• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1741-1744
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• 2005

The electron beam machining provides very high resolution up to nanometer scale, hence the E-Beam writing technology is rapidly growing in MEMS and nano-engineering areas. For E-Beam machining, $2^{nd}$ electron detector is required to see a machined sample at the stage. The $2^{nd}$ electron detector is composed of scintillator and photomultiplier with signal amplifier and high voltage power supplier. Since a photomultiplier tube is an extremely high-sensitivity photodetector, the signal light level to be detected is very low and therefore particular care must be exercised in shielding external light. In this paper, the design methodology of $2^{nd}$ electron detector and the image noise removal method are introduced.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1262-1264
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• 1993

An amorphous $Se_{75}Ge_{25}$ thin film as inorganic resist for the focused ion beam lithography(FIBL) is investigated. This film offers an attractive potential alternative to polymer resists because of a number of advantages, such as the possibility of preparing physically uniform films of thickness as small as 200A and obtaining both positive and negative resist action in the same material, compatibility with dry processing, the sensitivity on optical, e-beam and ion beam exposure, the high-temperature stability, etc. In previous paper, the defocused ion beam-induced characteristics in a-$Se_{75}Ge_{25}$ film has been propose. Practically it is neccesary to know the relation with resist and source ions. For the purpose, the ion stopping power, the ion projected range and ion transmission coefficiency are studied. In this paper, the theoretically calculated values of parameters are presented and compared with theory.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.372-376
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• 2009

In the modern semiconductor industry, lithography process is used to construct specific patterns. However, due to the decreasing of line width, these days, more and more researchers are interested in PMMA(Poly Methyl Methacrylate) lithography by using e-beam instead of the prior method, PR(Photoresist) lithography by using UV(Ultra-Violet). Additionally, the patterns constructed by lithography are collapsed during the process of cleansing remnants and the resistance against the breakdown of the patterns is known to be proportional to the elastic modulus of pattern-constructing materials. In this research, we measured the change of hardness and elastic modulus of PMMA film surface according to the change of time spent to soft-bake the PMMA film. During the measurement, we controlled the tip pressure from $25{\mu}N$ to $8,500{\mu}N$ having intervals that are $134.52{\mu}N$. For these measurements, we used the Triboindenter from Hysitron to gauge the hardness and elastic modulus and the tip we used was Berkovich diamond Tip.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.212-212
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• 2013

본 연구에서는 최근 다양한 전자 소자로써의 연구가 진행되고 있는 그라핀을 실리콘 기판위에 전자빔 식각(Electron-Beam Lithography)을 이용하여 TLM (Transfer Length Method) 패턴을 형성하고 가스 유입이 가능한 진공 챔버를 가지는 Probe Station을 이용하여 I-V 변화를 측정함으로써, 그라핀을 가스 센서 소자로서의 가능성을 연구하였다. 우리는 기존의 광식각을 이용한 TLM 패턴 형성과 더불어 전자빔 식각(E-Beam Lithography: EBL)을 이용한 TLM 패턴을 형성하여 I-V를 측정하였는데, 전자빔을 이용한 TLM 패턴의 형성은 광식각을 이용한 방법에 비해 더 세밀하고 미세한 패턴을 형성하는 것이 가능하다. 이렇게 형성된 그라핀의 TLM패턴은 가스 유량 조절이 가능한 진공 챔버를 가지는 Probe Station을 이용하여 측정하게 되는데, 이 때 저진공 상태의 챔버 내로 N2, H2 두 종류의 가스를 각각 유량을 변화시키며 주입하고 그 변화를 측정하였다. 유입된 가스는 그라핀의 Dangling Bond에 결합됨으로써 그라핀의 전도도를 변화시키게 되고, 변화된 그라핀의 전도도에 따른 I-V 결과의 변화를 측정하여 이를 가스 센서로 사용할 수 있는지를 측정하였다. 또한 유입되는 가스의 유량 변화에 따른 I-V 결과의 변화량을 통하여 가스 센서의 민감도 또한 측정하였다.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.17-20
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• 2000

We have enhanced the yield of 0.25 ${\mu}{\textrm}{m}$ T-gate $Al_{0.25}$G $a_{0.75}$As/I $n_{0.2}$G $a_{0.8}$As P-HEMT using three-layer E-beam lithography process and selective etching process. The three-layer resist structure (PMMA/copolymer/ PMMA=2000 $\AA$/3000 $\AA$/2000 $\AA$) and three developers (Benzene：IPA=1：1,Methanol：IPA =1：1,MIBK：IPA=1：3) were used for fabrication of a wide-head T-gate by the conventional double E-beam exposure technology. Also 1 wt% citric acid： $H_2O$$_2$：N $H_{4}$OH(200m1：4ml：2.2ml) solution were used for uniform gate recess. The etching selectivity of GaAs over $Al_{0.25}$G $a_{0.75}$As is measured to be 80. So these P-HEMT processes can be used in X-band MMIC LNA fabrication.ion.ion.ion.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.187-190
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• 1999

We have developed fabrication processes that form a wide-head T-gate with a 0.2 ${\mu}{\textrm}{m}$ gate length using the combination of thickness of each PMMA layer, line doses and development times for applications in millimeter- and micro-waves monolithic integrated circuits. The three-layer resist structure (PMMA/P(MMA-MAA)/PMMA = 1800 $\AA$/5800 A/1900$\AA$), 4nC/cm and over development were used for fabrication of a wide-head T-gate by the conventional double E-beam exposure technology. The experimented results show that the cross sectional area of T-gate fabricated by the proposed method is easily enlarged without additional processes.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1021-1024
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• 2003

In this work, we fabricated various 2D metallic and polymeric nanopatterns with the feature resolution of sub-micrometer scale by using the method of microcontact printing ($\mu$ P) based on soft lithography. Silicon masters for the micromolding were made by e-beam lithography. Composite poly(dimethylsiloxane) (PDMS) molds were composed of a thin, hard layer supported by soft PDMS layer. Finally, monodisperse metal or polymer particles could be obtained in the prepared pattern for the application of electronic devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.540-540
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• 2012

Selective detection of single nucleotide polymorphism (SNP) of Cytochrome P450 2C19 (CYP2C19) was carried out by the PNA chips which were electrically-interfaced with interdigitated nanogap electrodes (INEs). The INEs whose average gap distance and effective gap length were about ~70 nm and ${\sim}140{\mu}m$, respectively, were prepared by the combination of the photo lithography and the surface-catalyzed chemical deposition, without using the e-beam lithography which is almost inevitable in the conventional lab-scale fabrication of the INEs. Four different types of target DNAs were successfully detected and discriminated by the INE-based PNA chips.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.192-196
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.60-63
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth.