• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.405-406
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• 2006

Raw materials from different sources, produced by a given process and having equal chemical composition, are supposed to be equivalent. The differences in sintering behavior have been investigated on P/M steels obtained from four diffusion-bonded powders (Fe + Ni + Cu + Mo) on atomized iron base, at the same alloy contents. Two levels of carbon and two sintering conditions have been investigated. Dimensional changes, C content, hardness, microhardness pattern, universal hardness, fractal analysis, pore features, microstructure features, and rupture strength have been compared to characterize different raw materials. The results show that the claimed equivalence is not confirmed by experimental data.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.42-44
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• 2004

산업용 가스터빈의 버켓용 Ni기 초내열합금 GTD-111의 수리기술로서 천이액상확산접합법(Transcient Liquid Diffusion Bonding Process, 이하 TLP접차법)이 각광받고 있다. 그러나 이 방법은 등온응고 완료까지 장시간이 소요되므로 접합시간을 단축할 수 있는 공정 개발이 필요하다. (중략)

• Proceedings of KOSOMES biannual meeting
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• 2017.11a
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• pp.38-38
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• 2017

• Proceedings of the Membrane Society of Korea Conference
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• 1998.10a
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• pp.73-74
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• 1998

1. Introduction : We have researched to separate water effectively from aqueous pyridine solution. In our previous papers, we have proposed new separation mechanism, in-situ complex, which is different from solution-diffusion and accelerated transport by hydrogen bonding. We have adopted in-situ complex mechanism to membranes containing phosphoric acids as well as acrylic acid and sulfonic acid in copolymer for dehydration of pyridine.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.1
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• pp.15-21
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• 2008

SiC has an excellent resistance to oxidation and corrosion, high temperature strength and good thermal conductivity. However, it is difficult to density because of its highly covalent bonding characteristics. Hot-press sintering process was applied to fabricate fully densified SiC ceramics with carbon and boron addition as a sintering additive. The addition of carbon improved the mechanical properties of SiC because it could induce a fine and homogeneous microstructure by the suppression of abnormal growth of SiC grain. Also, the addition of carbon could control the phase transformation of SiC. The phase transformation of 6H to 4H increased with sintering temperature but the addition of carbon decreased that kind of phase transformation.

• Journal of Welding and Joining
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• v.25 no.5
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.321-327
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• 2001

Ti-Si-N films obtained by using RF reactive sputtering of targets with various Ti/Si ratios in a $N_2(Ar+N_2)$ gas mixture have been investigated in terms of films resistivity and diffusion barrier performance. The chemical bonding state of Si in the Ti-Si-N film which contained a higher Si content was in the form of amorphous $Si_3N_4$, producing increased film resistivity with increased $N_2$flow rate. Lowering the Si content in the deposited Ti-Si-N film favored the formation of crystalline TiN even at low $N_2$flow rates, and leads to low film resistivity. In addition increasing the N content led to Ti-Si-N films having a higher density and compressive stress, suggesting that the N content in the films appear to be one of the most important factors affecting the diffusion barrier characteristics. Consequently, we proposed the optimum composition in the range of 29~49 at.% of Ti, 6~20 at.% of Si, and 45~55 at.% of N for the Ti-Si-N films having both low resistivity and excellent diffusion barrier performance.

• Restorative Dentistry and Endodontics
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• v.23 no.2
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• pp.701-709
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• 1998

Many dental composites are Bis-GMA based resin which diluted with the more fluid monomer triethylenglycol dimethacrylate(TEGDMA). TEGDMA is often present in exess so that some quantity remains unreacted following photo-initiated polymerization. TEGDMA is a component of some resin composites which contributes to their cytotoxicity. The presence of dentin between resin composite and pulp space reduce the cytotoxicity in vitro. The root system from extrcted human third molar was removed and then a circular occlusal cavity 4mm in diameter was prepared, leaving a remaining dentinal thickness to the roof of the pulpal chamber within the range 1.0-1.5mm. Dentine was treated with 37% phosphoric acid prior to Z 100 placement without using bonding resin(group 1). In group 2, SMP(Scotchbond Multi Purpose) primer, bonding resin prior to Z 100 placement were applied sequently. In group 3, moulds with internal dimensions 4mm diameter by 2mm depth were used to contain the composite alone with an equvalent mass on tooth model, and then they were immersed directly into water. The purpose of this study is to evaluate the release rate and quantity of TEGDMA with or without the application of bonding resin. Both release rate and total cumulative amount of TEGDMA for the three groups were determined using reversed-phase HPLC at times up to 10 days. The results were as follows: 1. All experimental groups showed the highest rate of release was in the first sample period(0-4.32 min) and the rate of release declined exponentially thereafter. 2. The maximum release rate and total cumulative account of TEGDMA in the tooth model of group 1 and group 2 with the use of SMP bonding resin were reduced however ther were no significant differences between these groups(P>0.05). 3. In the first sample period(0-4.32 min), the rate of release of TEGDMA from composite resin in group 3 immersed directly into water was significantly higher than that in group 1 and group 2 of tooth model(P<0.05). Conclusively, TEGDMA diffusion from Z 100 resin was not effectively prevented by the presence of dentin in spite of using the SMP bonding resin.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.6
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• pp.1013-1017
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• 2012

Advanced composite-sintered bushings are widely utilized in the areas of excavators and injection molding machines as a journal bearing. Since the bearings are mainly used under high loads, service life should be long and the stored oil of inner bushings has to be continually fed into the bearing. The composite-sintered bushings are consisted of the two different materials; outer steel materials and inner porous sintered materials respectively. High temperature diffusion bonding has been applied for holding the both materials of the bushing together. Therefore, it is very important that the bonding reliability has to be assured and evaluated in manufacturing process. Finite element method (FEM) is performed in order to evaluate the minimum allowable flaw sizes that are possibly generated in the composite-sintered bushings. Additionally, the composite-sintered bushings were undergone ultrasonic C-scan tests to find out the size of inherent flaws through artificially simulated UT signal analysis.