• 제목/요약/키워드: elastic rubber pad

검색결과 14건 처리시간 0.019초

강성 및 연성 보강을 통한 콘크리트 중앙분리대 성능 향상 분석 (Concrete Median Barrier Performance Improvement using Stiffness and Flexibility Reinforcement)

  • 김찬희;김우석;이일근;이재하
    • 한국구조물진단유지관리공학회 논문집
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    • 제22권1호
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    • pp.23-31
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    • 2018
  • 최근 사용 중인 중앙분리대의 성능 등급을 뛰어넘는 사고가 발생하고 있다. 그러므로 피해를 줄이기 위해 중앙분리대의 성능 등급을 현재의 SB5-B등급보다 상향된 기준에 맞춰 개선하는 것이 필요하다. 이에 본 연구에서는 중앙분리대 충돌시험결과를 활용하여 적절한 모델을 개발 및 검증하고 강도성능이 향상된 콘크리트 중앙분리대 개발을 목표로 하였다. 중앙분리대 성능은 SB6등급으로 목표성능등급을 설정하였고, 중앙분리대의 강도성능 개선 요소로 강성보강과 연성보강의 두 가지 형태를 고려하였다. 강성보강으로는 와이어 메쉬 직경 증가, 중앙분리대 상단 부위 철판보강을 고려하였고, 연성보강을 위해서는 중앙분리대 하단에 고무패드를 설치하여 성능향상을 컴퓨터 시뮬레이션을 통해서 확인하였다. 시뮬레이션 결과, 와이어 메쉬 직경이 증가할 수록 중앙분리대의 부피 손실은 감소하였으며, 고무패드 사용시 트럭의 충격에너지를 중앙분리대의 변형에너지로 전환하여 충격흡수에 효과적인 것으로 나타났다.

사교의 사각에 따른 하부구조 설계변화 (Change of Substructure Design with Changed Angle of Skew Bridges)

  • 이주호;염종윤;박경래;배한욱
    • 콘크리트학회논문집
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    • 제11권3호
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    • pp.3-12
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    • 1999
  • This study presents a suggestion of regulation of skewed slab bridge. In order to find the characteristic behavior of skew bridge, many cases of skew bridges were analyzed with changed angle of skew. The comparison of design methods for cantilever part in pier was also made. It was found that : (1) The lower the skew angle was, the higher the maximum support reaction forces at the end point were. (2) The higher the ratio of L/B was, the higher the maximum support reaction force at the point was. (3) The effect of skew may be neglected for skew angles of $70^{\circ}$or more. (4) If elastic springs are applied to the boundary conditions to simulate the rubber pad bearings, the results will be more reasonable. (5) The shear deformation effect must be considered in the analysis of cantilever part of substructure. (6) Using strut and tie model to design cantilever part of pier, it will be more simple than finite element method with same accuracy and more accurate than using frame element.

H-말뚝을 이용한 일체식교대 교량 (Integral Bridge Using H-pile)

  • 정경자;김성환;유성근
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 1999년도 봄 학술발표회 논문집
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    • pp.241-248
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    • 1999
  • The existing bridge with deck joint has many problems during construction and maintenance. To overcome these difficulties, an integral bridge, which is defined as the practice of constructing bridges without deck joints, is proposed in this study. A test bridge with 3 spans of PC beam was selected to verify the function of the bridge and is under construction. Characteristics of integral bridge are followings: $\circled1$ Flexible H-piles under the abutment are installed to accommodate thermal movements of the superstructures of bridge. $\circled2$ PC beam of the superstructure and the abutment are integrated. $\circled3$ The existing approach and relief slabs are applied to minimize the stress transfer occurred from the bridge deck to the pavement. $\circled4$ A cyclic control joint is installed between approach and relief slabs to absorb the thermal movement. $\circled5$ It is used a dual direction bearing which is cheaper than single direction bearing and has a good workability as well. It is also installed a shear block on the top of pier coping to protect the lateral movement caused by temperature change and earthquake.

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초미세 금속 박판 홀 어레이 가공 (Fabrication of Ultra Small Size Hole Array on Thin Metal Foil)

  • 임성한;손영기;오수익
    • 소성∙가공
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    • 제15권1호
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    • pp.9-14
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    • 2006
  • In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.