• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.861-864
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• 1997

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.23-27
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• 1995

In sawing operation of synthetic jewelry, the performance of diamond cutter blade is very dependent on the blade variables. This investigation presents ecperimental results which show the effects of the blade variables such as types of diamond abrasives, grain size of diamond, concentration, and bond materials on the beavior of te blades. Based on the experimental results an optimum blade condition for the sawing of cubic zirconia was recommended.

• Journal of Biosystems Engineering
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• v.28 no.5
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• pp.421-428
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• 2003

This study was conducted to determine the optimum blade shape for peeling Altari radish. To figure out the required peeling force according to various angles of blade and rakes of peeling cutter, two peeling tests such as circumferential peeling and longitudinal peeling of Altari radish were carried out. Based on the pretest results, which performed to investigate the applicability of the optimum shape of cutter and to find out the cutting pattern according to the lapse of days after harvesting the radish, the peeling depth and width of the blade were fixed at 2 mm and 10 mm. From two methods of circumferential and longitudinal peeling test, the angles of rake and blade as cutter shape factors were affected on peeling force. But the peeling speed was not affected on it under the safety speed as 0.2 m/s, without blade vibrating on peeling operation. The rake angle was more effective factor than the blade angle, and the optimum angles of blade and rake were 10$^{\circ}$ and 55$^{\circ}$ respectively. The cutting surface by the longitudinal peeling was more smooth than that by the circumferential peeling. There was no problem in peeling work during 4 days after harvest because the freshness of the Altari radish was maintained.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.158-163
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• 1998

In this paper, the cutting characteristics and cutting mechanism of polystyrene foam was experimentally investigated. It was found that polystyrene foam has different cutting characteristics and cutting mechanism comparing with that of normal metal materials. By using the experimental results, the optimal cutting tool was designed and examined for approving the cuttingability of polystyrene foam.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.72-79
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• 2021

A circular saw is an effective tool for cutting glass and carbon-fiber hybrid composites. This study investigated tool wear and cut quality when reusing saw blades. The carbide saws wear four times faster than the new ones, and polycrystalline diamond (PCD) is very resistant to tool wear, except at the end of its lifespan. The cut cross-section quality is affected by the blade type, tool wear, and spindle speed. Alternate top bevel (ATB)-type blades are suitable for cutting fiber-reinforced plastics, but triple-chip grind (TCG)-type blades are unsuitable because they cause fiber-pullout defects. Tool wear and low spindle speeds increase the occurrence of arc scratches, due to the rear saw blade. A microscopic examination showed that the burr, which is a mixture of fiber chips and epoxy matrix, was bonded on top, and glass-fiber delamination occurred on the bottom glass-fiber-reinforced polymer (GFRP) surface.

• Journal of Biosystems Engineering
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• v.42 no.2
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• pp.80-85
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• 2017

Purpose: In this study, we attempted to analyze, by using a high-speed camera, the cutting shape as a function of cutting speed and feed rate. We compared the differences in cutting shape between domestic and foreign combines. Methods: Experiments were performed using plastic straws, and the results of two combine cutting blades, one from the Daedong Industry and one from Kuboda, were compared. The quality and performances of cutting were measured at three cutting positions: center and 68 cm to the left and right of the center. The feed rates were 0.6 m/s, 1.1 m/s, 1.6 m/s, and the cutting speeds were 600 RPM, 990 RPM, 1,380 RPM. For each speed, the cutting shape was measured three times, and the entire procedure was also repeated three times. Results: In the experiments, the domestic cutting blade achieved better results than the Japanese cutting blade. These results were obtained by studying the combination of feed rate and cutting speed, with the domestic combine attaining approximately 80% performance of the Japanese combine. We believe that additional data analysis is required, obtained from field experiments. Conclusions: The domestic cutting knives achieved better results than the Japanese cutting knives. These results are estimated from experiments conducted with different feed rates and cutting speeds; an in-depth analysis will require experiments in the real field with actual combines and a combination of multiple variables. Repeating the investigation on the length differences, broken and cut angle with various combinations of feed rate and cutting speed, will surely help to find the optimal cutting speed.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.222-222
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.11
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• pp.1917-1924
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• 2003

This paper proposes a roughing path generation method fer machining impeller with 5-axis machining center. Traditional researches are focus on finishing for machining impeller. To achieve efficient machining, roughing method must be studied. The proposed method consists two steps : One is to select optimal tool size and tool attitude by dividing cutting area into two regions to reduce cutting time. The regions are automatically divided by character point on the geometry of impeller blade. After dividing, the tool of the optimal size is selected for each divided region. The other is avoidance of tool interference. Tool interference in cutting areas is avoided by checking the distance between tool axis vector and ruling line on blade surface or approximated plan between ruling line. Using this method, the cutting time is reduced efficiently.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.5
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• pp.70-75
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• 2000

After the patterning and probe process of wafer have been achieved, the dicing process is necessary to separate chips from a wafer. The dicing process cuts a wafer to lengthwise and crosswise direction to make many chips by using narrow circular rotating diamond blade. But inferior goods are made under the influence of complex dicing environment such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using feature extraction in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, two features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision. a threshold method is adopted to classify the dicing process into normal and abnormal dicing. Experiment have been performed for GaAs semiconductor wafer. Based upon observation of the experimental results, the proposed scheme shown a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 12.8%.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.