• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Design & Manufacturing
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• 제17권4호
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• pp.42-51
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• 2023

In this study, we investigated the injection molding technology of thick-walled light guides, which are parts that control the light source of automotive lamps. Through injection molding analysis, the gate position that can minimize product shrinkage and deformation was selected, and a mold reflecting the analysis results was manufactured to evaluate the effect of injection speed and holding pressure on transferability during micro-pattern molding through experiments. When designing an injection mold for products with varying thicknesses, it was found that installing the gate on the side of the thicker part was advantageous for reducing volume shrinkage and deformation. It was found that the effect of shrinkage due to thickness may be greater than the position of the gate on pattern transferability. The pattern transfer error decreased as the injection speed and holding pressure increased, and it was found that increasing the injection speed was relatively effective.