature, there was a intermixing of the Ti and Si, migration of into SiC. Overlayer of Pt had the effect of decreasing the specific contact resistivity and improving the surface morphology of the annealed contact.

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III-V 광소자 제작을 위한 ITO/n+lnP 옴 접촉 특성연구 (Formation of ITO Ohmic Contact to ITO/n+lnP for III-V Optoelectronic Devices)

  • 황용한;한교용
    • 한국전기전자재료학회논문지
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    • 제15권5호
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    • pp.449-454
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    • 2002
  • The use of a thin film of indium between the ITO and the $n^+-lnP$ contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. $ITO/n^+-lnP$ ohmic contact was successfully achieved by the deposition of indium and annealing. The specific contact resistance of about $6.6{\times}10^{-4}\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to $ITO/n^+-lnP$ contact without the deposition of indium between ITO and $n^+-lnP$, it exhibited Schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with those of InP/InGaAs HBTs with the opaque emitter contacts.

산화 방식이 Ag-CdO계 전기접점재료의 수명 특성에 미치는 영향 (A Effect of the Oxidation Process on the Lifetime Properties of Ag-CdO Contact Materials)

  • 권기봉;남태운
    • 한국주조공학회지
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    • 제25권6호
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    • pp.233-239
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    • 2005
  • Contact material is widely used in the field of electrical parts. Ag-CdO has a good wear resistance and stable contact resistance. We studied a lifetime of Ag-CdO material because of getting better properties of Ag-CdO using Post-oxidation. The experimental procedure were melting using high frequency induction, heat treatment, rolling and internal oxidation. And we experimented on difference process, Post-oxidaion. Then we tested a lifetime and analysed. We obtained the optimizing oxidation temperature was $750^{\circ}C$. Using Pre-oxidation, coarse oxide and depleted oxidation layer existed but finer oxides were existed and depleted oxidation layer was not using Post-oxidation. In Post-oxidation, The density was 10 $g/cm^{3}$, the hardness was Hv 80 and the adhesive strength was 9000N. The specimen of Post-oxidation had better lifetime properties than that of Pre-oxidation. We predicted that the lifetime of Post-oxidation specimen is more longer twice than that of Pre-oxidation one.

Ni/Au와 Au/Al 전극 증착에 의한 GaN의 전기적 특성 연구 (Electrical Behavior of Ni/Ti and Au/Al Contact Metallization on GaN)

  • 이태근;최종운;허재근
    • 한국결정학회지
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    • 제14권2호
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    • pp.105-109
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    • 2003
  • Electrical properties of Ni/Au/p-GaN and optical properties of epitaxial GaN MQW LED on sapphire were characterized. At 20 mA forward bias, GaN MQW emitted in the blue at 470 nm. Current-voltage (I-V) characteristics were decreased linearly with the annealing temperature. The resistivity of Ni/Au contacts was found by TLM measurements to be of device quality (2×10/sup -1/Ωㆍcm).