• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• 한국해양공학회지
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• 제23권4호
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• 폴리머
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• 제26권6호
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• pp.728-736
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• 2002

The thermal and dielectric properties of unsaturated polyester resin system during cure were analyzed under Isothermal conditions. Both $varepsilon$′ and $varepsilon$" decreased and dipole relaxation was observed under isothermal conditions during cure. The ionic conductivity decreased linearly with the conversion according to the Kienle-Rate equation (ln($varepsilon$"$_{ionic}$we$_{0}$)=C$_{r}$$alpha$+C$_{0}$) up to $alpha$=0.15, after which it aparted from the relationship due to the entanglement of polymer chains. The effect of ionic conductivity was revealed to be larger than that of dipole motion during the whole cure through the electrical modulus analysis. Although dielectric motion was analyzed with Debye model, it was observed only at a narrow time region of middle stage of cure. In order to estimate the dielectric properties during the whole cure, the Havriliak-Negami model was considered and modified with the strong effect of ionic conductivity. The changes of $varepsilon$′ and $varepsilon$" were well estimated with this modified Havriliak-Negami model.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1570-1572
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• 1997

Characteristics of thermal degradation on cure conditions of DGEBA/MDA/GN system were investigated. Epoxy resin system was degradated in one stage. The activation energy of DGEBA/MDA/GN system had the lowest value in the cure time of 1.0 hr at $80^{\circ}C$ before at $150^{\circ}C$ for 1.0 hr and it increased with the pre-cure time at $80^{\circ}C$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.714-719
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• 2004

Controlling the cure depth of the Fa1260T photopolymer enhances the quality of a microstructure and minimizes its size in microstereolithography. In this work, variation of cure depth of the Fa1260T photopolymer is investigated while the concentration of a photopolymerization inhibitor as a radical quencher was varied. The energy source inducing photopolymerization was a He-Cd laser and a motorized stage controled the laser beam path accurately. The effects of process variables such as laser beam power and scan speed on the cure depth were examined. Optimum conditions for the minimum cure depth were determined as laser power of 230 W and scan speed of 40-50 m/s at the concentration of the radical quencher of 5％. The minimum cure depth at the optimal condition was 14 m. The feasibility of the fabrication of microstructures such as a microcup, microfunnel, and microgrid of 100 m size is demonstrated using Super IH process.

• Design & Manufacturing
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• 제17권1호
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.200-204
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• 2008

비대칭성 고리형 지방족 아민 경화제를 이용한 diglycidyl ether of bisphenol F(DGEBF) 계열의 에폭시의 경화 반응을 등온 및 동적 경화 실험을 통하여 분석하였다. 등온 부분경화 실험 및 동적 경화반응을 통하여 아민 경화제의 비대칭성으로 인해 경화 반응이 저온부 및 고온부분의 두 가지 반응으로 구성되어 있다는 것을 확인하였고, 따라서 경화도가 0.6 이상인 영역에서는 등온경화반응 모델식을 이용하여 실험값을 예측하기는 어렵다는 것을 확인하였다. 승온 속도를 여러 가지로 변화시키며 동적 경화반응을 분석하여 저온부 및 고온부 각각의 반응에 대한 활성화에너지 및 속도상수를 알아보았고, 경화 초기에는 저온부의 반응이 주가 되는 것을 확인하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 춘계학술발표대회 논문집
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• pp.214-217
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• 2004

The cure kinetics of blends of epoxy(tetraglycidyl-4,4'-diaminodiphenylmethane ; TGDDM)/curing agent(diaminodiphenyl sulfone ; DDS) resin with amine terminated polyetherimide-CTBN-amine terminated polyetherimide triblock copolymer(ABA) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of ABA in the blends, the final cure conversion was decreased. Lower values of the final cure conversions in the epoxy/ABA blends indicated that ABA hinders the cure reaction between the epoxy and curing agents. 1be value of the reaction order, m, for the initial autocatlytic reaction was not affected by blending ABA with epoxy resin, and the value was approximately 1.0. The value of n for the nth order component in the autocatalytic analysis was increased by increasing the amount of ABA in the blends, and the value increased from 2.0-3.4. A diffusion controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/DDS/ABA blends.

• 폴리머
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• 제35권3호
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• pp.196-202
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• 2011

비즈페놀 A 에폭시 수지와 폴리옥시프로필렌 디아민 경화제계의 경화 반응속도를 시차주사열량계을 이용하여 승온 및 등온 경화조건에서 조사하였다. 승온실험에서는 Ozawa와 Kissinger법을 이용하여 다양한 가열속도에서 얻어진 발열피크의 이동으로부터 활성화 에너지를 구하였다. 또한 등온실험에서 얻어진 데이터는 자촉매 효과를 고려한 Kamal의 속도모델로 분석하였으며, 그 결과 경화반응 초기의 속도우세 구간에서 실험데이터와 잘 맞았다. 반응 후기의 확산우세 구간에서는 확산효과를 적용하여 경화의 전체과정을 기술하였다. 또한 동역학분석을 이용하여 경화 후 저장 탄성률과 가교점간의 평균분자량을 측정하였다.

• 접착 및 계면
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• 제21권1호
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• pp.6-13
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• 2020

The objective of the current study is to characterize the long-term stability and efficacy of a structural adhesive assembly under static load. An apparatus was designed to be used in the Instron tensile test machine that would allow for real time modeling of the failure characteristics of an assembly utilizing a moisture- cure adhesive which was bonded to concrete. A regression model was developed that followed a linear - natural log function which was used to predict the expected life of the assembly. Evaluations at different curing times confirmed the structure was more robust with longer cure durations prior to loading. Finally, the results show that under the conditions the assembly was tested, there was only a small amount of inelastic creep and the regression models demonstrated the potential for a stable structure lasting several decades.