• Title/Summary/Keyword: e-AG

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Electrochemical Determination of Ag(I) Ion at Chemically Modified Carbon-Paste Electrode Containing 1,5,9,13-Tetrathiacyclohexadecane (1,5,9,13-Tetrathiacyclohexadecane 수식전극을 사용한 Ag(I)의 전기화학적 정량)

  • Ha, Kwang Soo;Jang, Mi-Kyeong;Seo, Moo Lyong
    • Analytical Science and Technology
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    • v.10 no.3
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    • pp.187-195
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    • 1997
  • Chemically modified electrodes(CMEs) for Ag(I) were constructed by incoporating 1,5,9,13-tetrathiacyclohexadecane([16]-ane-$S_4$) with a conventional carbon-paste mixture composed of graphite powder and nujol oil. Ag(I) ion was chemically deposited onto the surface of the modified electrode with [16]-ane-$S_4$ by immersion of the electrode in the acetate buffer solution(pH=4.5) containing $5.0{\times}10^{-4}M$ Ag(I) ion. And then the electrode deposited with Ag(I) was reduced at -0.3V vs. S.C.E. Well-defined stripping voltammetric peaks could be obtained by scanning the potential to the positive direction. The CME surface was regenerated with exposure to 0.1M $HNO_3$ solution and was reused for the determination of Ag(I) ion. When deposition/measurement/regeneration cycles were 10 times, the response could be reproduced with relative standard deviation of 6.08%. In case of differential pulse stripping voltammetry, the calibration curve for Ag(I) was linear over the range of $5.0{\times}10^{-7}{\sim}1.5{\times}10^{-6}M$. And the detection limit was $2.0{\times}10^{-7}M$. Various ions such as Cd(II), Ni(II), Pb(II), Zn(II), Mn(II), Mg(II), EDTA, and oxalate(II) did not influence the determination of Ag(I) ion, except Cu(II) ion.

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Antibacterial Characteristics of Silver Nano-Particles Attached to Activated Carbon Filter (은나노를 부착한 활성탄 필터의 제균특성)

  • Heo, Ju-Yeong;Nam, Sang-Yeob;Kang, Jeong-Hee;Song, Ji-Hyeon;Kang, Byung-Ha;Han, Sung
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.21 no.10
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    • pp.583-589
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    • 2009
  • Activated carbon has long been used in purification processes for indoor air quality. However, the bioaerosol removal by activated carbon is not often sufficient to be used in an air control devise. In order to overcome these problems, silver nano-particles have been proposed as an antibacterial agent on the surface of activated carbon. Silver or silver ions have been known for antimicrobial activities. In this study, bioaerosol generated by using an Escherichia coli culture was introduced to a lab-scale column packed with activated carbon (AC) and silver nano-particles attached to activated carbon (Ag-AC). E. coli was almost completely removed in the Ag-AC column, whereas bioaerosol penetrated through the AC column. To determine the antibacterial effect of different filter materials in a full-scale air-handling system, another experiment was conducted using a wind tunnel equipped with a heat exchanger and three filter materials including commercial fabric, AC and Ag-AC. It was found that E. coli proliferated on the surface of the heat exchanger after 5 days, which dramatically increased bioaerosol counts in the effluent air stream. The fabric filter could not control the increased bioaerosol and most of the E. coli penetrated the filter. The bacterial removal efficiency was found to be approximately 45% in the AC filter, while the antibacterial efficiency increased to 70% using the Ag-AC filter. Consequently, the Ag-AC filter can be an effective method to control bioaerosol and improve indoor air quality.

Corrosion Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging (반도체 패키징용 금-코팅된 은 와이어의 부식특성)

  • Hong, Won Sik;Kim, Mi-Song;Kim, Sang Yeop;Jeon, Sung Min;Moon, Jeong Tak;Kim, Youngsik
    • Corrosion Science and Technology
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    • v.20 no.5
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    • pp.289-294
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    • 2021
  • In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H2SO4 and 1 wt% HCl electrolytes at 25 ℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (ECORR) values in sulfuric acid solution, ACA wire had more than six times higher ECORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the ECORR value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.

Fabrication of Ag doped Hydroxyapatite and its Antimicrobial Effects with the Particle Size

  • Oh, Kyung-Sik;Kim, Kyung-Ja;Jeong, Young-Keun
    • Journal of Powder Materials
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    • v.8 no.3
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    • pp.192-196
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    • 2001
  • Ag doped Hydroxyapatite powder in nano-scale was successfully synthesized either by co-precipitation or by ion exchange route. The fabricated powder was successfully dispersed through freeze drying due to the prevention of secondary particles. The antimicrobial effects of nano-HAp against E.coli was superior to micron ones not only in its strength but also in duration.

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Preparation of Ag-impregnated Porous Ceramic Beads and Antibacterial Properties (Ag 담지 다공성 세라믹 비드 제조 및 항균 특성)

  • Seo, Won-Hak;Han, Yo-Seop;Jeong, Young;Park, Jai-Koo
    • Journal of Korean Society of Environmental Engineers
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    • v.27 no.5
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    • pp.549-554
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    • 2005
  • Porous ceramic beads that had skeleton structure were impregnated with Ag from silver nitrate solution. Ag-impregnated porous ceramic beads were performed to evaluate the antibacterial properties on Escherichia coli and Staphylococcus aureus, also, compared with commercial silver-activated carbon on antibacterial activity. As concentration of silver nitrate solution increased, deposited-Ag contents of outer and inner surface of beads were increased. The size of silver particles supported on porous ceramic bead were range of $0.5{\sim}2.0\;{\mu}m$. The observed effects of the prepared Ag-impregnated beads on antibacterial activity are as follows : i) Antibacterial activity should be directly proportional to silver nitrate solution and reaction time. ii) The antibacterial activity against Escherichia coli was better than that against Staphylococcus aureus.

Effects of Ag Content on Co-evaporated Wide Bandgap (Ag,Cu)(In,Ga)Se2 Solar Cells (Ag 함량이 진공증발법으로 형성된 광금지대 (Ag,Cu)(In,Ga)Se2 태양전지에 미치는 영향)

  • Park, Joo Wan;Yun, Jae Ho;Cho, Jun Sik;Yu, Jin Su;Lee, Hi-Deok;Kim, Kihwan
    • Current Photovoltaic Research
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    • v.3 no.1
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    • pp.16-20
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    • 2015
  • Ag addition in chalcopyrite materials is known to lead beneficial changes in aspects of structural and electronic properties. In this work, the effects of Ag alloying of $Cu(In,Ga)Se_2$-based solar cells has been investigated. Wide bandgap $(Ag,Cu)(In_{1-x},Ga_x)Se_2$ (x = 0.75~0.8) films have been deposited using a three-stage co-evaporation with various Ag/(Ag+Cu) ratios. With Ag alloying the $(Ag,Cu)(In_{1-x},Ga_x)Se_2$ (x~0.8) films were found to have greater grainsize and film thickness. Device were also fabricated with the $(Ag,Cu)(In_{1-x},Ga_x)Se_2$ (x~0.8) films and their J-V and quantum efficiency measurements were carried out. The highest-efficiency $(Ag,Cu)(In_{1-x},Ga_x)Se_2$ solar cell with Eg > 1.5 eV had an efficiency of 12.2% with device parameters $V_{OC}=0.810V$, $J_{SC}=21.7mA/cm^2$, and FF = 69.0%.

Studies on the Interfacial Reaction between Electroless-Plated UBM (Under Bump Metallurgy) on Cu pads and Pb-Sn-Ag Solder Bumps (Cu pad위에 무전해 도금된 UBM (Under Bump Metallurgy)과 Pb-Sn-Ag 솔더 범프 계면 반응에 관한 연구)

  • Na, Jae-Ung;Baek, Gyeong-Uk
    • Korean Journal of Materials Research
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    • v.10 no.12
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    • pp.853-863
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    • 2000
  • In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

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Optical energy band gap of the conductive $AgGaSe_2$ layers

  • You, Sang-Ha;Hong, Kwang-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.46-46
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    • 2009
  • The photoconductive $AgGaSe_2$(AGS) layers were grown by the hot wall epitaxy method. The AGS layer was confirmed to be the epitaxially grown layer along the <112> direction onto the GaAs(100) substrate. The band-gap variation as a function of temperature on AGS was well fitted by $E_8(T)=1.9501-8.37{\times}10^{-4}T^2/(T+224)$. The band-gap energy of AGS obtained at 293 K was determined to be 1.8111 eV.

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Structural and Optical Properties of Multilayer Films of IGZO / Ag / IGZO for Low Emissivity Applications (Low-e용 산화물 다층박막 IGZO/Ag/IGZO의 구조적, 광학적 특성 분석)

  • Wang, Hong Rae;Kim, Hong Bae;Lee, Sang Yeol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.4
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    • pp.321-324
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    • 2013
  • In this study, The RF magnetron sputter and evaporator was on glass substrates 30 mm ${\times}$ 30 mm OMO multilayer thin film structure is applied to the low-e. Structural and optical properties, a thin film was produced, the variable was placed into a variable deposition time of the oxide layer. According to the XRD measurement results there is no peak that satisfies the Bragg's law ($2dsin{\theta}=n{\lambda}$) which confirmed that it is an amorphous structure. RMS value of the results of the AFM measurement, has a roughness of less than 2 nm. transmittance measurements results, visible light region an average 80%, IR region 40% showed.

Preparation and Characterization of Biopolymer-Based Nanocomposite Films: Chitosan-Based Nanocomposite Films with Antimicrobial Activity

  • Rhim, Jong-Whan
    • 한국포장학회:학술대회논문집
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    • 2006.11a
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    • pp.54-73
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    • 2006
  • Four different types of chitosan-based nanocomposite films were prepared using a solvent casting method by incorporating with four types of nanoparticles, i.e., an unmodified montmorillonite (Na-MMT), an organically modified montmorillonite (Cloisite 30B), a Nano-silver, and a Ag-zeolite (Ag-Ion). X-ray diffraction patterns of the nanocomposite films indicated that a certain degree of intercalation was formed in the nanocomposite films, with the highest intercalation in the Na-MMT-incorporated films followed by films with Cloisite 30B and Ag-Ion. SEM micrographs showed that in all the nanocomposite films, except the Nanosilver-incorporated one, nanoparticles were dispersed homogeneously throughout the chitosan polymer matrix. Consequently, mechanical and barrier properties of chitosan films were affected through intercalation of nanoparticles, i.e., tensile strength (TS) increased by 7-16%, while water vapor permeability (WVP) decreased by 25-30% depending on the nanoparticle material tested. In addition, chitosan-based nanocomposite films, especially silver-containing ones, showed a promising range of antimicrobial activity.

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