• 대한원격탐사학회지
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• 제30권5호
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• pp.607-616
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• 2014

본 연구에서는 1967년부터 약 50년에 걸친 기간에 대하여 항공사진과 위성영상을 이용하여 진하해수욕장의 해안선 변화를 관측하였다. 해안선은 보정을 거친 영상으로부터 wet/dry 기법에 의해 추출하였고, DSAS에 의해 통계적으로 분석되었다. 그 결과, 1992년까지 회야강의 하구폐색이 심각하였으며, 이로 인해 북측 해안선의 침식이 진행되어왔다. 이후 하구폐색은 도류제 완공과 함께 완화되는 듯하였으나 하구에서 외해로 벗어난 지역에 토사의 퇴적은 계속되고 있으며, 북측 해안선의 침식현상은 완화됨에 반해 남측 해안선의 침식이 급속히 진행되고 있다. 따라서 본 연구지역의 경우 도류제건설과 준설 및 양빈만으로는 변화하는 해안선의 적절한 관리대책이 되지 못 할 것으로 판단된다. 향후 지속가능한 해안의 관리를 위해서는 해양환경뿐만 아니라 해안선 변화에 영향을 미칠 수 있는 유역하천의 유사유출 요인을 고려하여 근본적인 관리방안의 수립이 필요할 것으로 생각된다.

• 폴리머
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• 제28권4호
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• pp.305-313
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• 2004

본 연구는 나노 복화공정을 이용하여 마이크로 혹은 나노공정에 응용이 가능한 형상모형 제작공정 개발과 폴리디메틸실록산 (polydimethylsiloxane)를 이용하여 만들어진 형상모형의 몰드로 나노급 정밀도의 폴리디메틸실록산 형상을 복제하는 공정에 관한 것이다. 본 연구에서 제안한 나노 복화공정은 복잡한 형상모형 (pattern)이나 2차원 형상을 CAD 파일 없이 비트맵 그림파일을 이용하여 직접적으로 200nm 정밀도를 가지는 형상으로 만들 수 있다. 형상모형은 펨토초 레이저를 이용하여 이광자 흡수 중합법으로 제작하기 때문에 형상의 정밀도는 레이저 범의 회절한계 이하로 얻을 수 있다. 이렇게 제작된 마스터 형상모형은 본 연구에서 제안한 진공압력차이법으로 폴리디메틸실록산 몰드를 제작하여 기존의 제작방법에 비하여 정밀한 제작이 가능함을 보였으며 또한 제작된 몰드를 이용하여 양각의 플리디메틸실록산 스탬프를 제작하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.162-162
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• 2000

We have studied magnetic properties of Co/Pt multilayered films which have attracted great interest as high-density magneto-optical (MO) recording media due to their good MO properties. For this study, [Pt(45 )/Co(35 )]$\times$8 films were deposited with a Pt buffer layer of 60 on Si(100) substrate by alternating electron-beam evaporation in a high vacuum and were ion beam mixed by using 80keV Ar+ at 25$0^{\circ}C$. Especially, an external magnetic field was added to help changing magnetic property during ion beam mixing (IBM). The intermixing of Co and Pt layers after IBM was confirmed with Rutherford Backscattering Spectroscopy (RBS) and Transmission Electron Microscopy (TEM). The MO property of the film was measured with magneto-optical Kerr spectrometer and the change of magnetic easy axis in the film plane was observed from Ker loop data. This anomalous result might be correlated with the change of atomic structure due to the intermixing effect.

• 한국진공학회지
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• 제20권3호
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• pp.195-199
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• 2011

RF 마그네트론 스퍼터와 DC 마그네트론 스퍼터를 병행하여 ITO/Au/ITO, ITO/Cu/ITO, 그리고 ITO/Ni/ITO 박막을 유리기판 위에 증착하였다. 증착 후 진공열처리를 통하여 층간 금속 층이 ITO박막의 메탄올 검출 민감도에 미치는 영향을 분석하였다. 모든 박막센서의 두께는 100 nm로 동일하게 ITO 50 nm/metal 10 nm/ITO 40 nm로 제작되었고 메탄올 농도는 100에서 1,000 ppm까지 달리하였다. ITO/Au/ITO 박막센서가 가장 높은 민감도를 보임으로써 ITO/Au/ITO 다층박막이 기존의 ITO메탄올 센서를 대체할 수 있는 센서임을 확인하였다.

• 한국재료학회지
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• 제9권12호
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• pp.1216-1221
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• 1999

TMGa와 유전체 장벽방전에 기초한 질소함유 활성종을 이용하여 (0001) 사파이어 기판위에 GaN 박막을 저온에서 성장시켰다. III-V 질소화합물 반도체의 에피막 성장에 있어서 암모니아는 유기금속 화학증착법에서 지금까지 알려진 가장 보편적인 질소 공급원이며 충분한 질소공급을 위해 $1000^{\circ}C$ 이상의 고온 성장이 필수적이다. GaN 박막을 비교적 저온에서 성장시키기 위하여 질소 공급원으로 암모니아 대신 유전체 장벽방전을 이용하였다. 유전체 장벽방전은 전극사이에 유전체 장벽을 설치하여 arc를 조절하는 방전이며 수 기압의 높은 공정압력보다 훨씬 높으므로 기판표면까지 전달하는데도 이점이 있다. GaN 박막의 결정성과 표면형상은 성장온도, 완충층에 따라 변화하였으며, $700^{\circ}C$의 저온에서도 우수한 (0001) 배향성을 갖는 GaN 박막을 성장할 수 있었다.

• 한국재료학회지
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• 제11권2호
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• pp.71-75
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• 2001

The reaction stability of nickel with side-wall materials of SiO$_2$ and Si$_3$N$_4$ on p-type 4"(100) Si substrate were investigated. Ni on 1300 $\AA$ thick SiO$_2$ and 500 $\AA$ - thick Si$_3$N$_4$ were deposited. Then the samples were annealed at 400, 500, 750 and 100$0^{\circ}C$ for 30min, and the residual Ni layer was removed by a wet process. The interface reaction stability was probed by AES depth Profiling. No reaction was observed at the Ni/SiO$_2$ and Ni/Si$_3$N$_4$, interfaces at 400 and 50$0^{\circ}C$. At 75$0^{\circ}C$, no reaction occurred at Ni/SiO$_2$ interface, while $NiO_x$ and Si$_3$N$_4$ interdiffused at Ni/Si$_3$N$_4$ interface. At 100$0^{\circ}C$, Ni layers on SiO$_2$ and Si$_3$N$_4$ oxidized into $NiO_x$ and then $NiO_x$ interacted with side-wall materials. Once $NiO_x$ was formed, it was not removed in wet etching process and easily diffused into sidewall materials, which could lead to bridge effect of gate-source/drain.

• 한국표면공학회지
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• 제51권4호
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• pp.224-230
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• 2018

In this study, Mg films were prepared on hot dip aluminized steel (HDA) by using a sputtering method as a high corrosion resistance coating. The corrosion resistance of the Mg films was improved by controlling the morphology and the crystal structure of films by adjusting the Ar gas pressure during the coating process. Anodic polarization measurement results confirm that the corrosion resistance of the Mg films was affected by surface morphology and crystal structure. The corrosion resistance of the Mg coated HDA specimen increased with decreasing crystal size of the Mg coating and it was also improved by forming a film with denser morphology. The crystal structure oriented at Mg(101) plane showed the best corrosion resistance among crystal planes of the Mg metals, which is attributed to its relatively low surface energy. Neutral salt spray test confirmed that corrosion resistance of HDA can be greatly improved by Mg coating, which is superior to that of HDG (hot dip galvanized steel). The reason for the improvement of the corrosion resistance of Mg films on hot dip aluminized steel was due to the barrier effect by the Mg corrosion products formed by the corrosion of the Mg coating layer.

• 한국표면공학회지
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• 제51권4호
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• pp.243-248
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• 2018

All solid state thin film batteries with two types of cell structure, Pt / $LiCoO_2$ / LiPON / Cu and Pt / $LiCoO_2$ / LiPON / $LiCoO_2$ / Cu, are prepared and their electrochemical performances are investigated to evaluate the effect of $LiCoO_2$ interlayer at the interface of LiPON / Cu. The crystallinity of the deposited $LiCoO_2$ thin films is confirmed by XRD and Raman analysis. The crystalline $LiCoO_2$ cathode thin film is obtained and $LiCoO_2$ as the interlayer appears to be amorphous. The surface morphology of Cu current collector after cycling of the batteries is observed by AFM. The presence of a 10 nm-thick layer of $LiCoO_2$ at the interface of LiPON / Cu enhances the interfacial adhesion and reduces the interfacial resistance. As a result, Li plating / stripping at the interface of LiPON / Cu during charge/discharge reaction takes place more uniformly on Cu current collector, while without the interlayer of $LiCoO_2$ at the interface of LiPON / Cu, the Li plating / stripping is localized on current collector. The thin film batteries with the interlayer of $LiCoO_2$ at the interface of LiPON / Cu exhibits enhanced initial coulombic efficiency, reversible capacity and cycling stability. The thickness of the anode current collector Cu also appears to be crucial for electrochemical performances of all solid state thin film batteries.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.276-279
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• 2004

Plasma enhanced chemical vapor deposition (PECVD) of silicon nitride (SiN) is a proven technique for obtaining layers that meet the needs of surface passivation and anti-reflection coating. In addition, the deposition process appears to provoke bulk passivation as well due to diffusion of atomic hydrogen. This bulk passivation is an important advantage of PECVD deposition when compared to the conventional CVD techniques. A further advantage of PECVD is that the process takes place at a relatively low temperature of 300t, keeping the total thermal budget of the cell processing to a minimum. In this work SiN deposition was performed using a horizontal PECVD reactor system consisting of a long horizontal quartz tube that was radiantly heated. Special and long rectangular graphite plates served as both the electrodes to establish the plasma and holders of the wafers. The electrode configuration was designed to provide a uniform plasma environment for each wafer and to ensure the film uniformity. These horizontally oriented graphite electrodes were stacked parallel to one another, side by side, with alternating plates serving as power and ground electrodes for the RF power supply. The plasma was formed in the space between each pair of plates. Also this paper deals with the fabrication of multicrystalline silicon solar cells with PECVD SiN layers combined with high-throughput screen printing and RTP firing. Using this sequence we were able to obtain solar cells with an efficiency of 14% for polished multi crystalline Si wafers of size 125 m square.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.817-820
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• 2004

The $Sr_{0.7}Bi_{2.6}Ta_2O_9$(SBT) thin films are deposited on Pt-coated electrode($Pt/TiO_2/SiO_2/Si$) using a RF magnetron sputtering method. The ferroelectric properties of SBT capacitors with annealing time were studied. In the SEM images, Bi-layered perovskite phase was crystallized at 10min and grains largely grew with annealing tune. SBT thin films are transformed from initial amorphous phase to the fully formed layer-structured perovskite. During the annealing process at $750^{\circ}C$, we found that an fluorite-like stage is formed after 3min. In the XRD pattern, the SBT thin films after 3min annealing time had (105) orientation. The ferroelectric properties of SBT capacitor with annealing time represent a favorable properties at 60 min. The maximum remanent polarization and the coercive electric field with 60 min are $12.40C/cm^2$ and 30kV/cm, respectively. The leakage current density with 60min is $6.81{\times}10^{-10}A/cm^2$.