• Title/Summary/Keyword: delamination.

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Debonding and Crack of the R/C Beam Strengthened with CFS (CFS 보강 R/C 보의 균열 및 탈착)

  • Kim Chung Ho;Jang Hee Suc;Park Hyun Young;Ko Sin Woong
    • Proceedings of the Korea Concrete Institute Conference
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    • 2005.11a
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    • pp.173-176
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    • 2005
  • This study look into the mechanisms of growth and magnification in the cracks and delamination on the beams repaired with CFS. The experimental parameters was a loading type, loading speed and pre-crack. In the experiments, it was confirmed that the failure of beams began with development and propagation of the delamination in the below the loading point due to magnification of cracks, but it was not concerned with loading type, loading speed and pre-cracks. Particularly, in the case of beams having the pre-cracks, growth of crack concentrated at the special crack below the loading point and led to failure of the beam by delamination due to magnification of crack.

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Low Velocity Impact Characteristics of Glass/phenol Composite Laminates (Glass/phenol 복합적층판의 저속충격 특성)

  • Kim, Jae-Hoon;Kim, Hu-Shik;Park, Byoung-Joon;An, Byoung-Wook
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.228-233
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    • 2001
  • It is well known that composite laminates are easily damaged by low velocity impact. The damage of composite laminates subjected to impact loading are occurred matrix cracking, delamination, and fiber breakage. The damage of matrix cracking and delamination are reduced suddenly the compressive strength after impact. This study is to evaluate impact characteristics and the relationship between impact force and inside damage of composite laminates by low velocity impact loading. UT C-scan is used to determine impact damage areas by impact loading.

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Suppression of interfacial crack for foam core sandwich panel with crack arrester

  • Hirose, Y.;Hojo, M.;Fujiyoshi, A.;Matsubara, G.
    • Advanced Composite Materials
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    • v.16 no.1
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    • pp.11-30
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    • 2007
  • Since delamination often propagates at the interfacial layer between a surface skin and a foam core, a crack arrester is proposed for the suppression of the delamination. The arrester has a semi-cylindrical shape and is arranged in the foam core and is attached to the surface skin. Here, energy release rates and complex stress intensity factors are calculated using finite element analysis. Effects of the arrester size and its elastic moduli on the crack suppressing capability are investigated. Considerable reductions of the energy release rates at the crack tip are achieved as the crack tip approached the leading edge of the crack arrester. Thus, this new concept of a crack arrester may become a promising device to suppress crack initiation and propagation of the foam core sandwich panels.

An Analysis for Delaminations Using Energy Release Rate in CFRP Laminates (에너지 해방률을 이용한 CFRP 적층복합재료의 층간분리 평가)

  • Gang, Gi-Won;Kim, Jeong-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.8 s.179
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    • pp.2115-2122
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    • 2000
  • The understanding of impact-induced delamination is important in safety and reliability of composite structure. In this study, a model for arrest toughness is proposed in consideration of fracture behavior of composite materials. Also, the probabilistic model is proposed to describe the variability of arrest toughness due to the nonhomogeneity of material. For these models, experiments were conducted on the Carbon/Epoxy composite plates with various thickness using the impact hammer. The elastic work factor used in J-Integral is applicable to the evaluation of energy release rate. The fracture behavior can be described by crack arrest concept and the arrest toughness is independent of the delamination size. Additionally, a probabilistic characteristics of arrest toughness is well described by the Weibull distribution function. A variation of arrest toughness increases with specimen thickness.

The Damage Evaluation and Acoustic Emission Characteristics of the Unidirectional Ply CFRP Composite Materials in a Drilling Procedure (드릴작업중 발생되는 일방향 적층 CFRP 복합재료의 손상평가 및 AE특성)

  • Youn, Y.S.;Kwon, O.H.
    • Journal of Power System Engineering
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    • v.3 no.2
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    • pp.42-50
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    • 1999
  • In recent years, composite materials like CFRP are increasingly used in various fields of engineering because of their unique properties which offer a high strength/density and high modulus/density. When CFRP structures are manufactured in drilling processes which are frequently practiced in an Industry, they bring on the delaminations sometimes. So, acoustic emission(AE) techniques were used for a condition monitoring of the drilling process in CFRP. In this study, the AE from CFRP estimated the delamination which reduces the strength and load carrying capacity under the drilling process and the initial delamination were well caught and measured by a video camera. From the results, it was found the relationships between failure mechanism of CFRP delamination and AE characteristics as like amplitude and count.

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Health Monitoring of Composite Plates (복합재료 평판의 헬스 모니터링)

  • Kim Dang-Won;Chun Heoung-Jae;Yi Choong-Hee;Byun Joon-Hyung;Um Moon-Kwang
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2006.04a
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    • pp.15-20
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    • 2006
  • Real time health monitoring system was studied to detect the . generation of defects in the composite structures during service life. The PZT sensors were embedded into the woven-glass/phenol composite plate during the fabrication. VARTM (Vacuum Assisted Resin Transfer Molding) process were used to fabricate the composite plate. A Teflon tape was embedded between glass fiber layers to mimic delamination induced during service. Normalized maximum amplitude and energy analyses were used for the acquired signals. Both amplitude and energy of acquired signals were extremely sensitive to the delamination. Therefore, it was successful to detect and to locate the defects in composite plate by monitoring signals from sensors and using the proposed method.

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Coupled Thermal-Structure Analysis of UV Laser Pulsing according to the Thickness of Copper Film on the Surface of Polyimide (UV 펄스 레이저 가공의 구리 박막 두께에 따른 열-구조 연성 해석)

  • Shin, Minjae;Shin, Bosung
    • Laser Solutions
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    • v.16 no.2
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    • pp.7-11
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    • 2013
  • Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

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3D Non-linear Analysis of Interlaminar Stress around the Hole Edge of Orthotropic Laminates (직교이방성 적층판의 Hole단부의 3D 비선형 층간응력 해석)

  • SONG KWAN-HYUNG
    • Journal of Ocean Engineering and Technology
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    • v.18 no.5
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    • pp.36-42
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    • 2004
  • Orthotropic laminates, such as [$0^{\circ}6$/$90^{\circ}6$]s and [$90^{\circ}6$/$0^{\circ}6$]s, were performed, using a commercial nonlinear finite element method. Interlaminar stress distributions, around the hole curve free-edge, were calculated. The delamination bearing strengths of pin joints were predicted, using the modified delamination failure criterion. These stress distributions were presented along the radial lines and around the free-edge of the hole. Further, three-dimensional non-linear contact analysis of orthotropic laminates was conducted to investigate the effect of friction. In this paper, laminates with a circular hole were taken to study interlaminar stresses the curved edge. This study may assist in the design of a thick composite laminate with mechanically pin joints.

Characterization of Photoresist Processing by Statistical Design of Experiment (DOE)

  • Kim, Gwang-Beom;Park, Jae-Hyun;Soh, Dae-Wha;Hong, Sang-Jeen
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.43-44
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    • 2005
  • SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image is desired. But SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination. Based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factional design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

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Characterization of Negative Photoresist Processing by Statistical Design of Experiment (DOE)

  • Mun Sei-Young;Kim Gwang-Beom;Soh Dea-Wha;Hong Sang Jeen
    • Journal of information and communication convergence engineering
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    • v.3 no.4
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    • pp.191-194
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    • 2005
  • SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image are desired. However SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination, based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factorial design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.