• Composites Research
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• v.29 no.2
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• pp.45-52
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• 2016

An understanding of the failure mechanisms of the adhesive layer is decisive in interpreting the performance of a particular adhesive joint because the delamination is one of the most common failure modes of the laminated composites such as the fiber metal laminates. The interface between different materials, which is the case between the metal and the composite layers in this study, can be loaded through a combination of fracture modes. All loads can be decomposed into peel stresses, perpendicular to the interface, and two in-plane shear stresses, leading to three basic fracture mode I, II and III. To determine the load causing the delamination growth, the energy release rate should be identified in corresponding criterion involving the critical energy release rate ($G_C$) of the material. The critical energy release rate based on these three modes will be $G_{IC}$, $G_{IIC}$ and $G_{IIIC}$. In this study, to evaluate the fracture behaviors in the fracture mode I and II of the adhesive layer in fiber metal laminates, the double cantilever beam and the end-notched flexure tests were performed using the reference adhesive joints. Furthermore, it is confirmed that the experimental results of the adhesive fracture toughness can be applied by the comparison with the finite element analysis using cohesive zone model.

• Tribology and Lubricants
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• v.13 no.1
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• pp.42-52
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• 1997

This paper deals with wear characteristics of ion-nitrided metal theoretically and experimentally in order to analysis of wear phenomena. Wear tests show that compound layer of ion-nitrided metal reduces wear rate when the applied wear load is mall. However, as th load becomes large, the existence of compound layer tends to increase wear rate. The residual stress at the surface of ion-nitrided metal is measured, and the internal stress distribution is calculated when the normal and tangential forces are applied to the surface of metal. Compressive residual stress is largeest at the compound layer, and decreases as the depth from the surface increases. Calculation shows that the maximum stress exists at a certain depth from the surface when normal and tangential force are applied, and that the larger the wear load is the deeper the location of maximum stress becomes. In the analysis, it is found that under small applied wear load the critical depth, where voids and cracks may be created and propagated, is located at the compound layer, as the adhesive wear, where hardness is an important factor, is created the existence of compound layer reduces the amount of wear. When the load becomes large the critical depth is located below the compound layer, and delamination, which may be explained by surface deformation, crack nucleation and propagation, is created, and the existence of compound layer increases wear rate.

• Journal of the Korean Wood Science and Technology
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• v.39 no.5
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• pp.429-436
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• 2011

The selected physical and mechanical properties of non-certificated LVL circulated in domestic lumber market were investigated and compared to relevant standards. The tested LVL passed the moisture content and the soaking delamination rate limit as per domestic (KS) and Japanese standard (JAS). The evaluated mechanical properties were flatwise/edgewise bending strength, modulus of elasticity (MOE), horizontal shear and compressive strength. The 30 mm-thick LVL showed significantly higher bending strength than that of the 25 mm-thick LVL. The modulus of elasticity (MOE) showed same tendency in the results of bending strength. The edgewise bending strength and MOE were higher than that of flatwise bending strength and MOE. The horizontal shear strength values were also showed similar results to bending strength values. The tested results were compared each other and each products were graded according to JAS 701 grade specification. The failure mode of LVL in bending test showed the similar failure mode of solidwood that failed in a simple tension manner (splintery tension). The glue line failure was severe in 25 mm-thick specimens due to concentration of shear stress in layer discontinuity containing small voids and starved glue lines. In horizontal shear strength test, failure mode of LVL showed the typical horizontal shear failure. Compressive specimens failed with fiber crushing in company with apparent delamination that splitted along the length of the specimens. From the results, the complete bonding between lamination and consistency in thin veneer layer were considered as a critical factor in the mechanical properties of LVL. Moreover, the standard test procedure and specification for non-certificated LVL should be required to check the performance of uncertificated materials.

• Composites Research
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• v.16 no.6
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• pp.33-40
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• 2003

The initial thermal degradation of polymer matrix composite is not observed easily. At the beginning of thermal degradation of polymer matrix composites, phase transformation such as chain scission, oxidation occur, and then micro delamination is produced in matrix and interface between matrix and fiber before blistering. Initial heat damage deteriorate mechanical properties of composites. We presented the detection method of the initial heat damage of composites conveniently using ultrasonic technique. Absorption coefficient and material velocity was measured with thermal degradation and degree of cure. The more thermal degradation was progressed, the more absorption coefficient was increased. When the cure temperature is more high, the absorption coefficient of cured composite is increased and material velocity is decreased. We concluded that cure temperature is more high, the defects such as void is increased and molecular structure cured at high temperature has cross-linking structure which is more absorb the ultrasonic waves.

• Journal of the Korean institute of surface engineering
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• v.52 no.6
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• pp.298-305
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• 2019

We investigated a correlation between morphology and photoelectrochemical properties of TiO₂ nanotubes fabricated by well-controlled anodization processes. Anodization in an ethylene-glycol-based electrolyte solution accelerated the rapid grow rate of TiO₂ nanotubes, but also cause problems such as delamination at the interface between TiO₂ nanotubes and a Ti substrate, and debris on the top of the nanotube. The applied voltages for the anodization of TiO₂ were adjusted to avoid the interface delamination. The heat treatment and the anodizing time were also controlled to enhance the crystallinity of the as-prepared TiO₂ nanotubes and to increase the surface area with the varied length of the anodized TiO₂ nanotubes. Additionally, a 2-step anodization process was utilized to remove the debris on the tube top. The photoelectrochemical properties of TiO₂ nanotubes prepared with the carefully tailored conditions were investigated. By removing the debris on TiO₂ nanotubes, applied bias photon-to-current efficiency (ABPE) of TiO₂ nanotubes increased up to 0.33%.

• Advances in aircraft and spacecraft science
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• v.6 no.2
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• pp.145-156
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• 2019

As the industrial desire for a step change in productivity within the manufacture of composite structures increases, so does the interest in Through-Thickness Reinforcement technologies. As manufacturers look to increase the production rate, whilst reducing cost, Through-Thickness Reinforcement technologies represent valid methods to reinforce structural joints, as well as providing a potential alternative to mechanical fastening and bolting. The use of tufting promises to resolve the typically low delamination resistance, which is necessary when it comes to creating intersections within complex composite structures. Emerging methods include the use of 3D woven connectors, and orthogonally intersecting fibre packs, with the components secured by the selective insertion of microfasteners in the form of tufts. Intersections of this type are prevalent in aeronautical applications, as a typical connection to be found in aircraft wing structures, and their intersections with the composite skin and other structural elements. The common practice is to create back-to-back composite "L's", or to utilise a machined metallic connector, mechanically fastened to the remainder of the structure. 3D woven connectors and selective Through-Thickness Reinforcement promise to increase the ultimate load that the structure can bear, whilst reducing manufacturing complexity, increasing the load carrying capability and facilitating the automated production of parts of the composite structure. This paper provides an overview of the currently available methods for creating intersections within composite structures and compares them to alternatives involving the use of 3D woven connectors, and the application of selective Through-Thickness Reinforcement for enhanced damage tolerance. The use of tufts is investigated, and their effect on the load carrying ability of the structure is examined. The results of mechanical tests are presented for each of the methods described, and their failure characteristics examined.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.283.1-283.1
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• 2016

Tin Oxide(SnO2) has been widely investigated as a transparent conducting oxide (TCO) and can be used in optoelectronic devices such as solar cell and flat-panel displays. It would be applicable to fabricating the wide bandgap semiconductor because of its bandgap of 3.6 eV. In addition, SnO2 is commonly used as gas sensors. To fabricate high quality epitaxial SnO2 thin films, a powder sputtering method was used, in contrast to typical sputtering technique with sintered target. Single crystalline sapphire(0001) substrates were used. The samples were prepared with varying the growth parameters such as gas environment and film thickness. Then, the samples were characterized by using X-ray diffraction, scanning electron microscopy, and atomic force microscopy measurements. We found that the strain evolution of the samples was highly affected by gas environment and growth rate, resulted in the delamination under O2 environment.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.88-95
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• 2002

Fretting of fuel rod cladding material, Zircaloy-4 Tube, in PWR nuclear power plants must be reduced and avoided. Nowadays the introduction of surface treatments or coatings is expected to bean ideal solution to fretting damage since fretting is closely related to wear, corrosion and fatigue. Therefore, in this study the fretting wear experiment was peformed using TiAIN coated Zircaloy-4 tube as the fuel rod cladding and uncoated Zircaioy-4 tube as one of grids, especially concentrating on the sliding component. Fretting wear resistance of TiAIN coated Zircaloy-4 tubes was improved compared with that of TiN coated tubes and uncoated tubes and the fretting wear mechanisms were delamination and plastic flow following by brittle fracture at lower slip amplitude but severe oxidation and spallation of oxidative layer at higher slip amplitude.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.347-355
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• 2016

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.