• Journal of the Korean Wood Science and Technology
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• v.15 no.1
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• pp.1-11
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• 1987

A kraft black liquor obtained from pulping of pine (Pinus densiflora Sieb et Zucc) was used for producing three kinds of adhesive such as black liquor-phenol formaldehyde resin, methyloeated kraft lignin-phenol formaldehyde resin, and lignin cake-phenol resin. In case of producing black liquor-phenol formaldehyde resin, about 60 percent of the phenolic resin could be replaced by black liquor. Also the optimal press condition appeared to be $160^{\circ}C$ for 7 min. (l5.77Kg/$cm^2$ in dry test, 8.54Kg/$cm^2$ in 4 hr. boil test). Phenol could be substituted up to 80-90 percent by methylolated kraft lignin. The suitable conditions of factors affecting bond quality were pH to 2.6, methanol as solvent and 0.2ml formaldehyde per 1g of the adhesives, respectively. The optimal press condition was $150^{\circ}C$ for 4 min. (188.54Kg/$cm^2$ in dry test, 10.08Kg/$cm^2$ in 4 hr. boil test). In preparing lignin cake-phenol resin, a suitable mixing ratio of phenol to powered kraft lignin was one to one by weight. The optimal press condition was $150^{\circ}C$ for 4 min.(18.46Kg/$cm^2$ in dry test, 12.31Kg/$cm^2$ in 4 hr. hoil test).

• Journal of the Korean Society for Precision Engineering
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• v.32 no.10
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• pp.897-902
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• 2015

This study reports on a uniform resin coating method by using a doctor blade type dispenser. For high productivity, continuous imprint-lithography has been studied, and developed fabrication systems are used in several applications such as anti-reflection films, dry adhesives, and water collecting surfaces. In the continuous fabrication field, researchers have typically focused on patterning and demolding procedures. During the roll-to-roll fabrication process, however, the uniform resin coating process is also important in order to obtain a high quality product, which can be evaluated by uniform thickness, precise geometric expressions, and a thin residual layer. To achieve these, a doctor blade type dispenser was designed and fabricated. As a result, thickness of coated resin was well controlled by modulating the flow rate of the resin and blading gap. In addition, a very thin layer coating process (${\sim}10{\mu}m$) was achieved by softly contacting the blade on the substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.29 no.3
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• Journal of Korean Society of Forest Science
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• v.51 no.1
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• pp.41-50
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• 1981

The purpose of this study was to evaluate the substitutional possibility of new extender instead of wheat flour, which is extending for plywood adhesives in Korea. As the extending materials corn stalk, pine bark, Pitch and Korean pine leaves, wheat, or wood flour were selected and prepared for the extending powders, dried at $103{\pm}2^{\circ}C$ during 24 hours in the drying oven, followed by being pulverized into 60-100 mesh powder. The extenders were mixed with urea formaldehyde resin in the ratio of 5, 10, 15 or 20%. After plywoods were manufactured by the above extended ratios, dry and wet shear strength and wood failures were analyzed and discussed. The results at the study may be summarized as follows ; 1. In urea formaldehyde resin dry shear strength in plywood extended by wheat flour showed the highest value. 2. Among the extenders in 10 and 20% extension of urea formaldehyde resin wet shear strength of wood flour was higher than that of wheat powder. They had no significant difference statistically. 3. Among the extenders of 5% extension of water soluble phenol formaldehyde resin dry shear strength of plywood extended by Korean pine leaf powder showed the highest value, while wheat powder showed the highest value among 10, 15 and 20% extentions. 4. In water soluble phenol formaldehyde resin the best results of wet shear strength showed in wheat powder. 5. Among the extenders in 15 and 20% extension of water soluble phenol formaldehyde resin, dry and wet shear strength in plywood of corn stalk powder were the highest value next to wheat powder.

• Journal of the Korean Wood Science and Technology
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• v.34 no.6
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• pp.29-35
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• 2006

This stud y was conducted to investigate the bonding strength of plywood bonded with fatty acid-glycerol-pMDI adhesives with equivalent ratios of 1:1:2, 1:1:3, 1:1:4, 1:1:5, and 1:1:6. With veneer moisture contents of 0%, 3%, 5%, 8% and 15%, the bonding strengths exceeded the requirement of Korean plywood standard of $7.0kgf/cm^2$ with values of $13.7kgf/cm^2$, $11.6kgf/cm^2$, $11.2kgf/cm^2$, $9.8kgf/cm^2$, and $7.4kgf/cm^2$, respectively at fatty acid-glycerol-pMDI ratio of 1:1:2. With veneer moisture content of 30%, the bonding strengths exceeded th e requirement of Korean plywood standard of $7.0kgf/cm^2$, when fatty acid-glycerol-pMDI ratios were 1:6. Finally for satisfying the Korean plywood standard, the ratio of MDI in fatty acid-glycerol-pMDI should be increased with increasing of veneer moisture content.

• Journal of Conservation Science
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• v.31 no.1
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• pp.1-11
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• 2015

Seated Amitabha Triad at Muwisa Temple (Treasure No. 1312) had been known as wooden Buddha statue, but a precise safety inspection revealed that the statue is terracotta Buddha statue made with clay. The clay layer of Amitabha Triad was conserved due to its severe damage. In this study, experiments were conducted to produce the most appropriate filler for the conservation treatment of the seated Amitabha Triad. Mixed clay samples with various ratios were produced and surface hardening state, crack, color change, and shrinkage of the samples during dry process were measured. Loess, fine sand powder, and cotton were used to produce the mixed clay for the filler with six different ratios and then 12 different concentration glues made with glutinous rice glue, Pachymeniopsis Elliptica glue, and animal glue were added as adhesives. Total 72 types of samples were prepared and comparative study was conducted. As a result, when the mixed clay contains 2.5% cotton compared to the weight per cent of loess and fine sand powder and also loess and fine sand in the mixed clay have a 15:1 ratio, the mixed clay had the lowest shrinkage. Animal glue is considered as an appropriate glue since it had small color change, low physical property change and shringkage. Therefore, mixed clay (loess:fine sand=15:1) mixed with 15ml animal glue is likely to be a suitable filler for conservation treatment of the seated amitabha triad at the Muwisa Temple.

• Journal of Korean Society of Forest Science
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• v.60 no.1
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• pp.51-57
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• 1983

Properties and glue shear strength of each water soluble rues-phenol copolymer adhesive and phenolic resin adhesive were examined as a high temperature curing binder through the manufacture of plywood made of Kapur veneer. The former has different molar ratio and the latter was made from different catalyst method. The results are summarized as follows: 1) Specific gravities of air dried plywood manufactured from each adhesive ranged from 0.67 to 0.82 and their moisture contents met the K.S. standard 2) In dry and wet shear strength, adhesives with 60 percent of non volatile content showed higher values than those with 50 percent except phenolic resin. Urea-phenol copolymer resin with 20 percent of phenol content exhibited the highest, and that with 70 percent the lowest. Filling effect of wood flour on the bonding strength is great in urea-phenol copolymer resin with more than 50 percent of phenol content, especially significant in 50 percent of non volatile content including alkali catalyst phenolic resin. Alkali and acid catalyst methods were the highest among the adhesive manufacture methods. In wet strength, urea resin belongs to the lowest group. 3) In glue shear strength after boiling and drying test, no method for manufacturing phenolic formaldehyde resin adhesive was stronger than alkali and acid catalyst methods. Phenolic resin made from alkali catalyst method needs a wood flour filler to improve the bonding quality. Urea-phenol copolymer resin with 10 percent of phenol content showed the reasonable water resistance.