• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.152-153
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• 1994

A recessed $n^{+}$-p junction diode with the serf-aligned structure is proposed and fabricated by using the polysilicon as an $n^{+}$ diffusion source. The diode structure can be applicable to the emitter-base formation of high performance bipolar device and the $n^{+}$ polysilicon emitter has an important effect on the device characteristics. The considered parameters for the polysilicon formation are the deposition condition $As^{+}$ dose for the doping of the polysilicon, and the annealing using RTP system. The vertical depth profiles of the fabricated diode are obtained by SIMS. The eleotrical characteristics are analyzed in trims of the ideality factor of diode (n), contact resistance arid reverse leakage current. The $As_{+}$ dose for the formation of good junction is current. The $As^{+}$ dose for the formation of goodjunctions is about 1∼2${\times}$$10^{16}$$cm^{-2}$ at given RTA condition ($1100^{\circ}C$, 10 sec). The $n^{+}$-p structure is successfully applied to the self-aligned bipolar device adopting a single polysilicon technology.

• 센서학회지
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• 제14권2호
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• pp.131-135
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• 2005

This paper describes the ohmic contact formation of single crystalline 3C-SiC thin films heteroepitaxially grown on Si(001) wafers. In this work, a TiW (Titanium-tungsten) film as a contact matieral was deposited by RF magnetron sputter and annealed with the vacuum and RTA (rapid thermal anneal) process respectively. Contact resistivities between the TiW film and the n-type 3C-SiC substrate were measured by the C-TLM (circular transmission line model) method. The contact phases and interface the TiW/3C-SiC were evaulated with XRD (X-ray diffraction), SEM (scanning electron microscope) and AES (Auger electron spectroscopy) depth-profiles, respectively. The TiW film annealed at $1000^{\circ}C$ for 45 sec with the RTA play am important role in formation of ohmic contact with the 3C-SiC substrate and the contact resistance is less than $4.62{\times}10^{-4}{\Omega}{\cdot}cm^{2}$. Moreover, the inter-diffusion at TiW/3C-SiC interface was not generated during before and after annealing, and kept stable state. Therefore, the ohmic contact formation technology of single crystalline 3C-SiC using the TiW film is very suitable for high temperature MEMS applications.

• Journal of Electrical Engineering and Technology
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• 제5권1호
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• pp.146-150
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• 2010

A new type of dye-sensitized solar cell (DSC) based on a porous type Ti electrode without using a transparent conductive oxide (TCO) layer is fabricated for low-cost high-efficient solar cell application. The TCO-free DSC is composed of a glass substrate/dye-sensitized $TiO_2$ nanoparticle/porous Ti layer/electrolyte/Pt sputtered counter electrode. The porous Ti electrode (~350 nm thickness) with high conductivity can collect electrons from the $TiO_2$ layer and allows the ionic diffusion of $I^-/I_3{^-}$ through the hole. The vacuum annealing treatment is important with respect to the interfacial necking between the metal Ti and porous $TiO_2$ layer. The efficiency of the prepared TCO-free DSC sample is about 3.5% (ff: 0.48, $V_{oc}$: 0.64V, $J_{sc}$: 11.14 mA/$cm^2$).

• 열처리공학회지
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• 제17권3호
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• pp.139-145
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• 2004

Equal channel angular pressing (ECAP) technique had been adapted to the Mg alloy (AZ31) for achieving effective grain refinement through severe deformation. The average grain size of $2.5{\mu}m$ could be obtained after 4 passes. The stability of the ECAPed structure at elevated temperatures was examined by annealing the ECAPed materials over a wide range of temperature between 473 and 748 K. The average activation energy, Q, for static grain growth of 1, 2 and 3 passes was 33.7 kJ/mole (=0.25QL, activation for lattice diffusion). The abnormally low Q value in the lower temperature range may indicate that grain growth occurs in the unrecrystallized microstructure where non-equilibrium grain boundaries containing a large number of extrinsic dislocations exist. The yield stresses of the ECAPed alloys decreased whereas the elongations increased after the ECAP process. These results should be related to the modification of texture for easier slip on basal plane.

• 한국전기전자재료학회논문지
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• 제32권2호
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• pp.134-140
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• 2019

Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

• 한국표면공학회지
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• 제56권4호
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• pp.265-272
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• 2023

Photoelectrochemical (PEC) water splitting is one of the promising methods for hydrogen production by solar energy. Iron oxide has been effectively investigated as a photoelectrode material for PEC water splitting due to its intrinsic property such as short minority carrier diffusion length. However, iron oxide has a low PEC efficiency owing to a high recombination rate between photoexcited electrons and holes. In this study, we synthesized nanoporous structured iron oxide by anodization to overcome the drawbacks and to increase surface area. The anodized iron oxide was annealed in Ar atmosphere with different purging times. In conclusion, the highest current density of 0.032 mA/cm² at 1.23 V vs. RHE was obtained with 60 s of pursing for iron oxide(Fe-60), which was 3 times higher in photocurrent density compared to iron oxide annealed with 600 s of pursing(Fe-600). The resistances and donor densities were also evaluated for all the anodized iron oxide by electrochemical impedance spectra and Mott-Schottky plot analysis.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

• 한국진공학회지
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• 제7권1호
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• pp.17-23
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• 1998

RF magnetron co-sputtering법으로 PFN[$Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$]박막을 제조한 후 급속 열처리(rapid thermal annealing, RTA)하여 XRD(s-ray diffractometer)를 통한 박막의 상변 태 및 전기적 특성에 대하여 연구하였다. $SiO_2$/Si, ITO/glass, 및 Pt/Ti/$SiO_2$/Si기판에 PFN 박막을 증착시켰다. 기판의 변화에 따른 증착된 PFN박막의 조성변화는 관찰할 수 없었다. ITO/glass기판을 사용한 경우와 $SiO_2$/Si기판을 사용하여 증착시킨 PFN박막의 결정구조를 분석한 결과 ITO/glass기판에 증착한 시편이 perovskite상으로의 결정화가 더욱 우세하였다. 이는$SiO_2$기판의 경우 Pb의 확산에 의해 결정화가 잘 되지 못하기 때문이다. Pt/Ti/$SiO_2$/Si 기판 위에 증착시킨 PFN박막의 경우 perovskite상과 pyrochlore상이 공존하였다. Perovskite 상으로의 상변태에 대한 중요한 변수로는 열처리 온도와 Pb의 함량인 것이 확인되었으며, Pb의 함량이 화학양론적 조성비에 비해 5-10%정도 과량일수록 perovskite상으로의 상변태 온도가 낮아지고 상전이 정도가 향상되는 것으로 나타났으며, 급속 열처리 후 XRD를 이용 한 결정성 분석결과를 통해 결정한 perovskite상으로의 상전이 최저온도는 $500^{\circ}C$였다. Pb/(Fe+Nb)의 조성비가 1.17인 경우의 박막을 질소 분위기 하에서 $600^{\circ}C$로 30초간 급속열 처리 하였을 때 낮은 누설 전류 값과 1kHz에서 88의 유전 상수 값, 2.0$\mu$C/$\textrm{cm}^2$의 잔류 분극 값과 144kV/cm의 항전계 값을 얻었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.358-359
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• 2012

최근 분극 특성이 상이한 무분극 GaN 에피성장에 관한 심도 있는 연구와 함께 전자-전공 캐리어의 주입 및 캐리어의 거동, 방출되는 편광 특성 및 다양한 물리적 특성들에 대해 보고되고 있으며, 광학적 특성 및 물리적 특성의 확보를 위한 많은 연구가 활발히 진행 중이다 [1]. GaN의 ohmic 접촉(ohmic contact)의 형성은 발광 다이오드(light emitting diode), 레이저 다이오드(Laser), 태양전지(solar cell)와 같은 고신뢰도, 고효율 광전자 소자를 제조하기 위해서는 매우 중요하다 [2]. 그러나 이와 함께 병행 되어야 할 무분극 p-GaN 의 ohmic contact에 관한 연구는 많이 이루어지고 있지 않는 실정이다. 따라서 본 논문에서는 r-plane 사파이어 기판 상에 성장된 p-GaN에서의 ohmic 접촉 형성 연구를 위하여 Ni/Au ohmic 전극의 접촉저항 특성을 연구하였다. 본 실험에서는 성장된 a-plane GaN의 Hole농도가 $3.09{\times}1017cm3$ 인 시편을 사용하였다. E-beam evaporation 장비를 이용하여 Ni/Au를 각각 20 nm 그리고80 nm 증착 하였으며 비접촉저항을 측정하기 위해 Circle-Transfer Length Method (C-TLM) 패턴을 사용하였다. 샘플은 RTA (Rapid Thermal Annealing)를 사용하여 $300^{\circ}C$에서 $700^{\circ}C$까지 온도를 변화시키며 전기적 특성을 비교하여 그림 1(a) 나타내었다. 그림에서 알 수 있듯이 $400^{\circ}C$에서 가장 낮은 비접촉저항 값인 $6.95{\times}10-3{\Omega}cm2$를 얻을 수 있음을 발견하였다. 이 때의 I-V curve 도 그림1(b)에 나타낸 바와 같이 열처리에 의해 크게 향상됨을 알 수 있다. 그러나, $500^{\circ}C$ 이상 온도를 증가시키면 다시 비접촉 저항이 증가하는 것을 관찰하였다. XRD (x-Ray Diffraction) 분석을 통하여 $400^{\circ}C$ 이상열처리 온도가 증가하면 금속 표면에 $NiO_2$가 형성되며, 이에 따라 오믹특성이 저하 된다고 사료된다. 또한 $Ni_3N$의 존재를 확인 하였으며 이는 nonpolar surface의 특성으로 인해 nitrogen out diffusion 현상이 동시에 발생하여 계면에는 dopant로 작용하는 질소 공공을 남기고 표면에 $Ni_3N$을 형성하여 ohmic contact의 특성이 저하되기 때문인 것으로 사료된다.

• 한국정보통신학회논문지
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• 제8권7호
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• pp.1448-1452
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• 2004

비정질실리콘은 빛을 받으면 자유전자와 자유정공이 무수히 발생하여 전류 또는 전압의 형태로 나타나는 광전변환 재료이다. 이를 광다이오드로 사용하기 위해서는 금속 박막(Thin film)과 결합하여 쇼트키 다이오드로 만드는 기술이 효과적이다. 본 연구에서는 광다이오드의 신뢰성 및 특성을 개선하기 위하여 크롬실리사이드를 기존의 방식과 달리 하부 전극으로 크롬금속 박막을 증착한 후 그 위에 사일렌(SiH4)가스를 사용해서 PECVD (Plasma Enhanced Chemical Vapor Deposition) 진공 증착장비로 최적의 비정질실리콘 박막을 얇게 (100$\AA$) 만들어 열처리를 통하여 크롬실리사이드 박막을 형성 한 후 광다이오드 소자를 제조한다. 이렇게 형성된 크롬실리사이드 광 다이오드를 사용하여 암전류와 광전류를 측정찬 결과 기존의 방식보다 우수한 성능이 나타났고, 공정도 단순화 할 수 있었으며 그리고 신뢰성도 개선되었다.