• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Journal of Powder Materials
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• v.24 no.4
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• pp.326-331
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• 2017

The structural formation of inorganic nanoparticles dispersed in polymer matrices is a key technology for producing advanced nanocomposites with a unique combination of optical, electrical, and mechanical properties. Barium titanate ($BaTiO_3$) nanoparticles are attractive for increasing the refractive index and dielectric constant of polymer nanocomposites. Current synthesis processes for $BaTiO_3$ nanoparticles require expensive precursors or organic solvents, complicated steps, and long reaction times. In this study, we demonstrate a simple and continuous approach for synthesizing $BaTiO_3$ nanoparticles based on a salt-assisted ultrasonic spray pyrolysis method. This process allows the synthesis of $BaTiO_3$ nanoparticles with diameters of 20-50 nm and a highly crystalline tetragonal structure. The optical properties and photocatalytic activities of the nanoparticles show that they are suitable for use as fillers in various nanocomposites.

• Journal of the Korean Magnetics Society
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• v.19 no.6
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• pp.203-208
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• 2009

Magnetic and Ka-band absorbing properties have been investigated in Ti-Co substituted M-type barium hexaferrites with $BaTi_{0.5}Co_{0.5}Fe_{11}O_{19}$ composition. The ferrite powders were prepared by conventional ceramic processing technique and used as absorbent fillers in ferrite-rubber composites. The magnetic properties were measured by vibrating sample magnetometer. The complex permeability and dielectric constant were measured by using the WR-28 rectangular waveguide and network analyzer in the frequency range 26.5~40 GHz. For the Ti-Co substituted M-hexaferrites, the ferromagnetic resonance is observed at Ka-band (29.4 GHz). The matching frequency and matching thickness are determined by using the solution map of impedance matching. A wide band microwave absorbance is predicted with controlled ferrite volume fraction and absorber thickness.