• Title/Summary/Keyword: delamination.

Search Result 996, Processing Time 0.029 seconds

Impact fracture behavior on particle volume fraction of nano silica composite materials (입자 함유율의 변화에 따른 나노 실리카 복합재료의 충격파괴거동)

  • LEE, Jung-Kyu;KOH, Sung Wi
    • Journal of the Korean Society of Fisheries and Ocean Technology
    • /
    • v.51 no.3
    • /
    • pp.454-460
    • /
    • 2015
  • The present study is undertaken to evaluate the effect of volume fraction on the results of Charpy impact test for the rubber matrix filled with nano sized silica particles composites. The Charpy impact tests are conducted in the temperature range $0^{\circ}C$ and $-10^{\circ}C$. The range of volume fraction of silica particles tested are between 11% to 25%. The critical energy release rate $G_{IC}$ of the rubber matrix composites filled with nano sized silica particles is affected by silica volume fraction and it is shown that the value of $G_{IC}$ decreases as volume fraction increases. In regions close to the initial crack tip, fracture processes such as matrix deformation, silica particle debonding and delamination, and/or pull out between particles and matrix which is ascertained by SEM photographs of Charpy impact fracture surfaces.

Impact behavior on temperature effect of nano composite materials (온도변화에 따른 나노 복합재료의 충격거동)

  • KIM, Hyung-Jin;LEE, Jung-Kyu;KOH, Sung Wi
    • Journal of the Korean Society of Fisheries and Ocean Technology
    • /
    • v.51 no.4
    • /
    • pp.561-566
    • /
    • 2015
  • In this study, the effect of temperature effect of the rubber matrix filled with nano sized silica particles composites with silica volume fraction of 19-25% was investigated by the Charpy impact test. The Charpy impact test was conducted in the temperature range from $-40^{\circ}C$ to $0^{\circ}C$. The critical energy release rate GIC of the rubber matrix composites filled with nano sized silica particles was considerably affected by temperature and it was shown that the maximum value was appeared at higher temperature between temperature tested and it was shown that the value of GIC increases as temperature tested increases. The major fracture mechanisms were matrix deformation, silica particle debonding and delamination, microcrack between particles and matrix, and/or pull out between particles and matrix which is ascertained by SEM photographs of Charpy impact surfaces fracture.

Effect of Counterpart Roughness on Abrasive Wear Characteristics of Side Plate of FRP Ship (FRP 선박 외판재의 연삭마모 특성에 관한 상대재 거칠기의 영향)

  • Kim, Hyung-Jin;Koh, Sung-Wi;Kim, Jae-Dong
    • Journal of Ocean Engineering and Technology
    • /
    • v.22 no.6
    • /
    • pp.35-40
    • /
    • 2008
  • The effect of counterpart roughness on abrasive wear characteristics of side plate materials of FRP ship, which were composed of glass fiber and unsaturated polyester resin composites, were investigated at ambient temperature by pin-an-disc friction test. The friction coefficient, wear rate and cumulative wear volume of these materials against SiC abrasive paper were determined experimentally. The wear rate of these materials decreased rapidly with sliding distance and then maintained a constant value. It was increased as counterpart roughness was rougher in a wear test. The cumulative wear volume tended to increase nonlinearly with sliding distance and depended on applied load and sliding speed for these composites. It could be verified by SEM photograph of fracture surface that major failure mechanisms were overlapping layers, microcutting, deformation of resin, delamination, and cracking.

Planarizaiton of Cu Interconnect using ECMP Process (전기화학 기계적 연마를 이용한 Cu 배선의 평탄화)

  • Jeong, Suk-Hoon;Seo, Heon-Deok;Park, Boum-Young;Park, Jae-Hong;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.20 no.3
    • /
    • pp.213-217
    • /
    • 2007
  • Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

A pre-stack migration method for damage identification in composite structures

  • Zhou, L.;Yuan, F.G.;Meng, W.J.
    • Smart Structures and Systems
    • /
    • v.3 no.4
    • /
    • pp.439-454
    • /
    • 2007
  • In this paper a damage imaging technique using pre-stack migration is developed using Lamb (guided) wave propagation in composite structures for imaging multi damages by both numerical simulations and experimental studies. In particular, the paper focuses on the experimental study using a finite number of sensors for future practical applications. A composite laminate with a surface-mounted linear piezoelectric ceramic (PZT) disk array is illustrated as an example. Two types of damages, one straight-crack damage and two simulated circular-shaped delamination damage, have been studied. First, Mindlin plate theory is used to model Lamb waves propagating in laminates. The group velocities of flexural waves in the composite laminate are also derived from dispersion relations and validated by experiments. Then the pre-stack migration technique is performed by using a two-dimensional explicit finite difference algorithm to back-propagate the scattered energy to the damages and damages are imaged together with the excitation-time imaging conditions. Stacking these images together deduces the resulting image of damages. Both simulations and experimental results show that the pre-stack migration method is a promising method for damage identification in composite structures.

Mixed-Mode Fatigue Characteristics of Composite/Metal Interfaces (복합재료/금속 계면의 혼합모드 피로 특성)

  • Baek, Sang-Ho;Kim, Won-Seock;Jang, Chang-Jae;Lee, Jung-Ju
    • Composites Research
    • /
    • v.23 no.4
    • /
    • pp.21-27
    • /
    • 2010
  • In most engineering structures, fracture often takes place due to fatigue. Therefore, many studies about the effect of the various mode-mixities on fatigue characteristics have been performed. However, most of the former studies only address metal/metal interfaces or delamination of composite. In this study, the fatigue characteristics of composite/metal interfaces are investigated. The fatigue tests were performed using single leg bending(SLB)specimens that comprise composite and steel bonded to each other using co-cure bonding method. This paper focuses on fatigue characteristics depending on different mode ratios$(G_{II}/G_T$. The overall results obtained in this study show that the crack propagation rate increases with the mode II loading component.

A Study on Mechanical Characteristics of Interface of Ceramic/Metal Composites (세라믹/금속 이종재료 계면의 기계적 특성에 관한 연구)

  • Seo, Do-Won;Kim, Hak-Kun;Song, Jun-Hee;Lim, Jae-Kyoo;Park, Chan-Gyung
    • Proceedings of the KSME Conference
    • /
    • 2000.04a
    • /
    • pp.121-126
    • /
    • 2000
  • Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

  • PDF

The Exit Hole Burr Generation of CFRP with Ultrasonic Vibration (초음파 진동에 따른 CFRP의 출구 구멍 버 생성)

  • Won, Sung-Jae;Li, Ching-Ping;Park, Ki-Moon;Ko, Tae Jo
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.16 no.1
    • /
    • pp.134-140
    • /
    • 2017
  • CFRP has many industrial applications due to its low weight and high strength properties. CFRP is a composite material composed of carbon fibers embedded in a polymer matrix; it provides excellent resistance to fatigue wear, corrosion, and breakage due to fatigue. It is increasingly demanded in aircraft, automotive, and medical industries due to its superior properties to aluminum alloys, which were once considered the most suitable for specific applications. The basic machining methods of CFRP are drilling and route milling. However, in the case of drilling, the delamination of each layer, uncut fiber, resin burning, spalling, and exit burrs are barriers to successful application. This paper investigates the occurrence of exit burrs when drilling holes with ultrasonic vibration. Depending on design parameters such as the point angle, the characteristics of hole drilling were identified and appropriate machining conditions were considered.

Reliability Evaluation Through Moisture Sorption Characterization of Electronic Packaging Materials (전자 패키징 소재의 수착 특성화를 통한 신뢰성 평가)

  • Park, Heejin
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.37 no.9
    • /
    • pp.1151-1158
    • /
    • 2013
  • Knowledge of the moisture sorption properties of a material is essential for optimal material development and analysis of the delamination failure caused by vapor pressure at the interlayer during the manufacturing process of integrated packaging devices. In this paper, both temperature dependent absorption and desorption properties according to temperature and humidity model are parameterized and the effects of water activities and temperature are discussed. The activation energy obtained from the parameterized diffusivity determines the acceleration factor for the equivalency of moisture sorption levels, which enables the effect of moisture diffusivity on the equivalent elapsed testing time required for evaluating the reliable life time to be estimated. The acceleration factor evaluated at the reliability testing standard of the flexible packaging module is exampled.

Design Optimization of Blast and Ballistic Impact Resistance Sandwich Panels Based on Kriging Approximate Models (크리깅 근사모델기반 복합충격 저항 샌드위치 패널 최적설계)

  • Jang, Sungwoo;Baik, Woon-Kyoung;Choi, Hae-Jin;Park, Soon Suk
    • Korean Journal of Computational Design and Engineering
    • /
    • v.20 no.4
    • /
    • pp.367-374
    • /
    • 2015
  • Sandwich panels consisting of various materials have widely been applied for mitigating dynamic impacts such as ballistic and blast impacts. Especially, the selection of materials for different core set-ups can directly influence its performance. In this study, we design the sandwich panels for alleviating ballistic and blast impacts by controlling the stacking sequence of core materials and their thicknesses. FEM studies are performed to simulate the dynamic behavior of sandwich panels subjected to ballistic and blast impacts. Delamination between the core layers is also considered in the FEM studies for feasible design. Based on the FEM data, kriging models are generated for approximating design space and quickly predicting the FEM outputs. Finally, design optimizations are implemented to find the optimum stacking sequence of core materials and thicknesses with given impact situations.