• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.81-84
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• 1995

A reliable bonding between two silicon wafers, regularly grooved and non-grooved, was done by the direct boning technology, It is Presented that high structural duality was realized not only at the bended interface but in the bulk, commensurate with the filling of artificial grooves, which would be attributed to the dislocation-gettering capability of groove free-surfaces during annealing. The groove filling would be explained with mass-transport phenomena assisted by the dislocation movement from initial contact boundaries toward groove surfaces. Intrinsic voids can be easily removed by aid of the grooves. The proposed method yielded also an intimate bonding not only between {111} wafers strongly misoriented and slightly inclined to {111} basal plane but even between {111} and {100} orientation wafers.

• Restorative Dentistry and Endodontics
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• v.26 no.4
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• pp.316-325
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• 2001

The purpose of this study was to evaluate the effect of adhesive curing timing on the direction of polymerization shrinkage of light-curing composite resin. In this study, the curing times of adhesive and composite resin were measured by differential scanning calorimeter(DSC). 28 extracted human molars were embedded in clear resin and box-type cavities were prepared. Based on DSC data, the experimental teeth were divided into 4 groups. Group 1: no bond; Group 2: late curing; Group 3: Intermediate curing; Group 4: Early curing. After treating with adhesive, the buccal cavities were filled with Z-100 hybrid composite resin and the lingual ones were filled with AEliteflo flowable composite resin. The depressions at the surface were measured by surface profilometer, then the specimens were embedded in clear resin and sectioned. Impressions were obtained and used to get epoxy resin replicas. The epoxy replicas were gold-coated and observed under SEM. Average Maximum Gap(AMG), Gap Proportion(GP), Average Marginal Index(AMI) were used to compare the shrinkage gap of each group. The results were statistically analyzed using the Kruskal-Wallis One Way ANOVA, Student-Newman-Keuls method. The results of this study were as follows. 1. Average Maximum Gap, Gap Proportion, Average Marginal Index and depression at the surface or Z-100 hybride composite resin were smaller than those of AEliteflo flowable composite resin(P<0.05). 2. When the bonding between composite resin and tooth structure was strong, the shrinkage gap was small, and depression at the surface was deep(P<0.05). 3. In the well-bonded group, light-curing composite resin shrank toward bonded cavity wall, not toward light source. The result suggested that the direction of polymerization shrinkage was affected by the quality of bonding in the dentin-resin interface. The strong was the bonding between composite resin and tooth structure, the smaller was the gap and the deeper was the depression at the surface. Then the flow to compensate the polymerization shrinkage proceeded from surface to bonded cavity wall.