• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1632-1635
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• 2007

We developed a novel growth method of CNTs on metal substrate for device applications, deposited by a triode direct current plasma enhanced chemical vapor deposition (dc-PECVD). With resist-assisted patterning (RAP) method, we had grown CNTs on metal substrate, which were strongly bonded with metal substrate.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.348-351
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• 2007

A pure polyimide substrate and polyimide substrate with nano-silica additive have been formed on glass by coating. The a-Si:H TFT arrays have been formed on such polyimide substrate for driving TNLCD.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.873-878
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• 2008

Doosan Mecatec has developed alignment system for Organic Light-Emitting Diode (OLED) display production using large size substrate. In the present article, The alignment system between the substrate and the mask, which is a core technology for producing the OLED product using the fourth-generation substrate with $730{\times}920mm^2$ or more, will be described by dividing into a substrate loader, a magnet unit, a CCD camera, etc. The substrate loader is optimized through the simulation where the central portion of the substrate droops by about 1.5mm by clamping each of a long side (920mm direction) and a short side (730mm direction) thereof by 6 point and 4 point. A magnet unit using a sheet type of rubber magnet is constituted and a CCD camera model with the specifications capable of minimizing the errors between a clear image and the same image is selected. The system to which an upward evaporation technique of small molecular organic materials will be applied has been developed so that repeatability and position accuracy becomes ${\pm}1{\mu}m$ or less using an UVW type of stage. Also, the vision accuracy of the CCD camera becomes ${\pm}1{\mu}m$ or less and the align process TACT becomes 30sec. or less so that the final alignment accuracy between the substrate and the mask becomes ${\pm}3{\mu}m$ or less. In order to meet an extra-large glass substrate, an evaporation system using an extra-large AMOLED substrate has been developing through a vertical type of an alignment system.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.886-888
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• 2009

We fabricated flexible electronic paper display(EPD) by using toner particles on plastic (PC) substrate. We observed the relationship between contrast ratio and changes of rib structures. One is a fabrication of ribs on bottom substrate. The display with ribs on bottom substrate had higher contrast ratio about 46% than display with ribs on top substrate. The other is a change of density of rib. The less density of ribs fabricated, the higher the contrast ratio become.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.995-997
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• 2005

A plastic substrate for flexible display is developed. The gas barrier and optical properties of the substrate is improved through depositing silicon oxide/nitride layer and coating polymer layer on plastic film by sputtering process and wet coating process. Roll to roll processes will guarantee the productivity in the whole production process of the plastic substrate.

• Journal of Information Display
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• v.13 no.2
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• pp.55-59
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• 2012

In this paper, a concept of an integrated elastomer substrate for a three-dimensional (3D) liquid crystal display based on the integral-imaging method is presented. The elemental lens array and columnar spacers were integrated into one of the two substrates, an elastomer substrate, through an imprinting process. The integrated elastomer substrate was capable of maintaining the uniform liquid crystal (LC) cell gap and promoting homeotropic LC alignment without any surface treatment. The monolithic approach reported herein will provide a key component for 3D displays with enhanced portability through a more than 40% weight reduction compared with the conventional integral-imaging method.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.617-619
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• 2008

Inorganic-organic hybrid multilayers were formed on the plastic substrate to enhance the barrier properties of substrate to water vapor and oxygen transport. Plasma pretreatment of substrate with $Ar/O_2$ lead to adhesion improvement and the densification of inorganic layer on the substrates. Combination of $SiO_xN_y$ layer and silanenanoclay composite layer offered quite good barrier properties (WVTR and OTR) to PES substrate.

• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.32-35
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• 2002

In this work, we test electrode material of TFD (Thin Film Diode) device subject to flexible substrate. Al, that is ductile metal, was proper for flexible electrode to fabricate flexible display. The fabricated devices had symmetric electrode structure on both sides of insulation layer. The electrode was made of ductile Al so as to reduce the mismatch of properties between the electrode and substrate. The TFD device was successfully fabricated applying our own etch-free process. Electrical properties were improved by post-annealing.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1125-1128
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• 2007

The laminating technique for developing flexible liquid crystal display was demonstrated by using a thin UV curable polymer film and a plastic substrate with patterned polymer wall structure. We adopted the rigid wall structure to provide a solid mechanical support for the stable molecular alignment of liquid crystals (LCs) in the device. The cover film was prepared to have an ability of aligning LC molecules by patterning a micro-groove structure using the soft-lithographic process. These two substrates can be assembled tightly by the laminating and one-step UV irradiation process because of the adhesive nature of the used UV curable polymers. Proposed method can be used to fabricate the flexible LC display with simplicity and also be applicable for a cost-effective roll-to-roll process.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.439-442
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• 2006

We evaluated a-Si:H TFTs fabricated on polyimide substrate (PI) at the highest temperature of $160^{\circ}C$ with uniaxial and tensile strain to imitate flexible display. With tensile strain, the threshold voltage of a-Si:H TFTs have positive shift due to extra dangling bond formation in a-Si:H layer. However, no significant degradation of the subthreshold swing and effective mobility with tensile strain of a-Si:H TFTs indicates the similar level of band tail state. The metal wire with the width of $10\;{\mu}m$ for connection on flexible substrate can sustain with curvature radius 2.5 cm.